Patents by Inventor In Kyeong Choi

In Kyeong Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11935703
    Abstract: A multilayer electronic component has a body and a non-conductive resin layer. The non-conductive resin layer includes a body cover portion disposed in a region of an external surface of the body in which an electrode layer of an external electrode is not disposed, and an extending portion extending from the body cover portion between the electrode layer and a conductive resin layer of the external electrode, to thereby suppress arc discharge, improve bending strength, and improve moisture resistance.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Bon Seok Koo, Chang Hak Choi, Il Ro Lee, Byung Woo Kang, San Kyeong, Hae Sol Kang
  • Patent number: 11926127
    Abstract: Disclosed is a window film for a display device including a light transmitting substrate including a polyamide including a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a hard coating layer laminated on one surface of the light transmitting substrate: in Chemical Formula 1 and Chemical Formula 2, each of A1, A2, B, and D is the same as defined in the detailed description.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: March 12, 2024
    Assignees: SAMSUNG ELECTRONICS CO., LTD., SAMSUNG SDI CO., LTD.
    Inventors: Chanjae Ahn, Sun Jin Song, Won Suk Chang, Boreum Jeong, A Ra Jo, Kyeong-Sik Ju, Sungwon Choi
  • Patent number: 11912760
    Abstract: Described herein are doppel-targeting molecules (e.g., antibodies) useful for inhibiting pathological angiogenesis and treating diseases and conditions associated with pathological angiogenesis, such as tumors, cancers, atherosclerosis, tuberculosis, asthma, pulmonary arterial hypertension (PAH), neoplasms and neoplasm-related conditions, and for detecting doppel expression in a subject. Related compositions and methods also are described.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: February 27, 2024
    Assignee: PHAROSGEN CO., LTD
    Inventors: Youngro Byun, Ha Kyeong Lee, So Young Choi, So Ra Park, Se Ra Lee, Seung Il Baek
  • Publication number: 20240028875
    Abstract: Provided are a method and apparatus for performing a convolution operation for optimizing the arithmetic intensity of device.
    Type: Application
    Filed: July 19, 2023
    Publication date: January 25, 2024
    Applicant: NOTA, INC.
    Inventors: Shin Kook CHOI, Jun Kyeong CHOI
  • Publication number: 20230307129
    Abstract: Disclosed are a training data generation device, a method for driving the same, and a computer-readable recording medium. The training data generation device according to an embodiment of the present inventive concept includes a data receiver configured to receive, as a feedback, a training result output by applying, to a learning model, medical data generated by pre-processing an assigned amount of pathological images; and a controller configured to secure training data for artificial intelligence (AI) or image analysis by correcting medical data of pathological images having errors checked based on the training result received as a feedback, and then reapplying the corrected medical data to the learning model.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 28, 2023
    Inventors: Tae Gyoun LEE, Boo Kyeong CHOI, Jae Hong SO
  • Publication number: 20230118400
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Application
    Filed: October 31, 2022
    Publication date: April 20, 2023
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Patent number: 11488934
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: November 1, 2022
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Publication number: 20220339191
    Abstract: The invention is directed to an isolated population of mammal cells comprising about 75% or higher B-1a regula e PBS-treated tory cells expressing the cell surface inhibitory receptors lympho-cyte-activation gene 3 (LAG-3), programmed cell death protein 1 (PD-1), and C-X-C chemokine receptor type 4 (CXCR4), and secreting interleukin-27 (IL-27). The invention is also directed to methods of preparing and using the cell population to suppress the immune system and/or to treat or prevent diseases.
    Type: Application
    Filed: June 18, 2020
    Publication date: October 27, 2022
    Applicant: The United States of America,as represented by the Secretary,Department of Health and Human Services
    Inventors: Charles E. Egwuagu, Jin Kyeong Choi
  • Patent number: 11377540
    Abstract: Disclosed are a coupling agent for a rubber composition and a rubber composition for a tire containing the same. The rubber composition according to the present disclosure contains a coupling agent that may induce interactions between a rubber as a raw material and carbon black, thereby improving dispersibility of the carbon black in the rubber composition. Thus, a tire with low rolling-resistance and excellent wear resistance may be realized.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: July 5, 2022
    Assignee: OCI COMPANY LTD.
    Inventors: Yong-Jin Jeon, Jae-Seok Lee, Seock-Kyeong Choi
  • Patent number: 11323164
    Abstract: An operation method of a first AN for a hybrid beamforming-based cooperative transmission in a C-RAN includes obtaining a spatial channel covariance with terminals subject to a service; selecting a set of terminals to be serviced from among the terminals subject to the service; determining a radio frequency (RF) precoding matrix by which interference between the terminals to be serviced is minimized; transferring information on the determined RF precoding matrix to a centralized processor (CP); and generating an effective channel by configuring an RF precoder based on the determined RF precoding matrix.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: May 3, 2022
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seung Eun Hong, In Kyeong Choi, Tae Gyun Noh
  • Publication number: 20210217725
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Application
    Filed: December 21, 2020
    Publication date: July 15, 2021
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Patent number: 11038559
    Abstract: Disclosed are methods for transmitting and receiving beamforming-based signals in a communication system. An operation method of a terminal may comprise transmitting capability information of the terminal to an AN; receiving first configuration information of a network cluster configured based on the capability information from the AN; transmitting an SRS in a beamforming scheme through resources indicated by the first configuration information; receiving second configuration information of a user cluster configured based on a measurement result of the SRS from the AN; and performing cooperative communication with ANs belonging to the user cluster, which are indicated by the second configuration information. Accordingly, the performance of the communication system can be improved.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: June 15, 2021
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Min Hyun Kim, Tae Gyun Noh, In Kyeong Choi, Seung Eun Hong
  • Publication number: 20210126682
    Abstract: An operation method of a first AN for a hybrid beamforming-based cooperative transmission in a C-RAN includes obtaining a spatial channel covariance with terminals subject to a service; selecting a set of terminals to be serviced from among the terminals subject to the service; determining a radio frequency (RF) precoding matrix by which interference between the terminals to be serviced is minimized; transferring information on the determined RF precoding matrix to a centralized processor (CP); and generating an effective channel by configuring an RF precoder based on the determined RF precoding matrix.
    Type: Application
    Filed: October 13, 2020
    Publication date: April 29, 2021
    Inventors: Seung Eun HONG, In Kyeong CHOI, Tae Gyun NOH
  • Patent number: 10872879
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: December 22, 2020
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi
  • Patent number: 10833736
    Abstract: A hybrid beamforming based cooperative transmission system may comprise comprising a centralized processor (CP), access nodes (ANs) connected to the CP, and fronthaul links connecting the CP to the ANs. The CP may provide an outer precoding matrix for a first AN of the ANs, which is derived from global statistical channel state information (CSI) generated from local statistical CSI collected from the ANs, to the first AN via the fronthaul link; and the first AN may configure a radio frequency (RF) precoder of the first AN based on the outer precoding matrix, and configure a digital precoder of the first AN based on local instantaneous effective CSI between the first AN and first terminals to be served by the first AN.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: November 10, 2020
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Seung Eun Hong, Min Hyun Kim, Tae Gyun Noh, In Kyeong Choi
  • Publication number: 20200177242
    Abstract: Disclosed are methods for transmitting and receiving beamforming-based signals in a communication system. An operation method of a terminal may comprise transmitting capability information of the terminal to an AN; receiving first configuration information of a network cluster configured based on the capability information from the AN; transmitting an SRS in a beamforming scheme through resources indicated by the first configuration information; receiving second configuration information of a user cluster configured based on a measurement result of the SRS from the AN; and performing cooperative communication with ANs belonging to the user cluster, which are indicated by the second configuration information. Accordingly, the performance of the communication system can be improved.
    Type: Application
    Filed: November 21, 2019
    Publication date: June 4, 2020
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Min Hyun KIM, Tae Gyun NOH, In Kyeong CHOI, Seung Eun HONG
  • Publication number: 20200169301
    Abstract: A hybrid beamforming based cooperative transmission system may comprise comprising a centralized processor (CP), access nodes (ANs) connected to the CP, and fronthaul links connecting the CP to the ANs. The CP may provide an outer precoding matrix for a first AN of the ANs, which is derived from global statistical channel state information (CSI) generated from local statistical CSI collected from the ANs, to the first AN via the fronthaul link; and the first AN may configure a radio frequency (RF) precoder of the first AN based on the outer precoding matrix, and configure a digital precoder of the first AN based on local instantaneous effective CSI between the first AN and first terminals to be served by the first AN.
    Type: Application
    Filed: November 22, 2019
    Publication date: May 28, 2020
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Seung Eun HONG, Min Hyun KIM, Tae Gyun NOH, In Kyeong CHOI
  • Publication number: 20200102447
    Abstract: Disclosed are a coupling agent for a rubber composition and a rubber composition for a tire containing the same. The rubber composition according to the present disclosure contains a coupling agent that may induce interactions between a rubber as a raw material and carbon black, thereby improving dispersibility of the carbon black in the rubber composition. Thus, a tire with low rolling-resistance and excellent wear resistance may be realized.
    Type: Application
    Filed: September 25, 2019
    Publication date: April 2, 2020
    Inventors: Yong-Jin JEON, Jae-Seok Lee, Seock-Kyeong Choi
  • Patent number: 10388582
    Abstract: A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a non-limiting example embodiment, the method may comprise forming an interposer on a wafer, forming at least one reinforcement member on the interposer, coupling and electrically connecting at least one semiconductor die to the interposer to the interposer, filling a region between the semiconductor die and the interposer with an underfill, and encapsulating the reinforcement member, the semiconductor die and the underfill on the interposer using an encapsulant.
    Type: Grant
    Filed: April 5, 2018
    Date of Patent: August 20, 2019
    Assignee: AMKOR TECHNOLOGY, INC.
    Inventors: Young Rae Kim, Won Chul Do, Ji Hun Lee, Min Hwa Chang, Dong Hyun Kim, Wang Gu Lee, Jin Ryang Hwang, Mi Kyeong Choi
  • Patent number: 10163867
    Abstract: A semiconductor package and a method of manufacturing a semiconductor package. As a non-limiting example, various aspects of this disclosure provide a semiconductor package, and method of manufacturing thereof, that comprises shielding on multiple sides thereof.
    Type: Grant
    Filed: January 15, 2018
    Date of Patent: December 25, 2018
    Assignee: Amkor Technology, Inc.
    Inventors: Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee, Yung Woo Lee, Mi Kyeong Choi