Abstract: A touch detection module, includes: a plurality of driving electrodes arranged side by side; a plurality of sensing electrodes staggered with respect to the driving electrodes; and a touch driving circuit configured to supply touch driving signals to the plurality of driving electrodes and to detect touch detection signals through the plurality of sensing electrodes to identify touch position coordinates, wherein the touch driving circuit is configured: to vary frequency modulation parameter set values in response to a change in a frequency of reference clocks, and to generate and supply a frequency of the touch driving signals by using the reference clocks and a varied frequency modulation parameter set value.

Abstract: A wireless communication method and apparatus in a wireless local area network (WLAN) system are disclosed. A wireless communication method according to one embodiment may include generating a high-efficiency Wi-Fi (HEW) frame including at least one of an HEW-SIG-A field and an HEW-SIG-B field which include channel information for communications according to an Orthogonal Frequency-Division Multiple Access (OFDMA) mode, and transmitting the generated HEW frame to a reception apparatus.

Abstract: Provided are a method and apparatus for providing a network switching service to a user equipment.

Abstract: Provided are a method and apparatus for a user equipment, a core network, and a second device to enable bidirectional communication for second devices. The method of the second device may include receiving internet protocol (IP) configuration information for automatically configuring an IP version 6 (IPv6) address of the second device from a core network through a user equipment; generating the IPv6 address using information in the IP configuration information; and transmitting the generated IPv6 address to the core network through the UE.

Abstract: A window substrate integrated with a polarizing plate and a method of preparing the same is provided. A window substrate integrated with a polarizing plate comprises a base substrate, a non-display pattern disposed on a non-display part of one surface of the base substrate, and a liquid crystal polarizing layer disposed on a display part of the same surface as the non-display pattern. A display device having a reduced thickness and a colored non-display pattern is achieved using the widow substrate.

Abstract: There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.

Abstract: A light-emitting element mounting substrate is provided.

Abstract: A method for manufacturing a semiconductor light emitting device package includes forming a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a growth substrate, forming a reflective layer on a first surface of the light emitting structure corresponding to a surface of the second conductivity-type semiconductor layer, forming bumps on the first surface, the bumps being electrically connected to the first or second conductivity-type semiconductor layer and protruding from the reflective layer, bonding a support substrate to the bumps on the first surface, removing the growth substrate, bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed, and removing the support substrate.

Abstract: A window substrate integrated with a polarizing plate and a method of preparing the same is provided. A window substrate integrated with a polarizing plate comprises a base substrate, a non-display pattern disposed on a non-display part of one surface of the base substrate, and a liquid crystal polarizing layer disposed on a display part of the same surface as the non-display pattern. A display device having a reduced thickness and a colored non-display pattern is achieved using the widow substrate.

Abstract: A light-emitting element mounting substrate is provided.

Abstract: Provided is a bonding wire for a semiconductor package and a semiconductor package including the same. The bonding wire for the semiconductor package may include a core portion including silver (Ag), and a shell layer surrounding the core portion, having a thickness of 2 nm to 23 nm, and including gold (Au). The semiconductor package may include a package body having a first electrode structure and a second electrode structure, a semiconductor light emitting device comprising a first electrode portion and a second electrode portion electrically connected to the first electrode structure and the second electrode structure, and a bonding wire connecting at least one of the first electrode structure and the second electrode structure to the semiconductor light emitting device.

Abstract: A method for manufacturing a semiconductor light emitting device package includes forming a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a growth substrate, forming a reflective layer on a first surface of the light emitting structure corresponding to a surface of the second conductivity-type semiconductor layer, forming bumps on the first surface, the bumps being electrically connected to the first or second conductivity-type semiconductor layer and protruding from the reflective layer, bonding a support substrate to the bumps on the first surface, removing the growth substrate, bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed, and removing the support substrate.

Abstract: There are provided a phosphor film, a method of manufacturing the same, and a method of coating an LED chip with a phosphor layer. The phosphor film includes: a base film; a phosphor layer formed on the base film and obtained by mixing phosphor particles in a partially cured resin material; and a cover film formed on the phosphor layer to protect the phosphor layer.

Abstract: Provided is a bonding wire for a semiconductor package and a semiconductor package including the same. The bonding wire for the semiconductor package may include a core portion including silver (Ag), and a shell layer surrounding the core portion, having a thickness of 2 nm to 23 nm, and including gold (Au). The semiconductor package may include a package body having a first electrode structure and a second electrode structure, a semiconductor light emitting device comprising a first electrode portion and a second electrode portion electrically connected to the first electrode structure and the second electrode structure, and a bonding wire connecting at least one of the first electrode structure and the second electrode structure to the semiconductor light emitting device.

Abstract: A data sharing system includes at least one first client device, at least one second client device, and a hub equipment. The at least one first client device provides data. The at least one second client device receives data. The hub equipment receives data from the first client device using a first transmission protocol, and transmits the received data to the second client device using a second transmission protocol.

Abstract: There is provided a light emitting element package including: a light emitting laminate having a structure in which semiconductor layers are laminated and having a first main surface and a second main surface opposing the first main surface; a terminal unit disposed on an electrode disposed on the second main surface; a molded unit disposed on the second main surface of the light emitting laminate and allowing a portion of the terminal unit to be exposed; and a wavelength conversion unit disposed on the first main surface of the light emitting laminate.

Abstract: An integrated remote control system controls a plurality of peripheral electronic devices by a certain integrated operation to provide use convenience of the electronic devices. The integrated remote control system includes an integrated control device configured to store control codes of the peripheral electronic devices and provide the at least one control code of the peripheral electronic devices according to a request. The integrated remote control system also includes a user remote control device configured to request the integrated control device to transmit the control code for controlling the peripheral electronic device, receive the requested control code, and control the at least one of the peripheral electronic devices.

Abstract: A content reproducing method is provided for continuously reproducing content being reproduced by a client device in another client device in a multimedia data providing system including a server for providing content and a plurality of client devices for reproducing the content provided by the server. The method includes reproducing, by a first device, multimedia content being streamed by a content server; and transmitting, by the first device, a first request message for continuously reproducing content being reproduced by the first device in another device and an IDentification (ID) of the first device to another device using local area communication in order to continuously reproduce the content being reproduced by the first device in another device.

Abstract: A light emitting diode (LED) package includes: a package substrate having a first electrode structure and a second electrode structure; an LED chip disposed above a first surface of the package substrate and having a first electrode attached to the first electrode structure and a second electrode attached to the second electrode structure; a reflective layer disposed above the first surface of the package substrate to be separated from the LED chip, having a thickness less than a thickness of the LED chip, and configured to reflect light emitted from the LED chip to a given direction, wherein the wavelength converter has an upper surface substantially parallel to the first surface of the package substrate and a side surface inclined towards the upper surface of the wavelength converter.

Abstract: A method for manufacturing a semiconductor light emitting device package includes forming a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a growth substrate, forming a reflective layer on a first surface of the light emitting structure corresponding to a surface of the second conductivity-type semiconductor layer, forming bumps on the first surface, the bumps being electrically connected to the first or second conductivity-type semiconductor layer and protruding from the reflective layer, bonding a support substrate to the bumps on the first surface, removing the growth substrate, bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed, and removing the support substrate.