Abstract: The subject matter of the invention is mold material mixtures for producing molds or cores for metal casting, consisting of at least one refractory base mold material, a binder and an additive based on factice. The invention also relates to a component system, a method for producing molds and cores using the mold material mixtures or the component system respectively, and to molds and cores produced by said method.

Abstract: The subject matter of the invention is mold material mixtures for producing molds or cores for metal casting, consisting of at least one refractory base mold material, a binder and an additive based on factice. The invention also relates to a component system, a method for producing molds and cores using the mold material mixtures or the component system respectively, and to molds and cores produced by said method.

Abstract: A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate.

Abstract: A method for producing an electrically conducting metal contact on a semiconductor component having a coating on the surface of a semiconductor substrate. In order to keep transfer resistances low while maintaining good mechanical strength, the invention proposes applying a particle-containing fluid onto the coating, where the particles contain at least metal particles and glass frits, curing the fluid while simultaneously forming metal areas in the substrate through heat treatment, removing the cured fluid and the areas of the coating covered by the fluid, and depositing, for the purposes of forming the contact without using intermediate layers, electrically conducting material from a solution onto areas of the semiconductor component in which the coating is removed while at the same time conductively connecting the metal areas present in said areas on the substrate.