Abstract: A device includes a casing with two separable outer walls. Each of the walls is configured to passively dissipate heat. Two units that produce heat during operation are each thermally coupled to a different wall of the two outer walls.

Abstract: A structure for transferring heat from a heat producing element to a heat sink includes a first layer including a first flat heat pipe array of a substantially parallel and adjacent heat pipes for conveying heat substantially along a first array axis and configured to be thermally coupled to the heat producing element. A second layer includes a second flat heat pipe array of substantially parallel and adjacent heat pipes for conveying heat substantially along a second array axis. The first flat heat pipe array and the second flat heat pipe array partially overlap and are in thermal contact. The first array axis and the second array axis form a nonzero angle, so that the second flat heat pipe array extends beyond the first flat heat pipe array. The second flat heat pipe array is configured to be thermally coupled to the heat sink.

Abstract: A device includes a casing with two separable outer walls. Each of the walls is configured to passively dissipate heat. Two units that produce heat during operation are each thermally coupled to a different wall of the two outer walls.