Patents by Inventor Inessa Obenhuber, legal representative

Inessa Obenhuber, legal representative has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low profile discrete electronic components and applications of same
    Patent number: 8324727
    Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: December 4, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, William F. Wiedemann, Thomas J. Obenhuber, Inessa Obenhuber, legal representative
  • Multi-surface IC packaging structures and methods for their manufacture
    Patent number: 7919355
    Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
    Type: Grant
    Filed: May 12, 2010
    Date of Patent: April 5, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas J. Obenhuber, Inessa Obenhuber, legal representative, Kevin P. Grundy
  • Multi-surface IC packaging structures and methods for their manufacture
    Patent number: 7737545
    Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
    Type: Grant
    Filed: February 13, 2006
    Date of Patent: June 15, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas J. Obenhuber, Inessa Obenhuber, legal representative, Kevin P. Grundy
  • Multi-surface contact IC packaging structures and assemblies
    Patent number: 7732904
    Abstract: A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: June 8, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Joseph C. Fjelstad, Para K. Segaram, Thomas J. Obenhuber, Inessa Obenhuber, legal representative, Kevin P. Grundy, William F. Wiedemann
  • Low profile discrete electronic components and applications of same
    Patent number: 7701323
    Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: April 20, 2010
    Assignee: Interconnect Portfolio LLC
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, William F. Wiedemann, Thomas J. Obenhuber, Inessa Obenhuber, legal representative
  • Partitioned integrated circuit package with central clock driver
    Patent number: 7279783
    Abstract: Disclosed are IC partitioned packaging and interconnection constructions that provide for improved distribution of power, ground, cross chip interconnections and clocks.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: October 9, 2007
    Assignee: Silicon Pipe, Inc.
    Inventors: Joseph C. Fjelstad, Kevin P. Grundy, Para K. Segaram, Inessa Obenhuber, legal representative, Thomas J. Obenhuber, deceased
  • Refinement of a search query based on information stored on a local storage medium
    Patent number: 7240052
    Abstract: The generation a search query based on information stored on a storage medium is described. According to one embodiment of the invention, search criteria is entered to perform a search of a storage medium of a client computer. The search of the storage medium determines a web search criteria. The client computer provides search results based on the web search criteria.
    Type: Grant
    Filed: September 3, 2004
    Date of Patent: July 3, 2007
    Assignee: IAC Search & Media, Inc.
    Inventors: Jeffrey Alan Joseph Sidlosky, Creighton W. Chong, Inessa Obenhuber, legal representative, Para Kanagasabai Segaram, Thomas J. Obenhuber, deceased
  • Multi-surface IC packaging structures and methods for their manufacture
    Patent number: 7061096
    Abstract: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: June 13, 2006
    Assignee: Silicon Pipe, Inc.
    Inventors: Joseph C Fjelstad, Para K. Segaram, Inessa Obenhuber, legal representative, Kevin P. Grundy, Thomas J. Obenhuber, deceased