Patents by Inventor Ilyoung Richard Hong
Ilyoung Richard Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8790499Abstract: A process kit for a sputtering chamber comprises a deposition ring, cover ring, and a shield assembly, for placement about a substrate support in a sputtering chamber. The deposition ring comprising an annular band with an inner lip extending transversely, a raised ridge substantially parallel to the substrate support, an inner open channel, and a ledge radially outward of the raised ridge. A cover ring at least partially covers the deposition ring, the cover ring comprising an annular plate comprising a footing which rests on a surface about the substrate support, and downwardly extending first and second cylindrical walls.Type: GrantFiled: November 12, 2006Date of Patent: July 29, 2014Assignee: Applied Materials, Inc.Inventors: Donny Young, Alan Alexander Ritchie, Ilyoung (Richard) Hong, Kathleen A. Scheible
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Patent number: 8647484Abstract: A sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate has a groove. The sputtering plate comprises a cylindrical mesa having a plane, and an annular inclined rim surrounding the cylindrical mesa. In one version, the backing plate comprises a material having a high thermal conductivity and a low electrical resistivity. In another version, the backing plate comprises a backside surface with a single groove or a plurality of grooves.Type: GrantFiled: November 12, 2006Date of Patent: February 11, 2014Assignee: Applied Materials, Inc.Inventors: Alan Alexander Ritchie, Donny Young, Ilyoung (Richard) Hong, Kathleen A. Scheible, Umesh Kelkar
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Publication number: 20120237682Abstract: A system for handling masked substrates comprising a chamber having a pedestal for supporting a substrate, and a chuck for supporting a mask in relation to a substrate. The system may include an alignment system operable to confirm alignment of the mask and the substrate. A method of positioning a mask on a substrate in a chamber comprises supporting the mask with a chuck disposed in the chamber and supporting the substrate with a pedestal disposed in the chamber. The method may further comprise aligning one or more reference points on the mask with one or more reference points on the substrate and positioning the mask on the substrate using at least one of the chuck and the pedestal.Type: ApplicationFiled: March 7, 2012Publication date: September 20, 2012Applicant: Applied Materials, Inc.Inventors: Ilyoung Richard Hong, William N. Sterling, Dongsuh Lee
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Patent number: 7807030Abstract: A small magnet assembly having a magnet assembly of area less than 10% of the target area, is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly passes through the target center, thus allowing full target coverage. A properly chosen ratio of the two rotations about respective axes produces a much slower magnet velocity near the target periphery than at the target center. A geared planetary mechanism includes a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plane supporting a cantilevered magnet assembly on the side of the drive plate facing the target.Type: GrantFiled: December 14, 2006Date of Patent: October 5, 2010Assignee: Applied Materials, Inc.Inventors: Ilyoung Richard Hong, James Tsung, Daniel Clarence Lubben, Peijun Ding, Nirmalya Maity
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Patent number: 7767064Abstract: A dual magnetron for plasma sputtering including a source magnetron and an auxiliary magnetron, each of which rotate about the center of the target at respective radii. The positions of the magnetron can be moved in complementary radial directions between sputter deposition and target cleaning. The magnetrons have different characteristics of size, strength, and imbalance. The source magnetron is smaller, stronger, and unbalanced source magnetron and is positioned near the edge of the wafer in sputter deposition and etching. The auxiliary magnetron is larger, weak, and more balanced and used for cleaning the center of the target and guiding sputter ions from the source magnetron in sputter deposition. Each magnetron may have its plasma shorted out in its radially outer position.Type: GrantFiled: October 27, 2006Date of Patent: August 3, 2010Assignee: Applied Materials, Inc.Inventors: Cristopher M. Pavloff, Winsor Lam, Tza-Jing Gung, Hong S. Yang, Ilyoung Richard Hong
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Patent number: 7674360Abstract: A lift mechanism for and a corresponding use of a magnetron in a plasma sputter reactor. A magnetron rotating about the target axis is controllably lifted away from the back of the target to compensate for sputter erosion, thereby maintaining a constant magnetic field and resultant plasma density at the sputtered surface, which is particularly important for stable operation with a small magnetron, for example, one executing circular or planetary motion about the target axis. The lift mechanism can include a lead screw axially fixed to the magnetron support shaft and a lead nut engaged therewith to raise the magnetron as the lead nut is turned. Alternatively, the support shaft is axially fixed to a vertically moving slider. The amount of lift may be controlled according a recipe based on accumulated power applied to the target or by monitoring electrical characteristics of the target.Type: GrantFiled: September 16, 2004Date of Patent: March 9, 2010Assignee: Applied Materials, Inc.Inventors: Ilyoung Richard Hong, Donny Young, Michael Rosenstein, Robert B. Lowrance, Daniel C. Lubben, Michael Andrew Miller, Peijun Ding, Sreekrishnan Sankaranarayan, Goichi Yoshidome
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Publication number: 20080099329Abstract: A dual magnetron for plasma sputtering including a source magnetron and an auxiliary magnetron, each of which rotate about the center of the target at respective radii. The positions of the magnetron can be moved in complementary radial directions between sputter deposition and target cleaning. The magnetrons have different characteristics of size, strength, and imbalance. The source magnetron is smaller, stronger, and unbalanced source magnetron and is positioned near the edge of the wafer in sputter deposition and etching. The auxiliary magnetron is larger, weak, and more balanced and used for cleaning the center of the target and guiding sputter ions from the source magnetron in sputter deposition. Each magnetron may have its plasma shorted out in its radially outer position.Type: ApplicationFiled: October 27, 2006Publication date: May 1, 2008Applicant: Applied Materials, Inc.Inventors: Cristopher M. Pavloff, Winsor Lam, Tza-Jing Gung, Hong S. Yang, Ilyoung Richard Hong
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Publication number: 20070173059Abstract: A process kit for a sputtering chamber comprises a deposition ring, cover ring, and a shield assembly, for placement about a substrate support in a sputtering chamber. The deposition ring comprising an annular band with an inner lip extending transversely, a raised ridge substantially parallel to the substrate support, an inner open channel, and a ledge radially outward of the raised ridge. A cover ring at least partially covers the deposition ring, the cover ring comprising an annular plate comprising a footing which rests on a surface about the substrate support, and downwardly extending first and second cylindrical walls.Type: ApplicationFiled: November 12, 2006Publication date: July 26, 2007Inventors: Donny Young, Alan Ritchie, Ilyoung (Richard) Hong, Kathleen Scheible
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Publication number: 20070170052Abstract: A sputtering chamber has a sputtering target comprising a backing plate and a sputtering plate. The backing plate has a groove. The sputtering plate comprises a cylindrical mesa having a plane, and an annular inclined rim surrounding the cylindrical mesa. In one version, the backing plate comprises a material having a high thermal conductivity and a low electrical resistivity. In another version, the backing plate comprises a backside surface with a single groove or a plurality of grooves.Type: ApplicationFiled: November 12, 2006Publication date: July 26, 2007Inventors: Alan Ritchie, Donny Young, Ilyoung (Richard) Hong, Kathleen Scheible, Umesh Kelkar
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Patent number: 7169271Abstract: A small magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly passes through the target center, thus allowing full target coverage. A properly chosen ratio of the two rotations about respective axes produces a much slower magnet velocity near the target periphery than at the target center. A geared planetary mechanism includes a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plane supporting a cantilevered magnet assembly on the side of the drive plate facing the target. A belted planetary mechanism includes a fixed center capstan, a follower pulley supporting the magnet assembly, and a belt wrapped around them.Type: GrantFiled: June 7, 2004Date of Patent: January 30, 2007Assignee: Applied Materials, Inc.Inventors: Ilyoung Richard Hong, James Tsung, Daniel Clarence Lubben, Peijun Ding, Nirmalya Maity
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Patent number: 6852202Abstract: A small unbalanced magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly may pass through the target center, thus allowing full target coverage. A geared planetary mechanism may include a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plate supporting a cantilevered magnet assembly on the side of the drive plate facing the target. The erosion profile may be controlled by varying the rotation rate through the rotation cycle or by modulating the target power. A second planetary stage may be added or non-circular gears be used. Auxiliary electromagnetic coils may create a focusing magnetic field.Type: GrantFiled: April 17, 2003Date of Patent: February 8, 2005Assignee: Applied Materials, Inc.Inventors: Michael Andrew Miller, James H. Tsung, Daniel C. Lubben, Ilyoung Richard Hong, Peijun Ding
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Patent number: 6841050Abstract: A small magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly passes through the target center, thus allowing full target coverage. A properly chosen ratio of the two rotations about respective axes produces a much slower magnet velocity near the target periphery than at the target center. A geared planetary mechanism includes a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plane supporting a cantilevered magnet assembly on the side of the drive plate facing the target. A belted planetary mechanism includes a fixed center capstan, a follower pulley supporting the magnet assembly, and a belt wrapped around them.Type: GrantFiled: May 21, 2002Date of Patent: January 11, 2005Assignee: Applied Materials, Inc.Inventors: Ilyoung Richard Hong, James Tsung, Daniel Clarence Lubben, Peijun Ding, Nirmalya Maity
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Publication number: 20040222087Abstract: A small magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly passes through the target center, thus allowing full target coverage. A properly chosen ratio of the two rotations about respective axes produces a much slower magnet velocity near the target periphery than at the target center. A geared planetary mechanism includes a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plane supporting a cantilevered magnet assembly on the side of the drive plate facing the target. A belted planetary mechanism includes a fixed center capstan, a follower pulley supporting the magnet assembly, and a belt wrapped around them.Type: ApplicationFiled: June 7, 2004Publication date: November 11, 2004Inventors: Ilyoung Richard Hong, James Tsung, Daniel Clarence Lubben, Peijun Ding, Nirmalya Maity
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Publication number: 20030217913Abstract: A small magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly passes through the target center, thus allowing full target coverage. A properly chosen ratio of the two rotations about respective axes produces a much slower magnet velocity near the target periphery than at the target center. A geared planetary mechanism includes a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plane supporting a cantilevered magnet assembly on the side of the drive plate facing the target. A belted planetary mechanism includes a fixed center capstan, a follower pulley supporting the magnet assembly, and a belt wrapped around them.Type: ApplicationFiled: May 21, 2002Publication date: November 27, 2003Applicant: APPLIED MATERIALS, INC.Inventors: Ilyoung Richard Hong, James Tsung, Daniel Clarence Lubben, Peijun Ding, Nirmalya Maity
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Publication number: 20030217914Abstract: A small unbalanced magnet assembly is scanned in a retrograde planetary or epicyclic path about the back of a target being plasma sputtered including an orbital rotation about the center axis of the target and a planetary rotation about another axis rotating about the target center axis. The magnet assembly may pass through the target center, thus allowing full target coverage. A geared planetary mechanism may include a rotating drive plate, a fixed center gear, and an idler and a follower gear rotatably supported in the drive plate supporting a cantilevered magnet assembly on the side of the drive plate facing the target. The erosion profile may be controlled by varying the rotation rate through the rotation cycle or by modulating the target power. A second planetary stage may be added or non-circular gears be used. Auxiliary electromagnetic coils may create a focusing magnetic field.Type: ApplicationFiled: April 17, 2003Publication date: November 27, 2003Applicant: Applied Materials, Inc.Inventors: Michael Andrew Miller, James H. Tsung, Daniel C. Lubben, Ilyoung Richard Hong, Peijun Ding