Abstract: A stable aqueous, semi-aqueous or non-aqueous suspension medium to suspend inert organic or inorganic particles in the aqueous or polar solvent carrier containing gel particles as a separating and suspending agent for the inert organic or inorganic particle, which gel particles prevent agglomeration of the inert particles upon settling over extended periods of time.

Abstract: A slurry composition for use as a lubricant and/or a stable suspension medium to suspend inert organic or inorganic particles which is an aqueous or polar solvent carrier containing gel particles as a lubricating and suspending agent for inert organic or inorganic particles. The composition can contain inorganic salts to provide additional electrostatic repulsion.

Abstract: The invention relates to a cutting and lubricating suspension composition containing gelatinous particles for cutting hard and brittle material with a wire saw. The composition contains an in situ partially neutralized polyelectrolyte and a glycol which suspends abrasive particles used in the cutting operation.

Abstract: A slurry composition for use as a lubricant and/or a stable suspension medium to suspend inert organic or inorganic particles which is an aqueous or polar solvent carrier containing gel particles as a lubricating and suspending agent for inert organic or inorganic particles. The composition can contain inorganic salts to provide additional electrostatic repulsion.

Abstract: Corrosion inhibiting composition for use in aqueous or semi-aqueous stripping, cleaning, abrasive lapping and abrasive slurry compositions that form 5, 6, 7, or 8-membered chelating rings with a base metal together with a film forming polymeric chelation agent. Optionally there is included an oxygen scavenger.

Abstract: There is provided a method and composition for rinsing sliced ingots into wafers from a wire saw cutting operation. The method uses an alkoxylated alcohol diluted in water alone or with a polyalkyl siloxane when the bath has a dynamic flow of water to prevent foaming.

Abstract: A method and an apparatus is provided for the separation of liquid-liquid and liquid-solids compositions by flash evaporation in a heated vacuum chamber. The compositions are injected through an atomizing spray nozzle having a spray cone downward of about 30 to 150 degrees. The compositions are preheated and injected under pressure into the preheated vacuum evaporation chamber. The vaporized liquid that is formed is collected in a condenser which draws the vapors by vacuum or pressure differential. Any solids are collected at the bottom of the vacuum chamber as semi-dry or dry solids.

Abstract: The invention relates to a cutting and lubricating suspension composition containing gelatinous particles for cutting hard and brittle material with a wire saw. The composition contains an in situ partially neutralized polyelectrolyte and a glycol which suspends abrasive particles used in the cutting operation.

Abstract: Corrosion inhibiting composition for use in aqueous or semi-aqueous stripping, cleaning, abrasive lapping and abrasive slurry compositions that form 5, 6, 7, or 8-membered chelating rings with a base metal together with a film forming polymeric chelation agent. Optionally there is included an oxygen scavenger.

Abstract: An aqueous slurry composition for lapping, saw wire cutting, and finishing operations which contains about 0.1 to 70% by weight of abrasive particles, 0.1 to 20% by weight of suspending particles that have a density of less than or similar to the aqueous or semi-aqueous carrier medium, and the method for creating the suspension.

Abstract: A composition and method using same for removing photoresist and/or processing residue from a substrate are described herein. In one aspect, there is provided a composition for removing residue consisting essentially of: an acidic buffer solution having an acid selected from a carboxylic acid or a polybasic acid and an ammonium salt of the acid in a molar ratio of acid to ammonium salt ranging from 10:1 to 1:10; an organic polar solvent that is miscible in all proportions in water; a fluoride, and water wherein the composition has a pH ranging from about 3 to about 7.

Abstract: The invention relates to the preparation of ultra-high purity 1,2-diaminocyclohexane-tetraacetic acid being essentially free of unwanted metal and metal ion contaminants and its use as a stabilizer for ultra-high purity hydroxylamine compounds used extensively in the production of high premium electronic components.

Abstract: The invention relates to the preparation of ultra-high purity 1,2-diaminocyclohexanetetraacetic acid being essentially free of unwanted metal and metal ion contaminants and its use as a stabilizer for ultra-high purity hydroxylamine compounds used extensively in the production of high premium electronic components.

Abstract: The present invention relates to compositions useful in removing photoresist and organic and inorganic residues and processes for removal of photoresists and etch residues. The compositions are aqueous, acidic compositions containing fluoride and organic polar solvents. The compositions are free of glycols and have a low surface tension and viscosity. Corrosion inhibitors are optionally present.

Abstract: The invention relates to the preparation of ultra-high purity 1,2-diaminocyclohexanetetraacetic acid being essentially free of unwanted metal and metal ion contaminants and its use as a stabilizer for ultra-high purity hydroxylamine compounds used extensively in the production of high premium electronic components.

Abstract: The present invention relates to compositions useful in removing photoresist and organic and inorganic residues and processes for removal of photoresists and etch residues. The compositions are aqueous, acidic compositions containing fluoride and organic polar solvents. The compositions are free of glycols and have a low surface tension and viscosity. Corrosion inhibitors are optionally present.

Abstract: There is provided a process for significantly reducing thickness variations and the deviations of the wafer's centerline from a reference plane in material cut with wire saws in a wire cutting apparatus by utilizing a sacrificial layer. The sacrificial layer prevents excessive kerf loss in slices or wafers at the wire entry and exit points. The process can be used to produce semiconductor wafers having greater uniformity in thickness.

Abstract: A lubricating composition which may contain up to 70 weight percent abrasive grit material for use with wire saw and slicing apparatus for cutting or slicing hard and brittle materials. The composition contains abrasive particles suspended in a mixture of high and low molecular weight polyalkylene glycols and a suspension agent. The viscosity of the composition is about 50 to 700 cps.

Abstract: An aqueous stripping composition comprising a mixture of an organic amine and a corrosion inhibitor which is benzotriazole alone or in combination with gallic acid, its ester or analog. The stripping composition is effective to strip photoresists, residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures with little corrosion of copper or titanium containing substrates.

Abstract: An aqueous stripping composition comprising a mixture of a polar amine, an organic or inorganic amine and a corrosion inhibitor which is gallic acid, its ester or analog. The stripping composition is effective to strip photoresists, residues from plasma process generated organic, metal-organic materials, inorganic salts, oxides, hydroxides or complexes in combination with or exclusive of organic photoresist films at low temperatures without redepositing any substantial amount of metal ions.