Abstract: A semiconductor device may include a memory cell array including a memory block including a plurality of memory strings connected between a plurality of bit lines and a common source line, a control circuit that generates a page buffer control signal, a voltage control signal, and a drive address signal, a page buffer group including a plurality of page buffers and configured to form each of the plurality of bit lines to a preset voltage level, and generate a threshold voltage variation result on the basis of a change in the voltage level of each of the plurality of bit lines, a voltage generation circuit that generates a threshold verification voltage and a pass voltage, and a line drive circuit that drives a plurality of select lines to a level of the threshold verification voltage, and drives a plurality of word lines to a level of the pass voltage, during the threshold voltage variation verification.

Abstract: The present technology relates to an electronic device. A memory device including a plurality of memory cells connected to a plurality of word lines arranged between a plurality of source select lines and a plurality of drain select lines, a peripheral circuit configured to perform a program operation of programming data in selected memory cells among the plurality of memory cells, and a program operation controller configured to control the peripheral circuit to apply a voltage, for turning on or off source select transistors connected to the plurality of source select lines, to the plurality of source select lines, while applying a pass voltage to the plurality of word lines after applying a program voltage to selected word lines connected to the selected memory cells.

Abstract: Provided herein may be a semiconductor memory device and a method of manufacturing the semiconductor memory device. The semiconductor memory device may include a stacked body including a plurality of interlayer insulating layers and a plurality of gate electrodes that are alternately stacked on a substrate, and a plurality of channel structures configured to vertically pass through the stacked body. Each of the plurality of channel structures may include a core insulating layer, a first channel layer, a second channel layer, a tunnel insulating layer, and a charge storage layer that extend vertically towards the substrate. Electron mobility of the first channel layer may be higher than electron mobility of the second channel layer.

Abstract: A memory device includes a page buffer, a voltage generator, and a test controller. The page buffer is connected to a memory cell through a bit line, and is configured to sense a threshold voltage of the memory cell through a potential of a sensing node electrically connected to the bit line. The voltage generator is configured to generate a test voltage to be applied to the sensing node. The test controller is configured to control the voltage generator to apply the test voltage to the sensing node, and detect a defect of the page buffer, based on a leakage current value of the sensing node.

Abstract: The present disclosure relates to a defect inspection device including: an imaging part that captures an image of a first frame having a predetermined width and a predetermined length along a width direction and a length direction of a test object, respectively; an image division part that divides the image of the first frame of the test object captured by the imaging part into a plurality of second frames smaller than the first frame along the width direction of the test object; a brightness calculation part that measures a brightness value of each of the plurality of the second frames, and calculates a defect determination value of the first frame based on the brightness values of the plurality of the second frames; and a control part that determines a line defect existing along the length direction of the test object based on the calculated defect determination value of the first frame.

Abstract: A memory device includes a plurality of memory cell strings, a peripheral circuit, and control logic. The plurality of memory cell strings are connected between a bit line and a common source line. The peripheral circuit is configured to perform a channel precharge operation and a program operation for the plurality of memory cell strings. The control logic is configured to control the peripheral circuit to apply a pass voltage to a selected word line among a plurality of word lines connected to the plurality of memory cell strings and to apply a turn-on voltage to a source select line connected to the plurality of memory cell strings, during a portion of a period in which the pass voltage is applied to the selected word line, in the program operation.

Abstract: A memory device capable of reducing a peak current includes a plurality of memory cell strings each including a plurality of memory cells connected between a common source line and a bit line, a source select line connected between the common source line and the plurality of memory cells, and a drain select line connected between the bit line and the plurality of memory cells. A method for operating the memory device includes: precharging channel regions of a plurality of memory cell strings through a common source line; and setting a bit line voltage applied to the bit line, after starting precharging the channel regions of the plurality of memory cell strings, while the channel regions of the plurality of memory cell strings are being precharged.

Abstract: There are provided a memory device and an operating method thereof. The memory device includes: a memory block including a plurality of memory cells and a plurality of select transistors; a peripheral circuit for performing a program operation on selected select transistors among the plurality of select transistors in a select transistor program operation; and a control logic for controlling the peripheral circuit to perform the select transistor program operation. The peripheral circuit applies a coupling voltage having a positive potential to a source line of the memory block in the select transistor program operation.

Abstract: The present technology relates to an electronic device. For example, the present technology relates to a memory device and a method of operating the memory device. A memory device according to an embodiment includes a memory cell, a page buffer, and a test performer configured to control the page buffer to sequentially apply a first test voltage and a second test voltage of a level lower than a level of the first test voltage to a sensing node of the page buffer through a bit line, and detect a defect of the sensing node according to whether a potential level of the sensing node is changed.

Abstract: Provided herein is a semiconductor memory device and a method of operating the same. The semiconductor memory device includes a memory block, a peripheral circuit, and a control logic. The memory block includes a plurality of sub-blocks coupled to a plurality of source select lines, respectively. The peripheral circuit performs a program operation on the memory block. The control logic is configured to control the peripheral circuit to increase a voltage of a common source line that is coupled to the memory block, increase a voltage of at least one source select line, among the plurality of source select lines, to a first voltage level, and set a voltage of a bit line that is coupled to the memory block and increase the voltage of at least one source select line from the first voltage level to a second voltage level.

Abstract: Provided is a device for detecting a defect of an optical film, comprising a light emitting unit, a reflection unit, a screen, and an image capturing unit, and a method for detecting a defect of an optical film, comprising emitting light to a reflection unit, projecting the light reflected by the reflection unit onto an optical film, capturing an image of a screen which displays a projection shape obtained by projecting the light onto the optical film, and analyzing the image.

Abstract: Provided herein may be a semiconductor memory device and a method of manufacturing the semiconductor memory device. The semiconductor memory device may include a stacked body including a plurality of interlayer insulating layers and a plurality of gate electrodes that are alternately stacked on a substrate, and a plurality of channel structures configured to vertically pass through the stacked body. Each of the plurality of channel structures may include a core insulating layer, a first channel layer, a second channel layer, a tunnel insulating layer, and a charge storage layer that extend vertically towards the substrate. Electron mobility of the first channel layer may be higher than electron mobility of the second channel layer.

Abstract: There are provided a memory device and an operating method thereof. The memory device includes: a memory block including a plurality of memory cells and a plurality of select transistors; a peripheral circuit for performing a program operation on selected select transistors among the plurality of select transistors in a select transistor program operation; and a control logic for controlling the peripheral circuit to perform the select transistor program operation. The peripheral circuit applies a coupling voltage having a positive potential to a source line of the memory block in the select transistor program operation.

Abstract: A memory device includes a page buffer, a voltage generator, and a test controller. The page buffer is connected to a memory cell through a bit line, and is configured to sense a threshold voltage of the memory cell through a potential of a sensing node electrically connected to the bit line. The voltage generator is configured to generate a test voltage to be applied to the sensing node. The test controller is configured to control the voltage generator to apply the test voltage to the sensing node, and detect a defect of the page buffer, based on a leakage current value of the sensing node.

Abstract: The present technology relates to an electronic device. For example, the present technology relates to a memory device and a method of operating the memory device. A memory device according to an embodiment includes a memory cell, a page buffer, and a test performer configured to control the page buffer to sequentially apply a first test voltage and a second test voltage of a level lower than a level of the first test voltage to a sensing node of the page buffer through a bit line, and detect a defect of the sensing node according to whether a potential level of the sensing node is changed.

Abstract: Provided herein may be a memory device and a method of operating the same. The memory device may include a memory cell array, a plurality of page buffer groups, and a program operation controller. The memory cell array may include a plurality of memory cells. The page buffer groups may be coupled to the plurality of memory cells through a plurality of bit line groups, and may be configured to perform bit line precharge operations on the plurality of bit line groups. The program operation controller may be configured to control the plurality of page buffer groups to perform the bit line precharge operations initiated at different time points during a program operation on the plurality of memory cells, and to adjust an interval between initiation time points of the bit line precharge operations depending on a progress of the program operation.

Abstract: A memory device capable of reducing a peak current includes a plurality of memory cell strings each including a plurality of memory cells connected between a common source line and a bit line, a source select line connected between the common source line and the plurality of memory cells, and a drain select line connected between the bit line and the plurality of memory cells. A method for operating the memory device includes: precharging channel regions of a plurality of memory cell strings through a common source line; and setting a bit line voltage applied to the bit line, after starting precharging the channel regions of the plurality of memory cell strings, while the channel regions of the plurality of memory cell strings are being precharged.

Abstract: A memory device includes a plurality of memory cell strings, a peripheral circuit, and control logic, The plurality of memory cell strings are connected between a bit line and a common source line. The peripheral circuit is configured to perform a channel precharge operation and a program operation for the plurality of memory cell strings. The control logic is configured to control the peripheral circuit to apply a pass voltage to a selected word line among a plurality of word lines connected to the plurality of memory cell strings and to apply a turn-on voltage to a source select line connected to the plurality of memory cell strings, during a portion of a period in which the pass voltage is applied to the selected word line, in the program operation.

Abstract: Provided herein is a semiconductor memory device and a method of operating the same, The semiconductor memory device includes a memory block, a peripheral circuit, and a control logic. The memory block includes a plurality of sub-blocks coupled to a plurality of source select lines, respectively. The peripheral circuit performs a program operation on the memory block. The control logic is configured to control the peripheral circuit to increase a voltage of a common source line that is coupled to the memory block, increase a voltage of at least one source select line, among the plurality of source select lines, to a first voltage level, and set a voltage of a bit line that is coupled to the memory block and increase the voltage of at least one source select line from the first voltage level to a second voltage level.

Abstract: The present disclosure relates to a system and a method of detecting a defect of an optical film, and more particularly, to a system and a method of detecting a defect of an optical film, which obtain an image of a defect of an optical film projected onto a screen and detect the defect of the optical film. As an exemplary embodiment of the present disclosure, a system for detecting a defect of an optical film may be provided.