Abstract: Disclosed herein is an electric compressor. The electric compressor includes an inverter cover which is mounted to an outer surface of a compressor housing in which compression of refrigerant is implemented, and a printed circuit board which is disposed inside the inverter cover and mounted with a plurality of heat generating elements that come into surface contact with one surface of the compressor housing and perform heat transfer with low-temperature refrigerant supplied into the compressor housing.

Abstract: Disclosed is an apparatus for processing substrate which prevents a plasma discharge from being transferred to a substrate so as to minimize damages on the substrate and also minimize deterioration in quality of a thin film deposited on the substrate, wherein the apparatus may include a process chamber for providing a reaction space, and a gas distribution module for dissociating processing gas by the use of plasma, and distributing the dissociated processing gas onto a substrate, wherein the gas distribution module may include a lower frame having a plurality of electrode inserting portions, an upper frame having a plurality of protruding electrodes and processing gas distribution holes, and an insulating plate having a plurality of electrode penetrating portions.

Abstract: Disclosed herein is a scroll compressor in which refrigerant is compressed in a compression chamber while the volume of the compression chamber is gradually decreased due to relative rotation of a fixed scroll and an orbiting scroll. In accordance with the disclosure, the scroll compressor is provided in which a pressure in a back-pressure chamber is managed in connection with a discharge refrigerant pressure so that the orbiting scroll is supported by the pressure in the back-pressure chamber without a power loss or an inner leak in an overall pressure section of a scroll.

Abstract: Provided is a semiconductor fabrication technology; and, more particularly, to a semiconductor device having a heat release structure that uses a silicon-on-insulator (SOI) substrate, and a method for fabricating the semiconductor device. The device and method of the present research provides a semiconductor device having a high heat-release structure and high heat-release structure, and a fabrication method thereof. In the research, the heat and high-frequency noises that are generated in the integrated circuit are released outside of the substrate through the tunneling region quickly by forming an integrated circuit on a silicon-on-insulator (SOI) substrate, and removing a buried insulation layer under the integrated circuit to form a tunneling region. The heat-release efficiency can be enhanced much more, when unevenness is formed on the surfaces of the upper and lower parts of the tunneling region, or when the air or other gases having excellent heat conductivity is flown into the tunneling region.

Abstract: A nail file, provided with a plastic mirror for allowing a user to look into the mirror as desired, in addition to using the file for trimming, smoothing or shaping the fingernails, is disclosed. The nail file of this invention includes a board consisting of a soft resin sheet and a resin foam sheet laminated together into an integrated single board. A plastic mirror, coated with a reflective coat layer, is attached to the first surface of the single board, while a nail filing sheet is attached to the second surface of the single board. The board of the nail file may have a longitudinal shape rounded at each end thereof, or have a variety of shapes, such as a star shape, a heart shape or a flower shape.