Patents by Inventor Isaac Varela

Isaac Varela has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connecting metal foils/wires at different layers in 3D printed substrates with wire spanning
    Patent number: 10569464
    Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.
    Type: Grant
    Filed: February 7, 2017
    Date of Patent: February 25, 2020
    Assignee: Board of Regents, The University of Texas System
    Inventors: Eric MacDonald, David Espalin, Isaac Varela, Ryan Wicker
  • CONNECTING METAL FOILS/WIRES AT DIFFERENT LAYERS IN 3D PRINTED SUBSTRATES WITH WIRE SPANNING
    Publication number: 20180354189
    Abstract: A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method of configuring such an apparatus. In an example embodiment, an apparatus can include a substrate and one or more layers of a three-dimensional structure configured on and/or from the substrate. The three-dimensional structure includes one or more internal cavities configured by an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure can be configured with one or more structural integrated metal objects spanning one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties.
    Type: Application
    Filed: February 7, 2017
    Publication date: December 13, 2018
    Inventors: Eric MacDonald, David Espalin, Isaac Varela, Ryan Wicker