Abstract: By comparing a vehicle ID transmitted between an excitation coil 24 and a magnetic sensor 15a with a vehicle ID transmitted between a power feeding apparatus wireless communication unit 12a and a charging apparatus wireless communication unit 21, a charging station 2a with which a vehicle 3 should establish a wireless communication connection can be easily and reliably specified from a plurality of charging stations 2a, 2b, 2c.

Abstract: An in-vehicle communication device 2 broadcasts an inquiry signal while reducing the transmission output in stages, and when a response signal is received only from a single power feed device 9, automatically performs paring with a feeding-end communication device 10 that the power feed device 9 has.

Abstract: A feeding apparatus includes a feeding unit configured to feed power in a non-contact manner to the charging apparatus mounted on a vehicle and a feeding control unit that receives vehicle detection information from a sensor configured to transmit vehicle detection information when a vehicle is detected. The apparatus executes control so that the feeding unit provided in the feeding apparatus feeds first power determined for each feeding apparatus so as to specify the feeding apparatus, transmits charging start information indicating a start of charging when feeding unit specifying information containing information to indicate the power level at which power is received from the feeding unit is received from the charging apparatus, and the received power level is determined to be within a specific power range, and executes control so that the feeding unit feeds second power in order to charge a battery unit of the charging apparatus.

Abstract: A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer.

Abstract: A process for manufacturing workpiece whose surface is to be plated by means of electroless plating includes an ozone-processing step, and a superficial-layer removing step. In the ozone-processing step, a workpiece body including resin and having a surface is processed by means of an ozone treatment by brining the workpiece body into contact with a solution including ozone. Thus, a modified layer is formed on the surface of the workpiece body. Then, in the superficial-layer removing step, a superficial layer is removed from the resultant modified layer by applying energy onto the modified layer.

Abstract: A production method of an electroless plating material of the present invention is a method for the production of an electroless plating material that has a surface to be plated by electroless plating, and includes an ozone treatment step in which a material body that is made of a resin is brought into contact with a solution that contains ozone to form a modified layer in a surface of the material body, and a superficial layer removal step in which, after the ozone treatment step, the surface of the material body is irradiated with ultraviolet rays to remove a superficial layer of the modified layer.

Abstract: The oscillating unit 11 generates a signal having a frequency of n*f, i.e., n times a target frequency f. The control voltage generation circuit 21 compares the phase difference between a divided signal of a signal generated in the oscillating unit 11 and the reference signal, and outputs a DC control voltage according to the phase difference to the oscillating unit 11, thereby controlling an oscillation frequency. The divider circuit 22 converts a signal generated in the oscillating unit 11 to the target frequency f, by dividing the aforementioned signal into n equal units. By setting the oscillation frequency of the oscillating unit at n times the target frequency, the inductance and the capacitors can be formed on a semiconductor integrated circuit board.

Abstract: An object of the present invention is to provide a receiver, a digital-analog converter and a tuning circuit in which temperature compensating components can be formed on a semiconductor substrate while reducing component costs. An FM receiver 100 is constituted by including an antenna 1, a high frequency receiving circuit 2, a local oscillator 3, two digital-analog converters (DACs) 4, 6, a control section 8, a mixing circuit 9, an intermediate frequency amplification circuit 10, a detection circuit 11, a low frequency amplification circuit 12 and the speaker 13. The DACs 4, 6 have a predetermined temperature coefficient, of which output voltage is changed in accordance with ambient temperature. When a characteristic of VCO 31 is changed with variations of ambient temperature so as to cause a control voltage applied to the VCO 31 to be changed, output voltages of the DACs 4, 6 are also changed similarly.

Abstract: An object of the present invention is to provide a receiver, a digital-analog converter and a tuning circuit in which temperature compensating components can be formed on a semiconductor substrate while reducing component costs. An FM receiver 100 is constituted by including an antenna 1, a high frequency receiving circuit 2, a local oscillator 3, two digital-analog converters (DACs) 4, 6, a control section 8, a mixing circuit 9, an intermediate frequency amplification circuit 10, a detection circuit 11, a low frequency amplification circuit 12 and the speaker 13. The DACs 4, 6 have a predetermined temperature coefficient, of which output voltage is changed in accordance with ambient temperature. When a characteristic of VCO 31 is changed with variations of ambient temperature so as to cause a control voltage applied to the VCO 31 to be changed, output voltages of the DACs 4, 6 are also changed similarly.

Abstract: An object of the present invention is to provide a receiver, a digital-analog converter and a tuning circuit in which temperature compensating components can be formed on a semiconductor substrate while reducing component costs. An FM receiver 100 is constituted by including an antenna 1, a high frequency receiving circuit 2, a local oscillator 3, two digital-analog converters (DACs) 4, 6, a control section 8, a mixing circuit 9, an intermediate frequency amplification circuit 10, a detection circuit 11, a low frequency amplification circuit 12 and the speaker 13. The DACs 4, 6 have a predetermined temperature coefficient, of which output voltage is changed in accordance with ambient temperature. When a characteristic of VCO 31 is changed with variations of ambient temperature so as to cause a control voltage applied to the VCO 31 to be changed, output voltages of the DACs 4, 6 are also changed similarly.

Abstract: An object of the present invention is to provide a receiver, a digital-analog converter and a tuning circuit in which temperature compensating components can be formed on a semiconductor substrate while reducing component costs. An FM receiver 100 is constituted by including an antenna 1, a high frequency receiving circuit 2, a local oscillator 3, two digital-analog converters (DACs) 4, 6, a control section 8, a mixing circuit 9, an intermediate frequency amplification circuit 10, a detection circuit 11, a low frequency amplification circuit 12 and the speaker 13. The DACs 4, 6 have a predetermined temperature coefficient, of which output voltage is changed in accordance with ambient temperature. When a characteristic of VCO 31 is changed with variations of ambient temperature so as to cause a control voltage applied to the VCO 31 to be changed, output voltages of the DACs 4, 6 are also changed similarly.

Abstract: When detecting a start bit, a start bit detection circuit 15a outputs a signal for starting the oscillating operation of a clock signal generation circuit 16. When latching an end code for indicating the end of serial communication, a latch circuit 21 outputs the end code to a decoder 26. The decoder 26 decodes the end code and outputs a signal for stopping the oscillating operation of the clock signal generation circuit 16. Thus, the power consumption of the clock signal generation circuit 16 can be reduced.

Abstract: The oscillating unit 11 generates a signal having a frequency of n*f, i.e., n times a target frequency f. The control voltage generation circuit 21 compares the phase difference between a divided signal of a signal generated in the oscillating unit 11 and the reference signal, and outputs a DC control voltage according to the phase difference to the oscillating unit 11, thereby controlling an oscillation frequency. The divider circuit 22 converts a signal generated in the oscillating unit 11 to the target frequency f, by dividing the aforementioned signal into n equal units. By setting the oscillation frequency of the oscillating unit at n times the target frequency, the inductance and the capacitors can be formed on a semiconductor integrated circuit board.