Patents by Inventor Il Ho YANG

Il Ho YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9493677
    Abstract: Provided are a polishing composition for chemical mechanical polishing, a method of preparing the polishing composition, and a chemical mechanical polishing method using the polishing composition. The polishing composition which is a water-based polishing composition for planarizing a metal compound thin film including two or more metal elements includes nano-diamond particles as a polishing material and poly(sodium 4-styrenesulfonate) as a dispersion stabilizer for the nano-diamond particles in the polishing composition. Since the nano-diamond particles in the polishing composition have hydrophobic surfaces and poly(sodium 4-styrenesulfonate) effectively stabilizes the nano-diamond particles to prevent the nano-diamond particles from aggregating, excellent polishing characteristics for the metal compound thin film may be obtained due to the nano-diamond particles which have a nano size, high hardness, and excellent dispersibility.
    Type: Grant
    Filed: June 21, 2013
    Date of Patent: November 15, 2016
    Assignees: SK HYNIX INC., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Dae Soon Lim, Il Ho Yang, Seung Koo Lee, Dong Hee Shin, Dong Hyeon Lee, Yang Bok Lee
  • Patent number: 9068110
    Abstract: A polishing slurry for a chemical mechanical planarization process includes polishing particles and polyhedral nanoscale particles having a smaller size than the polishing particles and including a bond of silicon (Si) and oxygen (O).
    Type: Grant
    Filed: January 8, 2013
    Date of Patent: June 30, 2015
    Assignees: SK HYNIX INC., KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
    Inventors: Dae Soon Lim, Dong Hee Shin, Dong Hyeon Lee, Il Ho Yang, Yang Bok Lee
  • Publication number: 20130344777
    Abstract: Provided are a polishing composition for chemical mechanical polishing, a method of preparing the polishing composition, and a chemical mechanical polishing method using the polishing composition. The polishing composition which is a water-based polishing composition for planarizing a metal compound thin film including two or more metal elements includes nano-diamond particles as a polishing material and poly(sodium 4-styrenesulfonate) as a dispersion stabilizer for the nano-diamond particles in the polishing composition. Since the nano-diamond particles in the polishing composition have hydrophobic surfaces and poly(sodium 4-styrenesulfonate) effectively stabilizes the nano-diamond particles to prevent the nano-diamond particles from aggregating, excellent polishing characteristics for the metal compound thin film may be obtained due to the nano-diamond particles which have a nano size, high hardness, and excellent dispersibility.
    Type: Application
    Filed: June 21, 2013
    Publication date: December 26, 2013
    Inventors: Dae Soon LIM, Il Ho YANG, Seung Koo LEE, Dong Hee SHIN, Dong Hyeon LEE, Yang Bok LEE