Patents by Inventor In-Hyung Jung
In-Hyung Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220085485Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.Type: ApplicationFiled: November 29, 2021Publication date: March 17, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ji Hyung JUNG, Sung Yong AN
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Patent number: 11253524Abstract: The present invention provides metabolites of the antiviral drug bictegravir, including compositions and salts thereof, which are useful in the prevention and/or treatment of HIV as well as analytical methods related to the administration of bictegravir.Type: GrantFiled: January 18, 2019Date of Patent: February 22, 2022Assignee: Gilead Sciences, Inc.Inventors: Haolun Jin, Hyung-Jung Pyun, Bill J. Smith, Raju Subramanian, Jianhong Wang
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Patent number: 11251518Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.Type: GrantFiled: March 24, 2020Date of Patent: February 15, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo Kim, Sung Yong An, Ji Hyung Jung, Jae Yeong Kim, Ju Hyoung Park, Sung Nam Cho
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Publication number: 20220029274Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: ApplicationFiled: October 12, 2021Publication date: January 27, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
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Patent number: 11223133Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: GrantFiled: February 27, 2020Date of Patent: January 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Yeong Kim, Chin Mo Kim, Ji Hyung Jung, Sung Nam Cho, Sung Yong An
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Patent number: 11223100Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: GrantFiled: January 2, 2020Date of Patent: January 11, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Nam Cho, Sung Yong An, Ji Hyung Jung, Chin Mo Kim
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Patent number: 11213523Abstract: Compounds for use in the treatment of human immunodeficiency virus (HIV) infection are disclosed. The compounds have the following Formula (I): including stereoisomers and pharmaceutically acceptable salts thereof, wherein L, R1, R5, W, X, Y1, Y2, and Z are as defined herein. Methods associated with preparation and use of such compounds, as well as pharmaceutical compositions comprising such compounds, are also disclosed.Type: GrantFiled: September 16, 2019Date of Patent: January 4, 2022Assignee: Gilead Sciences, Inc.Inventors: Manoj C. Desai, Mingzhe Ji, Haolun Jin, Hyung-Jung Pyun, Teresa Alejandra Trejo Martin
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Patent number: 11211689Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.Type: GrantFiled: January 9, 2020Date of Patent: December 28, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ji Hyung Jung, Sung Yong An
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Patent number: 11205539Abstract: A coil component includes a coil and external electrodes electrically connected to the coil. The coil may include a plurality of coil patterns. A distal end of an outermost coil pattern may include a gap filling portion. A through via directly connected to an innermost coil pattern may also include a gap filling portion.Type: GrantFiled: May 17, 2018Date of Patent: December 21, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ji Hyung Jung, Boum Seock Kim, Kang Wook Bong
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Publication number: 20210384633Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: ApplicationFiled: September 1, 2021Publication date: December 9, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
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Patent number: 11185984Abstract: A method and an apparatus for controlling a robot are provided. According to one aspect of the present disclosure, the method can include receiving information on a work type of robot motion performed by the robot; generating workflow of the robot motion based upon the received information on the work type of the robot motion; measuring information on work environment in which the robot motion is performed in accordance with the work type and the workflow of the robot motion by controlling the robot; receiving work information on the robot motion in accordance with the work type and the workflow of the robot motion by controlling the robot; and performing the robot motion in accordance with the work type and the workflow of the robot motion by controlling the robot based upon the measured information on the work environment and the received work information on the robot motion.Type: GrantFiled: October 14, 2016Date of Patent: November 30, 2021Assignee: DOOSAN ROBOTICS INC.Inventors: Hyung Jung Kim, June Hyun Jang, Sang Hoon Lee
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Publication number: 20210339281Abstract: According to one embodiment, a tactile actuator can comprise: a housing having an accommodation space therein; a cap covering at least a portion of the accommodation space; a vibration unit disposed inside the accommodation space; an elastic member for connecting the housing and the vibration unit such that the vibration unit can vibrate with respect to the housing; a coil for forming a magnetic field to drive the vibration unit; and a control unit for determining any one driving mode on the basis of collected driving information from among a plurality of preset driving modes and determining, according to the driving mode, the characteristic of a current to be applied to the coil.Type: ApplicationFiled: July 16, 2021Publication date: November 4, 2021Inventors: Hyeong Jun KIM, Jong Hun LEE, Jeong Bum LEE, Ji Goo KANG, Jong Hyung JUNG
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Publication number: 20210296978Abstract: A tactile actuator, according to one embodiment, may comprise: a housing defining an accommodation space therein; an upper case for covering the upper part of the accommodation space; a vibration unit arranged inside the accommodation space; an upper elastic member connecting the upper side of the housing and the vibration unit; a lower elastic member for connecting the lower side of the housing and the vibration unit; and a coil for forming a magnetic field to drive the vibration unit, wherein one end of the upper elastic member may be fixed to a position on a side wall of the housing that is apart from the upper case.Type: ApplicationFiled: June 2, 2021Publication date: September 23, 2021Inventors: Hyeong Jun KIM, Jong Hyung JUNG, Jong Hun LEE, Nam Seok KIM
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Patent number: 11123767Abstract: According to one embodiment, a tactile actuator can comprise: a housing having an accommodation space therein; a cap covering at least a portion of the accommodation space; a vibration unit disposed inside the accommodation space; an elastic member for connecting the housing and the vibration unit such that the vibration unit can vibrate with respect to the housing; a coil for forming a magnetic field to drive the vibration unit; and a control unit for determining any one driving mode on the basis of collected driving information from among a plurality of preset driving modes and determining, according to the driving mode, the characteristic of a current to be applied to the coil.Type: GrantFiled: June 21, 2016Date of Patent: September 21, 2021Assignee: CK MATERIALS LAB CO., LTD.Inventors: Hyeong Jun Kim, Jong Hun Lee, Jeong Bum Lee, Ji Goo Kang, Jong Hyung Jung
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Patent number: 11119622Abstract: A window expansion method is provided. The method includes detecting an occurrence of an expansion event for expanding a window area, and expanding the window area based on the expansion event. An electronic device is also provided, the electronic device including a display that includes a window area for displaying data and a non-window area, and at least one processor configured to expand the window area based on an expansion event for an expansion of the window area when the expansion event occurs.Type: GrantFiled: November 23, 2018Date of Patent: September 14, 2021Assignee: Samsung Electronics Co., Ltd.Inventors: Jong-Min Kim, Bu-Sic Koag, Joo-Yong Kim, In-Hyung Jung
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Publication number: 20210251957Abstract: This application relates generally to certain substituted pyrrolizine compounds, and pharmaceutical compositions which inhibit HBV replication, and methods of making and using them.Type: ApplicationFiled: November 4, 2020Publication date: August 19, 2021Inventors: Jinfa DU, Joshua A. KAPLAN, Thorsten A. KIRSCHBERG, Tetsuya KOBAYASHI, Scott E. LAZERWITH, Rick Andrew LEE, Jonathan William MEDLEY, Michael L. MITCHELL, Philip Anthony MORGANELLI, Hyung-Jung PYUN, Sophia L. SHEVICK, Neil H. SQUIRES, William J. WATKINS
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Publication number: 20210249852Abstract: An energy storage system (ESS) protection system includes: a battery monitoring system (BMS) configured to transmit a protection signal when an internal state or an external state of a battery cell is abnormal; a power conversion system (PCS) connected to the BMS through a hard wire, and configured to receive the protection signal through the hard wire; and an energy management system (EMS) connected between the BMS and the PCS through a universal communication line, and configured to receive the protection signal from the BMS and transmit the protection signal to the PCS. The PCS may be configured to perform an ESS shutdown when the PCS receives the protection signal through the hard wire or the universal communication line.Type: ApplicationFiled: December 30, 2020Publication date: August 12, 2021Inventors: Jae Hyung JUNG, Suk Ki KIM, Dong Ki HONG
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Patent number: 11084832Abstract: Compounds for use in treating or preventing human immunodeficiency virus (HIV) infection are disclosed. The compounds have the following formula (I): including stereoisomers and pharmaceutically acceptable salts thereof, wherein R1, R2, L, W1, W2, X, Y, and Z are as defined herein. Methods associated with the preparation and use of such compounds, as well as pharmaceutical compositions comprising such compounds, are also disclosed.Type: GrantFiled: March 20, 2020Date of Patent: August 10, 2021Assignee: Gilead Sciences, Inc.Inventors: Hang Chu, Ana Z. Gonzalez Buenrostro, Hongyan Guo, Xiaochun Han, Lan Jiang, Jiayao Li, Michael L. Mitchell, Hyung-Jung Pyun, Scott D. Schroeder, Gregg M. Schwarzwalder, Nathan D. Shapiro, Devleena M. Shivakumar, Qiaoyin Wu, Hong Yang, Jennifer R. Zhang
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Patent number: 11069954Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).Type: GrantFiled: February 12, 2020Date of Patent: July 20, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chin Mo Kim, Jae Yeong Kim, Sung Yong An, Sung Nam Cho, Ji Hyung Jung
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Patent number: 11056960Abstract: A tactile actuator, according to one embodiment, may comprise: a housing defining an accommodation space therein; an upper case for covering the upper part of the accommodation space; a vibration unit arranged inside the accommodation space; an upper elastic member connecting the upper side of the housing and the vibration unit; a lower elastic member for connecting the lower side of the housing and the vibration unit; and a coil for forming a magnetic field to drive the vibration unit, wherein one end of the upper elastic member may be fixed to a position on a side wall of the housing that is apart from the upper case.Type: GrantFiled: November 8, 2017Date of Patent: July 6, 2021Assignee: CK MATERIALS LAB CO., LTD.Inventors: Hyeong Jun Kim, Jong Hyung Jung, Jong Hun Lee, Nam Seok Kim