Abstract: A sealing member includes a body having a ring shape, a lower contacting portion protruding from a lower end of the body and having at least one recess, the recess provided in a lower surface of the lower contacting portion and extending in a radial direction of the body, and an outer contacting portion protruding outwards from the body along an outer side portion of the body.

Abstract: An organic light-emitting display device is disclosed. The organic light-emitting display device may include a substrate, an organic light-emitting portion provided on the substrate, a first inorganic film that seals and covers the organic light-emitting portion, and a second inorganic film provided on the first inorganic film and including a low temperature viscosity transition (LVT) inorganic material. A coefficient of thermal expansion (CTE) of the first inorganic film may be smaller than a CTE of the second inorganic film.

Abstract: A method of manufacturing a sputtering target includes: preparing a sputtering target material including a low temperature viscosity transition (LVT) inorganic material, melting the sputtering target material at a working pressure that is lower than atmospheric pressure, and processing the melted sputtering target material to thereby form the sputtering target.

Abstract: A method for manufacturing an organic light-emitting display apparatus including: forming an organic light-emitting device on a substrate, the organic light-emitting device including a first electrode, a second electrode, and an intermediate layer including at least an organic emission layer; and forming a thin film encapsulating layer on the organic light-emitting device, wherein the thin film encapsulating layer includes at least one inorganic film including a low temperature viscosity transition (LVT) inorganic material and an oxide, and the oxide includes zirconium-tungsten oxide or lithium-aluminum-silicon oxide.

Abstract: A method of fabricating a sputtering target is provided. The method includes preparing a first powder material, wherein the first powder material includes tin oxide; preparing a mixture by mixing the first powder material and a second powder material, wherein the second powder material includes carbon; and fabricating the sputtering target by compressing and sintering the mixture simultaneously in a reducing atmosphere.

Abstract: An organic light emitting display apparatus includes a substrate and includes an organic light emitting device that overlaps the substrate and includes an organic layer. The organic light emitting display apparatus further includes a planarization layer that overlaps the organic light emitting device and includes an organic material, wherein the organic light emitting device is disposed between the substrate and the planarization layer. The organic light emitting display apparatus further includes an encapsulation layer that overlaps the planarization layer and includes an inorganic material, wherein the planarization layer is disposed between the organic light emitting device and a portion of the encapsulation layer. The organic light emitting display apparatus further includes an intermediate layer that is disposed between the planarization layer and the portion of the encapsulation layer.

Abstract: A method of fabricating a sputtering target includes preparing a first powder material including at least one of a tin oxide and a mesh-forming oxide; mixing the first powder material and a second powder material comprising carbon or a tin oxide to prepare a mixture; simultaneously performing a primary compression and primary sintering on the mixture in a reduction atmosphere; and simultaneously performing a secondary compression and secondary sintering on the mixture in the reduction atmosphere to prepare the sputtering target.

Abstract: An organic light-emitting display device is disclosed. The organic light-emitting display device may include a substrate, an organic light-emitting portion provided on the substrate, a first inorganic film that seals and covers the organic light-emitting portion, and a second inorganic film provided on the first inorganic film and including a low temperature viscosity transition (LVT) inorganic material. A coefficient of thermal expansion (CTE) of the first inorganic film may be smaller than a CTE of the second inorganic film.

Abstract: A sputtering apparatus including: a first target and a second target disposed to face each other; a magnetic field generating unit that is disposed on each rear surface of the first and second targets to generate a magnetic field; and a structure that is disposed between the first target and the second target and is formed of a doping material.

Abstract: An organic light emitting display includes a substrate; an organic light emitting diode on one surface of the substrate; an encapsulation substrate located opposite and substantially parallel to the substrate with the organic light emitting diode therebetween; a filler layer on one surface of the encapsulation substrate facing the substrate; a first encapsulation layer located between the encapsulation substrate and the substrate and sealing the substrate and the encapsulation substrate together; and a second encapsulation layer located adjacent to the first encapsulation layer and between the encapsulation substrate and the substrate, wherein the filler layer and the second encapsulation layer include a moisture absorbent.

Abstract: An organic light emitting display includes a substrate; an organic light emitting diode on one surface of the substrate; an encapsulation substrate located opposite and substantially parallel to the substrate with the organic light emitting diode therebetween; a filler layer on one surface of the encapsulation substrate facing the substrate; a first encapsulation layer located between the encapsulation substrate and the substrate and sealing the substrate and the encapsulation substrate together; and a second encapsulation layer located adjacent to the first encapsulation layer and between the encapsulation substrate and the substrate, wherein the filler layer and the second encapsulation layer include a moisture absorbent.

Abstract: Wafer cleaning apparatus include a cleaning tub configured to receive a wafer to be cleaned. A wafer cleaning unit coupled to the cleaning tub is configured to provide wafer cleaning solution to the wafer. A probe is positioned in the cleaning tub proximate the wafer. The probe is configured to provide megasonic vibrational energy to a surface of the wafer and/or the wafer cleaning solution to separate contaminants from the surface of the wafer. A probe cleaning unit is configured to provide a probe cleaning solution to the probe to clean the probe. Methods of using the wafer cleaning apparatus are also provided.

Abstract: Wafer cleaning apparatus include a cleaning tub configured to receive a wafer to be cleaned. A wafer cleaning unit coupled to the cleaning tub is configured to provide wafer cleaning solution to the wafer. A probe is positioned in the cleaning tub proximate the wafer. The probe is configured to provide megasonic vibrational energy to a surface of the wafer and/or the wafer cleaning solution to separate contaminants from the surface of the wafer. A probe cleaning unit is configured to provide a probe cleaning solution to the probe to clean the probe. Methods of using the wafer cleaning apparatus are also provided.