Patents by Inventor In Baek

In Baek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11991925
    Abstract: Provided are a light-emitting device including a condensed cyclic compound represented by Formula 1-1 or 1-2, and an electronic apparatus including the light-emitting device. The light emitting device includes: a first electrode; a second electrode facing the first electrode, and an interlayer between the first electrode and the second electrode and comprising an emission layer, where the interlayer further comprises a hole transport region between the first electrode and the emission layer, the hole transport region comprises a compound represented by Formula 201, a compound represented by Formula 202, or any combination thereof, and the emission layer comprises at least one condensed cyclic compound represented by Formula 1-1 or 1-2.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: May 21, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Munki Sim, Taeil Kim, Sunyoung Pak, Junha Park, Jangyeol Baek, Chanseok Oh, Minjung Jung
  • Patent number: 11990952
    Abstract: In one embodiment, a method includes receiving low voltage pulse power from power sourcing equipment at a powered device, synchronizing the powered device with a waveform of the low voltage pulse power received from the power sourcing equipment, and operating the powered device with high voltage pulse power received from the power sourcing equipment.
    Type: Grant
    Filed: March 20, 2023
    Date of Patent: May 21, 2024
    Assignee: CISCO TECHNOLOGY, INC.
    Inventors: Douglas Paul Arduini, Sung Kee Baek, Richard Anthony O'Brien, Joel Richard Goergen, Chad M. Jones, Jason Dewayne Potterf, Ruqi Li
  • Patent number: 11991902
    Abstract: A display device includes a bank including an opening exposing a surface of a base. The bank further includes side surfaces adjacent to an upper surface. The side surfaces slope downward from the upper surface toward an opening in an organic film pattern. A plurality of fine holes is formed on the upper surface and the side surfaces, the bank may also include a plurality of inner holes.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: May 21, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Myung Hwan Kim, Suk Hoon Kang, Min Jae Kim, Hee Ra Kim, Beom Soo Shin, Hong Yeon Lee, Baek Kyun Jeon
  • Patent number: 11991339
    Abstract: Disclosed are methods and apparatuses for decoding an image. A method includes receiving a bitstream obtained by encoding the image; dividing a first coding block into a plurality of second coding blocks; generating a prediction block of a second coding block based on syntax information obtained from the bitstream; and reconstructing the second coding block based on the prediction block and a residual block of the second coding block, the residual block being obtained by performing a dequantization and an inverse-transform on quantized transform coefficients from the bitstream. The first coding block has a recursive division structure. The first coding block is divided based on at least one of a quad tree division, a binary tree division or a triple tree division.
    Type: Grant
    Filed: November 29, 2023
    Date of Patent: May 21, 2024
    Assignee: B1 INSTITUTE OF IMAGE TECHNOLOGY, INC.
    Inventor: Ki Baek Kim
  • Patent number: 11991366
    Abstract: The in-loop filtering method performed by a video decoding apparatus includes: classifying reconstructed samples according to an absolute classification standard or relative classification standard; acquiring offset data on the basis of results of classifying the reconstructed samples; adding an offset value to the reconstructed samples by referencing the acquired offset data; and outputting the offset value-added reconstructed samples. Accordingly, W errors in the reconstructed image can be corrected.
    Type: Grant
    Filed: December 8, 2022
    Date of Patent: May 21, 2024
    Assignee: Industry-University Cooperation Foundation Hanyang University
    Inventors: Ki Baek Kim, Je Chang Jeong
  • Patent number: 11990701
    Abstract: Provided are a receptacle connector configured to avoid damage to conductors of the receptacle connector. The receptacle connector includes a plurality of connection terminals, a mold structure which comprises a front part exposing each of the connection terminals and a support part disposed on a rear end of the front part and surrounding each of the connection terminals, and a shield which is disposed on the support part and comprises a conductive material, wherein the support part comprises a flat part which includes a surface along which the shield extends and a protruding part which protrudes from the surface of the flat part and is disposed in front of a front end of the shield. The protruding part is configured to avoid damage to conductors of the receptacle when a plug is mated to the receptacle.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: May 21, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seon Gyun Baek, Jae Hong Park, Yusuf Cinar, Han Hong Lee
  • Patent number: 11987820
    Abstract: The present invention relates to a halophilic Bacillus polyfermenticus KMU01 strain producing salt-tolerant gamma-glutamyl transpeptidase, and the halophilic Bacillus polyfermenticus KMU01 strain according to the present invention (KCTC11751BP) producing a halophilic gamma-glutamyl transpeptidase, wherein, when food is fermented using the strain of the present invention, it can be utilized in foods with high salt concentration, and fermented foods having excellent flavor and various peptides can be prepared by high enzyme activity that decomposes protein binding.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: May 21, 2024
    Assignee: KOOKMINBIO, CORP.
    Inventors: Moon Hee Sung, Misun Kwak, Seon-Young Baek
  • Patent number: 11987611
    Abstract: The present disclosure relates to a novel polypeptide having an activity of exporting 5?-inosine monophosphate, a microorganism comprising the same, a method for preparing 5?-inosine monophosphate using the same, and a method for increasing export of 5?-inosine monophosphate.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: May 21, 2024
    Assignee: CJ CHEILJEDANG CORPORATION
    Inventors: Jung Gun Kwon, Min Ji Baek, Ji Hye Lee, Nara Kwon, Ju Jeong Kim, Jin Ah Rho, Jin Man Cho
  • Patent number: 11987833
    Abstract: The present invention relates to a novel enzyme capable of producing multi-hydroxy derivatives from polyunsaturated fatty acids and a method for producing multi-hydroxy derivatives of polyunsaturated fatty acids using the same.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: May 21, 2024
    Assignee: KOREA RESEARCH INSTITUTE OF BIOSCIENCE AND BIOTECHNOLOGY
    Inventors: Jeong Woo Seo, Jong Jae Yi, Sun Yeon Heo, Young Bae Kim, Chul Ho Kim, Baek Rock Oh, Jung Hyun Ju, Hack Sun Choi
  • Patent number: 11987083
    Abstract: An apparatus enables a commercial vehicle tire hub drum to be attached and detached. The apparatus includes a main body frame having traveling wheels mounted on a lower part thereof and holding means that face forward from the main body frame for holding upright a circular load mounted on a commercial vehicle. An attachment/detachment means executes an attachment/detachment operation of the load from above the holding means. A position adjustment device coupled to the main body frame adjusts the position of the holding means and the attachment/detachment means. Accordingly, the apparatus uses a hydraulic device providing a hydraulic driving force to conveniently attach or detach a load of various sizes to a vehicle from a fixed position while simultaneously adjusting the vertical position of a load-holding means.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: May 21, 2024
    Inventor: Seong Gi Baek
  • Patent number: 11987561
    Abstract: A resist underlayer composition includes (A) a polymer including a structural unit represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof; (B) a polymer including a structure in which at least one moiety represented by Chemical Formula 3 or Chemical Formula 4 and a moiety represented by Chemical Formula 7 are bound to each other; and (C) a solvent:
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: May 21, 2024
    Assignee: Samsung SDI Co., Ltd.
    Inventors: Yoojeong Choi, Soonhyung Kwon, Hyeon Park, Jaeyeol Baek, Minsoo Kim, Shinhyo Bae, Daeseok Song, Dowon Ahn
  • Patent number: 11987598
    Abstract: Methods and compositions using E-selectin antagonists are provided for the treatment and prevention of diseases and disorders treatable by inhibiting binding of E-selectin to an E-selectin ligand. Described herein are E-selectin antagonists including, for example, glycomimetic compounds, antibodies, aptamers and peptides that are useful in methods for treatment of cancers, and treatment and prevention of metastasis, inhibiting infiltration of the cancer cells into bone marrow, reducing or inhibiting adhesion of the cancer cells to endothelial cells including cells in bone marrow, and inhibiting thrombus formation.
    Type: Grant
    Filed: April 20, 2022
    Date of Patent: May 21, 2024
    Assignee: GLYCOMIMETICS, INC.
    Inventors: John L. Magnani, Arun K. Sarkar, Myung-Gi Baek, Frank E. Anderson, III, Yanhong Li
  • Publication number: 20240159469
    Abstract: A heat exchanger including an inner tube including a bending portion, a first heat exchange portion extending from the bending portion, and a second heat exchange portion extending from the bending portion; a first outer tube forming a first double-tube structure around the first heat exchange portion; a second outer tube forming a second double-tube structure around the second heat exchange portion; and a first connection tube connecting a first through hole of the first outer tube and a second through hole of the second outer tube so as to connect the first outer tube and the second outer tube, wherein a first refrigerant is flowable through the heat exchange portions and the bending portion, a second refrigerant is flowable through the outer tubes and the first connection tube, and the second refrigerant exchanges heat with the first refrigerant at boundaries between the respective outer tubes and heat exchange portions.
    Type: Application
    Filed: September 29, 2023
    Publication date: May 16, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sunghee LEE, Jiho BAEK, Hyunwuk KANG, Duhan JUNG, Jaewoo CHOI
  • Publication number: 20240159920
    Abstract: The present disclosure is for minimizing the problem of AED sensor malfunction, and comprises: a panel having a plurality of sensing elements for sensing an X-ray, and converting an X-ray into an electrical signal; an AED sensor for sensing an X-ray; and a main control unit for obtaining image data by reading out the charge of the panel when an X-ray is sensed by the AED sensor, wherein the main control unit may determine whether or not reading out is to be performed on the basis of the acceleration of the panel even when the AED sensor senses an X-ray.
    Type: Application
    Filed: June 30, 2021
    Publication date: May 16, 2024
    Applicant: LG ELECTRONICS INC.
    Inventors: Seungchan BAEK, Seonghwan KIM, Youngsoo PARK, Sangjun PARK
  • Publication number: 20240161039
    Abstract: A prevention and safety management system utilizes a non-intrusive imaging sensor (e.g. surveillance cameras, smartphone cameras) and a computer vision system to record videos of workers not wearing sensors. The videos are analyzed using a deep machine learning algorithm to detect kinematic activities (set of predetermined body joint positions and angles) of the workers and recognizing various physical activities (walk/posture, lift, push, pull, reach, force, repetition, duration etc.). The measured kinematic variables are then parsed into metrics relevant to workplace ergonomics, such as number of repetitions, total distance travelled, range of motion, and the proportion of time in different posture categories. The information gathered by this system is fed into an ergonomic assessment system and is used to automatically populate exposure assessment tools and create risk assessments.
    Type: Application
    Filed: August 17, 2023
    Publication date: May 16, 2024
    Inventors: STEPHEN BAEK, NATHAN B. FETHKE, JEAN ROBILLARD, JOSEPH A.V. BUCKWALTER, PAMELA VILLACORTA
  • Publication number: 20240162225
    Abstract: A semiconductor device includes an active pattern having sharp corners. The semiconductor device includes a peripheral circuit including a substrate, a resistor device in the substrate, and an active pattern on the substrate. When viewed in a plan view, the active pattern includes corners in a serpentine shape, and first and second shapes of the corners are different from each other.
    Type: Application
    Filed: May 17, 2023
    Publication date: May 16, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Juseong MIN, Jae-Bok Baek, Taekkyu Yoon, Seungwook Choi, Jeehoon Han, Taeyoon Hong
  • Publication number: 20240161212
    Abstract: Disclosed are a guardian information-based animal integrated management server and an animal integrated management method thereof.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 16, 2024
    Inventors: Jong Ho Park, Jin Hyun Baek
  • Publication number: 20240157687
    Abstract: Provided is a polyethylene film having a multi-layer structure including an outer layer (A) including a first ethylene polymer having a density M1 of 0.935?M1?0.968; an intermediate layer (B) including a second ethylene polymer having a density M2 of 0.900?M2?0.920; and an inner layer (C) including a third ethylene polymer having a density M3 of 0.850?M3?0.905, wherein the outer layer (A), the intermediate layer (B), and the inner layer (C) are sequentially laminated to form the polyethylene film comprising the multi-layer structure, and wherein a falling ball impact strength per unit thickness and a puncture strength per unit thickness of the polyethylene film comprising the multi-layer structure are 3.0 to 15.0 g/?m and 0.2 to 0.4 N/?m, respectively, and a difference in melting point between the outer layer (A) and the inner layer (C) is 30 to 100° C.
    Type: Application
    Filed: June 7, 2022
    Publication date: May 16, 2024
    Inventors: Eunjung Baek, Soyoung Park, Daesig Hong, Joohyun Nam, Jaemyoung Son, Byoungcheon Jo
  • Publication number: 20240161239
    Abstract: In a method for designing a binary phase filter to expand depth of field and for reconstructing images performed by an electronic device according to an embodiment of the present disclosure, the method includes: obtaining images for each depth for a test image based on a binary phase structure set in the binary phase filter; obtaining reconstructed images for each depth by reconstructing the images for each depth based on a model trained to reconstruct an input image; calculating a loss value of the reconstructed images for each depth by comparing the reconstructed images for each depth with the test image; and updating the binary phase structure until the loss value becomes less than or equal to a predefined value.
    Type: Application
    Filed: October 20, 2023
    Publication date: May 16, 2024
    Inventors: Chulmin Joo, Baek Cheon Seong
  • Publication number: 20240162130
    Abstract: A semiconductor package includes a first redistribution wiring layer having first and second surfaces opposite to each other, the first redistribution wiring layer including a plurality of first redistribution wires and a plurality of landing pads electrically connected to the first redistribution wires, the plurality of landing pads exposed from the second surface, a second redistribution wiring layer disposed on the first surface of the first redistribution wiring layer, the second redistribution wiring layer including an insulating layer, a logic semiconductor chip provided in the insulating layer, second redistribution wires electrically connected to the logic semiconductor chip, and third redistribution wires electrically connected to the first redistribution wires, the third redistribution wires extending to penetrate the insulating layer, a third redistribution wiring layer disposed on the second redistribution wiring layer, the third redistribution wiring layer including fourth redistribution wires el
    Type: Application
    Filed: July 19, 2023
    Publication date: May 16, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kitae Park, Seungmin Baek, Joohyung Lee, Junghyun Cho