Abstract: A method of providing connections to an arrangement of multilayer transducer elements of an ultrasonic transducer array includes patterning an electrically conductive layer on a substrate to define a number of traces and a wide-area continuous region. At least a portion of the substrate is then removed to expose both of the upper and lower surfaces of the wide-area conductive region. The exposed upper and lower surfaces are captured between first and second piezoelectric layers such that the conductive layer electrically contacts both of the piezoelectric layers. The captured wide-area continuous region and at least one of the piezoelectric layers are diced to define the array of transducer elements. The traces that are formed during the patterning step are arranged such that there is a one-to-one correspondence between the traces and the electrodes that are defined by segmenting the wide-area continuous region during the dicing step.