Patents by Inventor Imtiaz Chaudhry

Imtiaz Chaudhry has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for assembling a ball grid array package with two substrates
    Patent number: 7312108
    Abstract: An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: December 25, 2007
    Assignee: Broadcom Corporation
    Inventors: Sam Zinqun Zhao, Reza-ur Rahman Khan, Imtiaz Chaudhry
  • Method for assembling a ball grid array package with two substrates
    Publication number: 20050173787
    Abstract: An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
    Type: Application
    Filed: March 11, 2005
    Publication date: August 11, 2005
    Applicant: Broadcom Corporation
    Inventors: Sam Zhao, Reza-ur Khan, Imtiaz Chaudhry
  • Method for making an enhanced die-up ball grid array package with two substrates
    Patent number: 6887741
    Abstract: An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
    Type: Grant
    Filed: December 9, 2003
    Date of Patent: May 3, 2005
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan, Imtiaz Chaudhry
  • Enhanced die-up ball grid array package with two substrates
    Patent number: 6876553
    Abstract: An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: April 5, 2005
    Assignee: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-ur Rahman Khan, Imtiaz Chaudhry
  • Method for making an enhanced die-up ball grid array package with two substrates
    Publication number: 20040113284
    Abstract: An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
    Type: Application
    Filed: December 9, 2003
    Publication date: June 17, 2004
    Applicant: Broadcom Corporation
    Inventors: Sam Ziqun Zhao, Reza-Ur Rahman Khan, Imtiaz Chaudhry
  • Enhanced die-up ball grid array package with two substrates and method for making the same
    Publication number: 20030179556
    Abstract: An electrically and thermally enhanced die-up ball grid array (BGA) package is described. An integrated circuit (IC) package includes a first substrate, a second substrate, and a stiffener. A surface of the first substrate is attached to a first surface of the stiffener. A surface of the second substrate is attached to a second surface of the stiffener. An IC die may be attached to a second surface of the second substrate or to the second surface of the stiffener. Additional electronic devices may be attached to the second surface of the second substrate.
    Type: Application
    Filed: March 21, 2002
    Publication date: September 25, 2003
    Applicant: Broadcom Corporation
    Inventors: Sam Z. Zhao, Reza-ur R. Khan, Imtiaz Chaudhry