Patents by Inventor Intae SON

Intae SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Curable composition, method of preparing curable composition, cured material of curable composition, method of preparing cured material, and electronic device including cured material
    Patent number: 11859034
    Abstract: A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.
    Type: Grant
    Filed: November 6, 2022
    Date of Patent: January 2, 2024
    Assignees: Samsung Display Co., Ltd., Myongji University Industry And Academia Cooperation Foundation
    Inventors: Sanggu Lee, Junhyup Lee, Yoongook Park, Intae Son, Onnuri Kim, Hoyun Byun, Younghye Son
  • COMPOSITION, POLYMER PREPARED THEREFROM, AND ELECTRONIC APPARATUS INCLUDING THE SAME
    Publication number: 20230357557
    Abstract: A composition including a first monomer including a hydroxy group, a second monomer that does not include a hydroxy group, a third monomer including a terminal heterocyclic group, a fourth monomer including an alkylene glycol, an oligomer, a silane coupling agent, and a photoinitiator. The composition has a viscosity of 5 centipoise to 50 centipoise at about room temperature.
    Type: Application
    Filed: February 1, 2023
    Publication date: November 9, 2023
    Inventors: Sebeen LEE, Bookan KI, Hoyun BYUN, Intae SON, Donghyeon LEE, Jeongin LEE
  • CURABLE COMPOSITION, METHOD OF PREPARING CURABLE COMPOSITION, CURED MATERIAL OF CURABLE COMPOSITION, METHOD OF PREPARING CURED MATERIAL, AND ELECTRONIC DEVICE INCLUDING CURED MATERIAL
    Publication number: 20230086283
    Abstract: A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.
    Type: Application
    Filed: November 6, 2022
    Publication date: March 23, 2023
    Inventors: Sanggu Lee, Junhyup Lee, Yoongook Park, Intae Son, Onnuri Kim, Hoyun Byun, Younghye Son
  • Curable composition, method of preparing curable composition, cured material of curable composition, method of preparing cured material, and electronic device including cured material
    Patent number: 11512159
    Abstract: A curable composition for an electronic device, includes a curable material; and an oxide-containing complex; wherein the oxide-containing complex includes i) an oxide core and ii) an organic group chemically bound to an atom on a surface of the oxide core, the organic group includes a) a curable group reactable with the curable material and b) a linking group linking the atom on a surface of the oxide core to the curable group, and the oxide core includes an aluminum oxide, a silicon oxide, or a combination thereof.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: November 29, 2022
    Assignees: Samsung Display Co., Ltd., Myongji University Industry And Academia Cooperation Foundation
    Inventors: Sanggu Lee, Junhyup Lee, Yoongook Park, Intae Son, Onnuri Kim, Hoyun Byun, Younghye Son
  • Thermally releasable adhesive member and display apparatus including the same
    Patent number: 11491762
    Abstract: A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: November 8, 2022
    Assignees: SAMSUNG DISPLAY CO., LTD., MYONGJI UNIVERSITY INDUSTRY AND ACADEMIA COOPERATION FOUNDATION
    Inventors: Byungwook Ahn, Jongdeok Park, Jeongho Hwang, Junhyup Lee, Intae Son, Byungsun Lee
  • THERMALLY RELEASABLE ADHESIVE MEMBER AND DISPLAY APPARATUS INCLUDING THE SAME
    Publication number: 20200377764
    Abstract: A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.
    Type: Application
    Filed: July 10, 2020
    Publication date: December 3, 2020
    Inventors: Byungwook AHN, Jongdeok PARK, Jeongho HWANG, Junhyup LEE, Intae SON, Byungsun LEE
  • Thermally releasable adhesive member and display apparatus including the same
    Patent number: 10745592
    Abstract: A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: August 18, 2020
    Assignees: SAMSUNG DISPLAY CO., LTD., MYONGJI UNIVERSITY INDUSTRY AND ACADEMIA COOPERATION FOUNDATION
    Inventors: Byungwook Ahn, Jongdeok Park, Jeongho Hwang, Junhyup Lee, Intae Son, Byungsun Lee
  • Thermally releasable adhesive member and display apparatus including the same
    Patent number: 10316219
    Abstract: A thermally releasable adhesive member including a base resin and microcapsules dispersed and disposed in the base resin. The microcapsule includes a core part, a shell part wrapping the core part, and an organic solvent disposed in the core part, and an average diameter of the microcapsules is in a range from about 50 nm to about 500 nm. The adhesive member may maintain high optical transmittance and may be easily detached at a high temperature.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: June 11, 2019
    Assignees: Samsung Display Co., Ltd., Myongji University Industry and Academia Cooperation Foundation
    Inventors: Byungwook Ahn, Kikyung Youk, Sukwon Jung, Jeongho Hwang, Jongdeok Park, Seungchan Lee, Intae Son, Junhyup Lee
  • THERMALLY RELEASABLE ADHESIVE MEMBER AND DISPLAY APPARATUS INCLUDING THE SAME
    Publication number: 20180355216
    Abstract: A thermally releasable adhesive member includes a base resin and microcapsules dispersed in the base resin. At least one of the microcapsules includes a shell part which comprises a hydrophobic polymer material, and a hollow part which is defined by the shell part and contains an organic solvent.
    Type: Application
    Filed: May 4, 2018
    Publication date: December 13, 2018
    Inventors: Byungwook AHN, Jongdeok PARK, Jeongho HWANG, Junhyup LEE, Intae SON, Byungsun LEE