Patents by Inventor Ilchan Lee

Ilchan Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11971744
    Abstract: An example computing device includes a hinge, a first housing, a first display device disposed in the first housing, second housing rotatably coupled to the first housing via the hinge, a second display device disposed in the second housing, and a connector coupled to the hinge and the second display device. As an example, in response to a rotation of the first housing relative to the second housing, a first end of the second display device is to slide along a surface of the second housing and a second end of the second display device is to slide along a surface of the first housing.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: April 30, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Dong Ryul Cha, Mark Senatori, Ilchan Lee
  • Patent number: 11579655
    Abstract: In example implementations, an electronic device housing is provided. The electronic device housing includes a display housing, a lifting mechanism, abase housing, and a secondary display. The lifting mechanism is coupled to a side of the display housing. The base housing is coupled to the display housing. The secondary display is coupled to a distal side of the base housing. The lifting mechanism is to lift the secondary display on a rotation of the display housing.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: February 14, 2023
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Marcus Townsend, Ilchan Lee, Jin Sang Hwang
  • Publication number: 20230034118
    Abstract: An example electronic device includes a first housing having a first cover and a second cover, where the first cover is made from fibre composite material, where the second cover is made from metal, and where the first cover is bonded to the second cover via adhesive. The electronic device also includes a display device disposed in the first housing.
    Type: Application
    Filed: February 4, 2020
    Publication date: February 2, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Stacy L. Wolff, Eric Wright Chen, Ilchan Lee, Chad Patrick Paris, Woojin Chung
  • Publication number: 20220397933
    Abstract: An example computing device includes a hinge, a first housing, and a second housing rotatably connected to the first housing via the hinge. As an example, a first display device is disposed in the first housing. The second housing includes a cover disposed along a bottom surface of the second housing, wherein the cover includes a first portion and a second portion separable from the first portion of the cover. As an example, the second portion of the cover includes an L-shaped mechanism coupled to the first portion of the cover at a first end of the L-shaped mechanism and to the first housing at a second end of the L-shaped mechanism.
    Type: Application
    Filed: August 29, 2019
    Publication date: December 15, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Dong Ryul Cha, Mark Senatori, Ilchan Lee
  • Publication number: 20220373128
    Abstract: An example stand for an electronic device includes a base, a column extending upward from the base, a camera coupled to the column, and an interface supported on the column that is to engage with the electronic device to suspend the electronic device on the column.
    Type: Application
    Filed: May 24, 2021
    Publication date: November 24, 2022
    Inventors: Ilchan LEE, Jin Cherl KWON, Hyunmin MOON
  • Publication number: 20220374043
    Abstract: An example stand for an electronic device, includes a base, a column extending upward from the base, and an interface coupled to the column to engage with the electronic device to suspend the electronic device from the column. In addition, the stand includes a ringed light array coupled to the column that includes an outer diameter that is larger than the larger of a width and a length of the interface.
    Type: Application
    Filed: May 24, 2021
    Publication date: November 24, 2022
    Inventors: Ilchan LEE, Jin Cherl KWON, Jaekyu JUNG
  • Patent number: 11500419
    Abstract: An example stand for an electronic device, includes a base, a column extending upward from the base, and an interface coupled to the column to engage with the electronic device to suspend the electronic device from the column. In addition, the stand includes a ringed light array coupled to the column that includes an outer diameter that is larger than the larger of a width and a length of the interface.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: November 15, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ilchan Lee, Jin Cherl Kwon, Jaekyu Jung
  • Patent number: 11493960
    Abstract: An example electronic device cover includes a body component to attach to an electronic device. The body component articulates among a first, second, and third configuration. The body component includes a first section to attach to the electronic device. A second section attaches to the first section, bends with respect to the first section, and provides structural support to the electronic device in the second configuration. A third section attaches to the second section, and bends with respect to the second section. A fourth section attaches to the third section and includes a rotatable data port. An input device attaches to the fourth section and is operatively connected to the data port. The input device is to be held against and face the electronic device in the third configuration. The body component constrains the electronic device within a perimeter boundary of the fourth section in the first and third configurations.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 8, 2022
    Assignee: Hewlett-Packard Development Company, L. P.
    Inventors: Philip Moon, Ilchan Lee, Stacy L. Wolff
  • Publication number: 20220229467
    Abstract: An example computing device includes a hinge, a first housing, a first display device disposed in the first housing, second housing rotatably coupled to the first housing via the hinge, a second display device disposed in the second housing, and a connector coupled to the hinge and the second display device. As an example, in response to a rotation of the first housing relative to the second housing, a first end of the second display device is to slide along a surface of the second housing and a second end of the second display device is to slide along a surface of the first housing.
    Type: Application
    Filed: September 27, 2019
    Publication date: July 21, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Dong Ryul Cha, Mark Senatori, Ilchan Lee
  • Patent number: 10852850
    Abstract: An example stylus pen including a body includes a central axis, a first end, and a second end. In addition, the stylus pen includes an engagement tip disposed at the first end and including resilient cover. Further, the stylus pen includes an adjustment mechanism at least partially disposed within the body and arranged such that manipulation of the adjustment mechanism by a user causes the cover of the engagement tip to actuate between a first shape and a second shape. The cover of the engagement tip is arranged to engage with a touch sensitive surface to cause a change in a computing device when in either one of the first shape and the second shape.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: December 1, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Ki Bok Song, Ilchan Lee, Dong Ryul Cha
  • Publication number: 20200333841
    Abstract: An example electronic device cover includes a body component to attach to an electronic device. The body component articulates among a first, second, and third configuration. The body component includes a first section to attach to the electronic device. A second section attaches to the first section, bends with respect to the first section, and provides structural support to the electronic device in the second configuration. A third section attaches to the second section, and bends with respect to the second section. A fourth section attaches to the third section and includes a rotatable data port. An input device attaches to the fourth section and is operatively connected to the data port. The input device is to be held against and face the electronic device in the third configuration. The body component constrains the electronic device within a perimeter boundary of the fourth section in the first and third configurations.
    Type: Application
    Filed: January 5, 2018
    Publication date: October 22, 2020
    Inventors: Philip Moon, Ilchan Lee, Stacy L. Wolff
  • Publication number: 20190196611
    Abstract: An example stylus pen including a body includes a central axis, a first end, and a second end. In addition, the stylus pen includes an engagement tip disposed at the first end and including resilient cover. Further, the stylus pen includes an adjustment mechanism at least partially disposed within the body and arranged such that manipulation of the adjustment mechanism by a user causes the cover of the engagement tip to actuate between a first shape and a second shape. The cover of the engagement tip is arranged to engage with a touch sensitive surface to cause a change in a computing device when in either one of the first shape and the second shape.
    Type: Application
    Filed: March 4, 2019
    Publication date: June 27, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Ki Bok Song, Ilchan Lee, Dong Ryul Cha
  • Patent number: 10014640
    Abstract: Examples disclosed herein relate to an alternating current (AC) adapter. In one example, an AC adapter includes an adapter head with an arm extending from a first side of a surface of the adapter head towards a centerline of the first surface of the adapter head to secure a cable to the first surface of the adapter head. A housing body is coupled to the adapter head. The arm is deformable to be biased towards a first position to secure the cable between the arm and the first surface of the adapter head and flexed to a second position to allow an operator to insert the cable between the arm and the first surface of the adapter head.
    Type: Grant
    Filed: September 30, 2014
    Date of Patent: July 3, 2018
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Vincent Kenya Shyu, Chad Patrick Paris, Ilchan Lee
  • Patent number: D838269
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: January 15, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stacy L. Wolff, Kevin L. Massaro, Eric Chen, Ilchan Lee, Dimitre D. Mehandjiysky, Sandie N. Cheng, Aki Laine, Heesang Kil, Ki Bok Song, Britt C. Ashcraft, Michael J. Delpier, Marcus A. Hoggarth, Kyle R. Loughlin, David B. Sutton
  • Patent number: D871394
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: December 31, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: J Q Jung, Ilchan Lee, Kevin L. Massaro, Stacy L. Wolff, Jonathan Garcia Gomez, Isaac Teece, Harc Lee, Marcus Hoggarth
  • Patent number: D872073
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: January 7, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Dong Ryul Cha, Ilchan Lee, Mark Senatori
  • Patent number: D877734
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: March 10, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Dong Ryul Cha, Jq Jung, Ilchan Lee
  • Patent number: D887404
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: June 16, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Philip Moon, Ilchan Lee
  • Patent number: D890166
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: July 14, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jq Jung, Ilchan Lee, Kevin L. Massaro
  • Patent number: D901486
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 10, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Philip Moon, Ilchan Lee, Kevin L. Massaro