Patents by Inventor Isaac T. Poku

Isaac T. Poku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-destructive method of determining substrate tilt within a packaged semiconductor component
    Patent number: 5827970
    Abstract: A non-destructive method of determining substrate tilt within a packaged component includes providing the packaged component (10) with a component surface (32), providing a substrate (22) in the packaged component (10) wherein the substrate (22) has a substrate surface (33), using an acoustic wave (50) to measure a distance (34) between the component surface (32) and a region on the substrate surface (33), using another acoustic wave (53) to measure another distance (35) between the component surface (32) and a different region on the substrate surface (33), and comparing the distances (34, 35) to a threshold value.
    Type: Grant
    Filed: September 16, 1996
    Date of Patent: October 27, 1998
    Assignee: Motorola Inc.
    Inventors: Isaac T. Poku, Rama P. Cherkur, Yushi Matsuda
  • Method for determining the cleanliness of a surface
    Patent number: 5756885
    Abstract: A method for determining the cleanliness of a surface of a substrate involves using a visual pattern (17, 29). The visual pattern is either provided in the optical portion of a visual system or is formed on the surface of the substrate to be analyzed. A liquid droplet (26, 27) is dispensed onto the substrate surface, and the extent of the spread area of the droplet is compared to the visual pattern. If the area of the droplet is greater than or equal to a tolerance as signified by the pattern markings, then the surface of the substrate is determined to be sufficiently clean. In relying upon a simple visual comparison of the area of the surface covered by the droplet with an empirically determined visual pattern, a method for analyzing surface cleanliness is consistent between operators and surfaces, is easy to set up and operate, and improves manufacturing throughput.
    Type: Grant
    Filed: April 4, 1996
    Date of Patent: May 26, 1998
    Assignee: Motorola, Inc.
    Inventors: Isaac T. Poku, Rama Cherkur
  • Semiconductor device having x-shaped die support member and method for making the same
    Patent number: 5424576
    Abstract: A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking problems caused by stress and to provide a universal lead frame which is suitable for use with many different die sizes. In another embodiment, a semiconductor device (45) includes a lead frame (40) having a mini-flag (42) to accomplish these same objectives.
    Type: Grant
    Filed: October 12, 1993
    Date of Patent: June 13, 1995
    Assignee: Motorola, Inc.
    Inventors: Frank Djennas, Isaac T. Poku, Robert Yarosh
  • Semiconductor device having universal low-stress die support and method for making the same
    Patent number: 5327008
    Abstract: A semiconductor device (10) includes a lead frame (12) having tie bars (16). In one form of the invention, the tie bars are used to support a semiconductor die (20) to alleviate package cracking problems caused by stress and to provide a universal lead frame which is suitable for use with many different die sizes. In another embodiment, a semiconductor device (45) includes a lead frame (40) having a mini-flag (42) to accomplish these same objectives.
    Type: Grant
    Filed: March 22, 1993
    Date of Patent: July 5, 1994
    Assignee: Motorola Inc.
    Inventors: Frank Djennas, Isaac T. Poku, Robert Yarosh