Abstract: A complementary metal oxide semiconductor (CMOS) device embedded with micro-electro-mechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermoconforms. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the MEMS sensors in the MEMS region. The CMOS cap includes a base cap with release openings and a seal cap which seals the release openings.

Abstract: Device and method of forming the device are disclosed. The method includes providing a substrate prepared with a complementary metal oxide semiconductor (CMOS) region and a sensor region. A substrate cavity is formed in the substrate in the sensor region, the substrate cavity including cavity sidewalls and cavity bottom surface and a membrane which serves as a substrate cavity top surface. The cavity bottom surface includes a reflector. The method also includes forming CMOS devices in the CMOS region, forming a micro-electrical mechanical system (MEMS) component on the membrane, and forming a back-end-of-line (BEOL) dielectric disposed on the substrate having a plurality of interlayer dielectric (ILD) layers. The BEOL dielectric includes an opening to expose the MEMS component. The opening forms a BEOL cavity above the MEMS component.

Abstract: A complementary metal oxide semiconductor (CMOS) device integrated with micro-electro-mechanical system (MEMS) components in a MEMS region is disclosed. The MEMS components, for example, are infrared (IR) thermosensors. The MEMS sensors are integrated on the CMOS device heterogeneously. For example, a CMOS wafer with CMOS devices and interconnections as well as partially processed MEMS modules is bonded with a MEMS wafer with MEMS structures, post CMOS compatibility issues are alleviated. Post integration process to complete the devices includes forming contacts for interconnecting the sensors to the CMOS components as well as encapsulating the devices with a cap wafer using wafer-level vacuum packaging.

Abstract: In an approach for automatic vertical partitioning of fact tables in a distributed query engine a processor analyzes a sample end-user workload of queries to extract filter predicates associated with each of multiple fact tables relating to a big data store. A processor, for each fact table, and for each column in the fact table to which a filter predicate is applied and where coarsification is required, generates a candidate partitioning expression incorporating an adjustment to a coarsification function based on a data distribution of values in the column. A processor scores the candidate partitioning expressions for each fact table based on cost data relating to the sample end-user workload and selects one or more candidate partitioning expressions to optimize partitioning of each fact table with each partition data being placed in a separate directory in a distributed file system.

Abstract: Aspects of the present invention disclose a method, computer program product, and system for auto-scaling a query engine. The method includes one or more processors monitoring query traffic at the query engine. The method further includes one or more processors classifying queries by a plurality of service classes based on a level of complexity of a query. The method further includes one or more processors comparing query traffic for each service class with a concurrency threshold of a maximum number of queries of the service class allowed to be concurrently processed. The method further includes one or more processors instructing auto-scaling of a cluster of worker nodes to change a number of worker nodes available in the cluster based on the comparison, over a defined period of time, of the query traffic relative to a defined upscaling threshold and a defined downscaling threshold.

Abstract: A computer-implemented method, system and computer program product for optimally performing stress testing against big data management systems. A set of random test queries is generated and compiled to determine the data points of the features (e.g., table type being queried) of the set of random test queries. A distance (e.g., Mahalanobis distance) is then measured between the data points of the features and the mean of a distribution of data points corresponding to each same feature of an extracted feature set. Each random test query whose distance exceeds a threshold distance is then ranked. The ranked random test queries are then executed in order of rank. Those executed random test queries which resulted in an error (e.g., system failure) are added to a log, which is used to identify those queries to perform a stress test against the big data management system.

Abstract: A computer-implemented method, system and computer program product for optimally performing stress testing against big data management systems. A set of random test queries is generated and compiled to determine the data points of the features (e.g., table type being queried) of the set of random test queries. A distance (e.g., Mahalanobis distance) is then measured between the data points of the features and the mean of a distribution of data points corresponding to each same feature of an extracted feature set. Each random test query whose distance exceeds a threshold distance is then ranked. The ranked random test queries are then executed in order of rank. Those executed random test queries which resulted in an error (e.g., system failure) are added to a log, which is used to identify those queries to perform a stress test against the big data management system.

Abstract: A computer-implemented method, system and computer program product for optimally performing stress testing against big data management systems. A set of random test queries is generated and compiled to determine the data points of the features (e.g., table type being queried) of the set of random test queries. A distance (e.g., Mahalanobis distance) is then measured between the data points of the features and the mean of a distribution of data points corresponding to each same feature of an extracted feature set. Each random test query whose distance exceeds a threshold distance is then ranked. The ranked random test queries are then executed in order of rank. Those executed random test queries which resulted in an error (e.g., system failure) are added to a log, which is used to identify those queries to perform a stress test against the big data management system.

Abstract: A cover for an infrared detector and a method of fabricating the cover are disclosed. The cover comprises a wafer comprising a material such as silicon that transmits infrared radiation. The wafer has a first surface and a second surface opposite the first surface. An antireflective region is formed in the wafer to enhance transmission of infrared radiation through the cover. The antireflective region comprises a first plurality of antireflective elements such as moth-eyes formed in the first surface. The first plurality of antireflective elements are sized and shaped and arranged relative to one another to form a region of graded refractive index at the first surface so as to reduce the amount of infrared radiation reflected by the cover at the antireflective region. The cover comprises a wall extending from the first surface and surrounding the antireflective region.

Abstract: In an approach for automatic vertical partitioning of fact tables in a distributed query engine a processor analyzes a sample end-user workload of queries to extract filter predicates associated with each of multiple fact tables relating to a big data store. A processor, for each fact table, and for each column in the fact table to which a filter predicate is applied and where coarsification is required, generates a candidate partitioning expression incorporating an adjustment to a coarsification function based on a data distribution of values in the column. A processor scores the candidate partitioning expressions for each fact table based on cost data relating to the sample end-user workload and selects one or more candidate partitioning expressions to optimize partitioning of each fact table with each partition data being placed in a separate directory in a distributed file system.

Abstract: Proposed are concepts for providing resilience (i.e., fault tolerance) for the temporary data needs of a distributed file system. Such concepts may, for instance, provide a virtual storage layer in a data node of a distributed file system. The virtual storage layer may provide resilience for the temporary data needs of a Massively Parallel Processing (MPP) SQL on Hadoop engine.

Abstract: A complementary metal oxide semiconductor (CMOS) device embedded with microelectromechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermosensors. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the device using wafer-level vacuum packaging techniques. The cap includes an integrated focusing system with a metalens module for focusing IR radiation onto the sensors.

Abstract: A complementary metal oxide semiconductor (CMOS) device embedded with micro-electro-mechanical system (MEMS) components in a MEMS region is disclosed. The MEMS components, for example, are infrared (IR) thermosensors. The MEMS sensors are integrated on the CMOS device monolithically after CMOS processing. For example, the MEMS sensors are formed over a BEOL dielectric of a CMOS device. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the MEMS sensors in the MEMS region.

Abstract: A complementary metal oxide semiconductor (CMOS) device integrated with micro-electro-mechanical system (MEMS) components in a MEMS region is disclosed. The MEMS components, for example, are infrared (IR) thermosensors. The MEMS sensors are integrated on the CMOS device heterogeneously. For example, a CMOS wafer with CMOS devices and interconnections as well as partially processed MEMS modules is bonded with a MEMS wafer with MEMS structures, post CMOS compatibility issues are alleviated. Post integration process to complete the devices includes forming contacts for interconnecting the sensors to the CMOS components as well as encapsulating the devices with a cap wafer using wafer-level vacuum packaging.

Abstract: Proposed are concepts for providing resilience (i.e., fault tolerance) for the temporary data needs of a distributed file system. Such concepts may, for instance, provide a virtual storage layer in a data node of a distributed file system. The virtual storage layer may provide resilience for the temporary data needs of a Massively Parallel Processing (MPP) SQL on Hadoop engine.

Abstract: A complementary metal oxide semiconductor (CMOS) device embedded with microelectromechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermosensors. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the device using wafer-level vacuum packaging techniques.

Abstract: Aspects of the present invention disclose a method, computer program product, and system for auto-scaling a query engine. The method includes one or more processors monitoring query traffic at the query engine. The method further includes one or more processors classifying queries by a plurality of service classes based on a level of complexity of a query. The method further includes one or more processors comparing query traffic for each service class with a concurrency threshold of a maximum number of queries of the service class allowed to be concurrently processed. The method further includes one or more processors instructing auto-scaling of a cluster of worker nodes to change a number of worker nodes available in the cluster based on the comparison, over a defined period of time, of the query traffic relative to a defined upscaling threshold and a defined downscaling threshold.

Abstract: A complementary metal oxide semiconductor (CMOS) device embedded with micro-electro-mechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermoconforms. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the MEMS sensors in the MEMS region. The CMOS cap includes a base cap with release openings and a seal cap which seals the release openings.

Abstract: Device and method of forming the device are disclosed. The method includes providing a substrate prepared with a complementary metal oxide semiconductor (CMOS) region and a sensor region. A substrate cavity is formed in the substrate in the sensor region, the substrate cavity including cavity sidewalls and cavity bottom surface and a membrane which serves as a substrate cavity top surface. The cavity bottom surface includes a reflector. The method also includes forming CMOS devices in the CMOS region, forming a micro-electrical mechanical system (MEMS) component on the membrane, and forming a back-end-of-line (BEOL) dielectric disposed on the substrate having a plurality of interlayer dielectric (ILD) layers. The BEOL dielectric includes an opening to expose the MEMS component. The opening forms a BEOL cavity above the MEMS component.

Abstract: Device and method of forming a device are disclosed. The device includes a substrate with a transistor component disposed in a transistor region and a micro-electrical mechanical system (MEMS) component disposed on a membrane over a lower sensor cavity in a hybrid region. The MEMS component serves as thermoelectric-based infrared sensor, a thermopile line structure which includes an absorber layer disposed over a portion of oppositely doped first and second line segments. A back-end-of-line (BEOL) dielectric is disposed on the substrate having a plurality of inter layer dielectric (ILD) layers with metal and via levels. The ILD layers include metal lines and via contacts for interconnecting the components of the device. The metal lines in the metal levels are configured to define a BEOL or an upper sensor cavity over the lower sensor cavity, and metal lines of a first metal level of the BEOL dielectric are configured to define a geometry of the MEMS component.