Abstract: A method of manufacturing a hard-to-weld material by a beam-assisted additive manufacturing process is presented. The method includes depositing a first layer for the material onto the substrate, the first layer including a major fraction of a base material for the component and a minor fraction of a solder, depositing a second layer of the base material for the component and a thermal treatment of the layer arrangement. The thermal treatment includes a first thermal cycle at a first temperature above 1200° C. for a duration of more than 3 hours, a subsequent second thermal cycle at a second temperature above 1000° C. for more than 2 hours, and a subsequent third thermal cycle and a third temperature above 700° C. for more than 12 hours. A manufactured component is also presented.

Abstract: A soldering method in which abrasive particles, in particular cubic boron nitride, are applied in a matrix composed of a solder material and are intended to have better adhesion in the matrix material. The particle which includes an abrasive particle, in particular of cubic boron nitride, is coated with a metal. A method for producing a layer on a substrate, wherein a solder material is applied as metallic matrix material such with particles, in particular solder material in the form of a soldering paste, a soldering tape, a solder powder, by an application method, in particular by a welding process or a thermal spraying process.

Abstract: A method of manufacturing a hard-to-weld material by a beam-assisted additive manufacturing process is presented. The method includes depositing a first layer for the material onto the substrate, the first layer including a major fraction of a base material for the component and a minor fraction of a solder, depositing a second layer of the base material for the component and a thermal treatment of the layer arrangement. The thermal treatment includes a first thermal cycle at a first temperature above 1200° C. for a duration of more than 3 hours, a subsequent second thermal cycle at a second temperature above 1000° C. for more than 2 hours, and a subsequent third thermal cycle and a third temperature above 700° C. for more than 12 hours. A manufactured component is also presented.

Abstract: A method for joining materials, includes: providing a first material and a second material, providing the first material with a grid structure at a joining point, and joining, in particular soldering, the second material to the grid structure such that a material composite of the first material and the second material is produced, wherein the grid structure is designed in such a way that stresses in the material composite are at least partly compensated by the grid structure.

Abstract: A coating method for applying a cover layer to a base material is provided. A solder positioned on a surface of the base material is heated until it is molten, for joining the solder to the base material in a heat treatment. Oxygen is diffused in the molten lot for forming a diffusion layer in the cover layer. A component for a steam turbine is also provided.

Abstract: A method for applying a wear protection layer to a continuous flow machine component which has a base material comprising titanium is provided. The method includes the following steps: mixing a solder which comprises an alloy comprising titanium and particles which are distributed in the alloy and have a reaction agent; applying the solder to predetermined points of the continuous flow machine component; introducing a heat volume into the solder and the continuous flow machine component so that the alloy becomes liquid and the reaction agent changes through diffusion processes with the solder and undergoes a chemical reaction with the alloy, forming a hard aggregate; and cooling the solder so that the alloy becomes solid.

Abstract: A method for re-melting and refilling a defect (7) in a surface (19) of a substrate (4) by re-melting the defect (7) causing a hollow (28) to be produced above the re-melt, and the hollow (28) is refilled. A nickel- or cobalt-based substrate (4) is re-melted by a laser re-melting method. Subsequently, the hollow (28) that is produced is refilled by a laser application method, in particular by soldering. Also, a component having a re-melted region (25) and a solder region (31) thereover is disclosed.

Abstract: A method for applying a wear protection layer to a continuous flow machine component which has a base material comprising titanium is provided. The method includes the following steps: mixing a solder which comprises an alloy comprising titanium and particles which are distributed in the alloy and have a reaction agent; applying the solder to predetermined points of the continuous flow machine component; introducing a heat volume into the solder and the continuous flow machine component so that the alloy becomes liquid and the reaction agent changes through diffusion processes with the solder and undergoes a chemical reaction with the alloy, forming a hard aggregate; and cooling the solder so that the alloy becomes solid.

Abstract: A method for repairing surface damage to a turbomachine component that has a base material which has titanium with the base material having TiAl6V4 and/or pure titanium is provided. The method includes the following steps: mixing a solder that has a titanium-containing alloy and a powder which is distributed in the solder and which has the base material; applying the solder onto turbomachine component areas where the surface damage is located; introducing a quantity of heat into the solder and into the turbomachine component such that the alloy liquefies and the areas are thus wetted; and cooling the solder such that the alloy solidifies.

Abstract: A method for brazing a surface of a metallic substrate having a generally passive metal oxide layer includes activating the surface of the metallic substrate by machining the metallic substrate with a hard metal tool, grit blasting powdered particles of an activating material on the surface, and wetting the grit blasted surface of the metallic substrate with a filler material at a brazing temperature, wherein the activating material is reactive with the metal oxide layer at the brazing temperature.

Abstract: A method of manufacturing a hot-gas component with cooling channels and a hot gas component manufactured by the method is provided. Pre-sintered preform materials are used for the manufacturing of a hot-gas component with a cooling channel. The method initially involves providing a carrier substrate for the hot-gas component and then providing a sheet of pre-sintered preform material. The sheet is then arranged on the carrier substrate so as to form the cooling channel. The sheet and the carrier substrate are then brazed to manufacture the hot-gas component with the cooling channel.

Abstract: A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau.

Abstract: A process including local heating of a brazing point in order to remove an integrally brazed component from a structural part is provided. The brazing point joins a metal sheet in the interior of a cavity to a structural part. The process makes the removal of the metal sheet from the cavity much easier compared to the existing mechanical removal. A plasma source or an induction source may be used for heating the filler metal.

Abstract: A method in which no voids occur during the soldering processes is provided. A component with a soldering material is heated using a first temperature plateau for a first time duration such that the solder material is completely melted. Each subsequent heating is at a temperature plateau with a temperature that is lower than a temperature of the previous plateau.

Abstract: In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation.

Abstract: In soldering processes according to prior art, there is often an insufficient tie-up to a substrate of a component. A method in which no voids occur during the soldering processes is provided. A temperature pattern is proposed according to the method in which the temperature is lowered successively during the soldering operation.