Abstract: A semiconductor device may comprise: a plurality of lower electrodes which are on a substrate; a first electrode support which is between adjacent lower electrodes and comprises a metallic material; a dielectric layer which is on the lower electrodes and the first electrode support to extend along profiles of the first electrode support and each of the lower electrodes; and an upper electrode which is on the dielectric layer.

Abstract: A vehicle moving apparatus may include a housing extending in a first direction; an elevator coupled to the housing to be movable in the first direction and another direction opposite thereto, extending in a third direction and being inserted to be drawable into an underside space of a vehicle, and configured to lift or lower a wheel of the vehicle; and a wheel assembly coupled to the elevator and configured to move the housing and the elevator in a direction toward the vehicle or in a direction opposite the vehicle, wherein the wheel assembly includes a wheel rotatably provided with a vertical direction as an axis, and configured to movably support the elevator; and an actuator coupled to the wheel and configured to provide power for rotating the wheel, wherein the wheel is rotatable such that a diameter of the wheel is aligned between the first and third directions.

Abstract: The present invention relates to a method for generating an alarm pertaining to continuous biometric data and, more specifically, to an alarm generation method in which, if an alarm condition is satisfied, an alarm is output to a user while maintaining the alarm in an activated state during a set alarm period, and changing the alarm type selected by the user during the alarm period, thereby enabling the user to be prompted to input information or take an action in response to the alarm without ignoring the alarm, while not causing inconvenience to the user due to frequent alarms; and when the alarm condition is satisfied, an operating mode of a receiver is determined and the alarm type, which has been set in accordance with the alarm condition, is changed to an alarm type corresponding to the operating mode of the receiver, thereby making it possible to prevent an alarm from being generated against the user's wishes.

Abstract: A service identifying and processing method using a wireless terminal message according to an exemplary embodiment of the present invention includes (a) receiving a wireless terminal message by a first entity which is a mobile device; and (b) expressing, by a first agent which is an information processing application program installed on the first entity, entity information of second entity based on the wireless terminal message and service confirmation information related to service provided by the second entity, through an application screen by the first agent.

Abstract: Disclosed is an apparatus and method for performing deep learning operations. The apparatus includes a systolic array comprising multiplier accumulator (MAC) units, and a control circuit configured to control an operation of a multiplexer connected to at least one of the MAC units and operations of the MAC units according to a plurality of operation modes.

Abstract: Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 ?m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Abstract: Disclosed is a positive electrode material for a lithium secondary battery. The positive electrode material includes a positive electrode active material formed of Li—[Mn—Ti]-M-O-based material including a transition metal (M) to enable reversible intercalation and deintercalation of lithium and molybdenum oxide. The positive electrode active material is coated with the molybdenum oxide to form a coating layer on a surface thereof.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: Provided is a strain sensor. The strain sensor according to embodiments of the inventive concept includes a flexible substrate, rigid patterns on the flexible substrate, the rigid patterns including a first pattern and a second pattern spaced apart from the first pattern in a first direction, a first electrode on the first pattern, a second electrode on the second pattern, the second electrode being spaced apart from the first electrode, and a piezoresistive layer connecting the first electrode and the second electrode. Here, each of the rigid patterns may have a stiffness greater than that of the flexible substrate.

Abstract: A bitline sense amplifier including: an amplifier which is connected between a first sensing bitline and a second sensing bitline, and detects and amplifies a voltage difference between a first bitline and a second bitline in response to a first control signal and a second control signal; and an equalizer which is connected between a first supply line through which the first control signal is supplied and a second supply line through which the second control signal is supplied, and pre-charges the first bitline and the second bitline with a precharge voltage in response to an equalizing control signal, wherein the equalizer includes an equalizing enable transistor in which a source terminal is connected to the first supply line and performs equalizing in response to the equalizing control signal.

Abstract: A pedal for a bicycle is disclosed. The pedal for a bicycle comprises a case which can rotate about a spindle; a top plate which is connected to the case by a pivot shaft and can rotate about the pivot shaft; a displacement generating assembly which is disposed in the case and is connected to the case and the top plate so as to generate displacement according to the rotation of the top plate; and a sensing unit which is connected to the displacement generating assembly so as to sense the displacement.

Abstract: A battery cell cartridge in which a battery cell is accommodated, includes first, second, third and fourth frames formed in a quadrangular shape, wherein the first frame and the second frame extend along a horizontal direction and are spaced from each other at a predetermined interval therebetween, the first frame is positioned on an upper side and the second frame is positioned on a lower side, the third frame and the fourth frame extend along a vertical direction and are spaced from each other at a predetermined interval therebetween, and the third frame is positioned on a first side and the third frame is positioned on a second side opposite to the second frame.

Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.

Abstract: A pixel including: a light emitting element; a first transistor connected between a first power source and a second node; a first capacitor connected to a first node or a second node and a third node; a second transistor between the third node and a data line, the second transistor turned on by a first scan signal; a third transistor between the first and second nodes, the third transistor turned on by a second scan signal; a fifth transistor between the first power source and the first transistor, the fifth transistor turned on by a first emission control signal; a sixth transistor between the second node and the light emitting element, the sixth transistor turned on by a second emission control signal; and an eighth transistor between the second node and a second emission control line, the eighth transistor turned on by a fourth scan signal.

Abstract: An atomic layer deposition method for manufacturing a platinum-based alloy catalyst includes applying a support in a reactor and depositing an alloy of platinum and a non-platinum metal on the support through a super cycle comprising a first sub-cycle and a second sub-cycle.

Abstract: A sensing block includes a block body having a plurality of slots through which electrode leads of battery cells pass, a plurality of sensing terminals installed between the plurality of slots on a front surface of the block body, a circuit board installed on the front surface of the block body, and a connector installed on the circuit board.

Abstract: A semiconductor device includes a lower channel pattern and an upper channel pattern stacked on a substrate in a first direction perpendicular to a top surface of the substrate, lower source/drain patterns on the substrate and at a first side and a second side of the lower channel pattern, upper source/drain patterns stacked on the lower source/drain patterns and at a third side and a fourth side of the upper channel pattern, a first barrier pattern between the lower source/drain patterns and the upper source/drain patterns, and a second barrier pattern between the first barrier pattern and the upper source/drain patterns. The first barrier pattern includes a first material and the second barrier pattern includes a second material, wherein the first material and the second material are different.

Abstract: A light emitting element includes a first semiconductor layer, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, and an insulating layer enclosing the first semiconductor layer, the active layer, and at least a portion of the second semiconductor layer. The first semiconductor layer, the active layer, and the second semiconductor layer are successively disposed in a first direction. The active layer includes a first barrier layer, a second barrier layer, and a first well layer disposed between the first barrier layer and the second barrier layer, and including a non-uniform indium composition ratio in a first direction and a second direction intersecting the first direction, and including a non-uniform indium density in a third direction intersecting the first direction and the second direction.

Abstract: An electrified vehicle includes: a battery; a motor drive device configured to drive a motor through an inverter, based on a voltage of the battery; and a battery controller configured to determine whether to perform output limiting on the battery, based on whether a ratio of regenerative braking is less than or equal to a preset ratio, wherein the ratio of regenerative braking is varied according to an amount of charging of the battery and an amount of discharging of the battery within a preset time interval, and adjust, based on the output limiting being performed on the battery, a derate ratio associated with a battery output limit value.

Abstract: A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.