Abstract: A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to a plurality of tubes extending between header tanks in an upper portion of a housing. A refrigerant is disposed in the lower portion of the housing for liquid-to-vapor transformation. The tubes are radially flexible to vary the volume of the tubes for modulating the flow of coolant liquid through the tubes in response to heat transferred by an electronic device to the lower portion of the housing.

Abstract: A fluid heat exchanger assembly cools an electronic device with a cooling fluid supplied from a heat extractor (R, F) to a plurality of tubes extending between header tanks in an upper portion of a housing. A refrigerant is disposed in the lower portion of the housing for liquid-to-vapor transformation. The tubes are radially flexible to vary the volume of the tubes for modulating the flow of coolant liquid through the tubes in response to heat transferred by an electronic device to the lower portion of the housing.

Abstract: A fill and bleed valve for filling a liquid cooling system has a single axially movable plunger, slidable within a central block bore, from a normal operating position to a filling position that opens the cooling system to a supply of coolant. The filling operation is continued until all air is purged from the system. The central block bore also retains a solid fill of coolant, and when shifted back to the normal operating system, no air is introduced into the system.

Abstract: A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.

Abstract: A portable air filtration system includes a filter housing having an air inlet and an air outlet. The filter housing defines a filtration chamber between the air inlet and the air outlet. The portable air filtration system uses an ionizing mechanism, a filter media, and an electrode to filter air. The ionizing mechanism ionizes particles within the air to a negative charge. The filter media is disposed between the ionizing mechanism and the air outlet for entrapping the particles. The electrode is disposed between the ionizing mechanism and the filter media to establish an electric field. The electric field is established between the ionizing mechanism and the electrode adjacent to the filter media. The electrode is also electrically-connected to ground and to the filter media for dissipating the negative charge of the particles entrapped within the filter media.

Abstract: A fill and bleed valve for filling a liquid cooling system has a single axially movable plunger, slidable within a central block bore, from a normal operating position to a filling position that opens the cooling system to a supply of coolant. The filling operation is continued until all air is purged from the system. The central block bore also retains a solid fill of coolant, and when shifted back to the normal operating system, no air is introduced into the system.

Abstract: A heat dissipation element for cooling an electronic device is disclosed. The heat dissipation element has a top surface and a bottom surface for mounting the electronic device to be cooled thereto. The top surface defines a heat dissipation area for dissipating heat from the electronic device and a plurality of heat transfer fins project upwardly from the top surface and are coextensive with the heat dissipation area. Each of the heat transfer fins defines a plurality of steps having a rise and a run and each of the steps extend across the heat dissipation area for maximizing an amount of heat dissipated from the electronic device. The heat dissipation element is particularly useful in either one of a cold plate assembly used with a liquid cooled unit (LCU) or a boiler plate assembly used with a thermosiphon cooling unit (TCU).

Abstract: A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within the sealed chamber. Intersecting partition walls are mounted to the condenser plate and are angled downwardly toward the base plate for directing working fluid on the condenser plate down a corner of the walls toward a portion of the base plate. Preferably, the base plate defines a first circumference and the condenser plate defines a second circumference larger than the first circumference such that the outer wall has an angled configuration extending between the base plate and the condenser plate to provide a larger area within the sealed chamber for a vapor phase of the working fluid than a liquid phase of the working fluid.

Abstract: A portable air filtration system includes a filter housing having an air inlet and an air outlet. The filter housing defines a filtration chamber between the air inlet and the air outlet. The portable air filtration system uses an ionizing mechanism, a filter media, and an electrode to filter air. The ionizing mechanism ionizes particles within the air to a negative charge. The filter media is disposed between the ionizing mechanism and the air outlet for entrapping the particles. The electrode is disposed between the ionizing mechanism and the filter media to establish an electric field. The electric field is established between the ionizing mechanism and the electrode adjacent to the filter media. The electrode is also electrically-connected to ground and to the filter media for dissipating the negative charge of the particles entrapped within the filter media.

Abstract: A cooling assembly having a base plate and a condenser plate. An outer wall interconnects the base plate to the condenser plate to define a sealed chamber with a working fluid being disposed within the sealed chamber. Intersecting partition walls are mounted to the condenser plate and are angled downwardly toward the base plate for directing working fluid on the condenser plate down a corner of the walls toward a portion of the base plate. Preferably, the base plate defines a first circumference and the condenser plate defines a second circumference larger than the first circumference such that the outer wall has an angled configuration extending between the base plate and the condenser plate to provide a larger area within the sealed chamber for a vapor phase of the working fluid than a liquid phase of the working fluid.

Abstract: A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat to evaporate the working fluid into a vaporized working fluid within the chamber disposed between a first condensation region and a second condensation region opposite the first condensation region for condensing the vaporized working fluid back into a liquefied working fluid within the chamber. Each of the condensation regions have a first portion extending upwardly at a first angle from the evaporation region and a second portion extending upwardly at a second angle different than the first angle.

Abstract: A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.

Abstract: A leak detection apparatus includes one or more detection devices that envelope the various pipe joints of a liquid circulation cooling system. In one approach, the detection devices include a pair of conductors separated by a wicking material impregnated with a crystalline salt that provides a low resistance electrical path between the conductors in the presence of a leak. In another approach, the detection devices include a pair of dissimilar metal mesh electrodes separated by an electrolyte-impregnated wicking material to form a water-activated battery that energizes an alarm in the presence of a leak. In either case, the electrodes and wicking material may be encased with a water-activated sealing material that hardens in the presence of a leak to contain the leakage.

Abstract: A compact thermosiphon assembly for dissipating heat generated by electronic components using a working fluid includes a tube having a first end and a second end and a flat cross section defining an elongated chamber is disclosed. The tube has an evaporation region for receiving heat to evaporate the working fluid into a vaporized working fluid within the chamber disposed between a first condensation region and a second condensation region opposite the first condensation region for condensing the vaporized working fluid back into a liquefied working fluid within the chamber. Each of the condensation regions have a first portion extending upwardly at a first angle from the evaporation region and a second portion extending upwardly at a second angle different than the first angle.

Abstract: A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a base having an upper surface and a plurality of fins extending substantially upwardly from the upper surface. The condenser also includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator.

Abstract: A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a base having an upper surface and a plurality of fins extending substantially upwardly from the upper surface. The condenser also includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator.

Abstract: A thermosiphon assembly for dissipating heat generated by an electronic component using a working fluid is disclosed. The assembly includes an evaporator having a front face, a rear face, and a peripheral wall extending between the front face and the rear face and being arcuate. A heat block contacts the front face for transferring generated heat from the electronic component to the working fluid to vaporize the working fluid. A condenser is in fluid communication with the chamber and connected to the rear face for condensing the vaporized working fluid back to a liquid. The assembly further includes an acute angle between the front face and the peripheral wall such that the chamber extends upwardly at an angle from the front face to the rear face to ensure complete coverage of the heat block with the cooling fluid in any position between horizontal and vertical.

Abstract: A heat sink assembly for cooling an electronic device comprises a fan housed in a shroud, the fan including a hub and fan blades extending therefrom for causing an axially directed airflow through the shroud upon rotation of the fan blades. A thermosiphon comprises an evaporator defining an evaporating chamber containing a working fluid therein and further including a condenser mounted thereabove. The thermosiphon is positioned at one end of the shroud such that the fan is aligned with the condenser for directing the axial airflow therethrough. The condenser includes a plurality of tubes forming a tube grouping. Each tube having an opening in fluid communication with the evaporator and for receiving and condensing vapor of the working fluid received from the evaporator. The tubes are axially aligned with the airflow and are laterally positioned such that a lateral width of the tube grouping is approximately equal to a width of the hub and substantially in lateral alignment therewith.

Abstract: A thermosiphon for cooling an electronic device having a mean width of dimension “b” comprises a boilerplate having a top surface and including a plurality of pyramid shaped fins projecting upwardly from the top surface. The boilerplate also has a bottom surface for receiving the electronic device to be cooled. A plurality of spaced apart condenser tubes is mounted above the boilerplate such that the boilerplate and the condenser tubes define a vapor chamber therebetween for receiving a working fluid therein. A plurality of convoluted fins extends between each adjacent pair of condenser tubes.

Abstract: A thermoelectric refrigerant handling system that includes a chamber having an inlet path for receiving refrigerant from a source thereof and an outlet for delivering refrigerant in vapor phase. A thermoelectric element is operatively disposed between the chamber and the refrigerant inlet path, and is responsive to application of electrical energy for transferring heat from the inlet path to the chamber. In this way, heat is withdrawn from refrigerant at the inlet path and refrigerant is drawn into the inlet from the source, while heat is added to refrigerant in the chamber until the refrigerant is vaporized and driven by vapor pressure through the chamber outlet. A controller applies electrical energy to the thermoelectric element for transferring heat into the chamber to vaporize the refrigerant contained therein until the chamber is substantially empty of refrigerant, and then opens a valve to feed refrigerant from the inlet path to the chamber.