Abstract: Provided is an engine capable of performing post-injection control with a proper fuel injection amount. The engine (1) comprises an engine body (10) equipped with a turbocharger (7), an engine rotational speed sensor (21), an acceleration opening degree sensor (24), a boost sensor (23), a turbo sensor (22), and an ECU (100) for performing post-injection control. The ECU (100) recognizes the rotational speed of the engine, the supercharging pressure, the load on the engine, and the rotational speed of the supercharger, and so performs the post-injection control that the rotational speed of the supercharger becomes equal to the target rotational speed of the supercharger calculated in the ECU (100).

Abstract: A tape adhering device including: a drawing roller for drawing out a tape; a tape fixing means for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered under the condition that fixing operation of the tape by the tape fixing means is released.

Abstract: An engine in which a fluctuation in the amount of fuel injection is reduced in the entire operating tolerance of the engine. The engine (1) has an engine body (5) provided with a turbocharger (7), an engine speed sensor (21), a turbo sensor (22), a boost sensor (23), and an ECU (20) for correcting the amount of fuel injection. A control means recognizes an engine speed, a supercharging pressure, a supercharger speed, a fuel injection amount and corrects the fuel injection amount.

Abstract: It is an object to provide an engine that makes it possible to constantly detect the number of rotations of a supercharger with a calculation load of an ECU reduced. An engine 1 is provided with an engine base 8 comprised of a plurality of cylinders and a turbocharger 7, a crank angle sensor 4, a turbo sensor 5 that detects rotations of the turbocharger 7 as pulses, an amplifier 11 that divides the pulses by an arbitrary division ratio and calculates the divided pulses, and an ECU 10 that judges a surge condition of the turbocharger 7, wherein the ECU 10 sets a predetermined position of a piston of each cylinder in a crank angle of the engine base 8 to count start timing of the divided pulses, outputs the divided pulses counted from the count start timing to the number of predetermined rotations as a first output, and judges that, if a difference between the first outputs at every cylinder is more than a predetermined value, the turbocharger 7 is in the surge condition.

Abstract: In an engine equipped with a supercharger consisting of a compressor having a plurality of blades on a turbine shaft and a turbine, at least one index means provided on the turbine shaft or the plurality of blades, and a turbo angular velocity sensor, which detects a rotation of the index means and a rotation of the plurality of blades respectively and connected to an ECU. In the engine, also, a turbo angular velocity computing means, which calculates an angular velocity by obtaining a plurality of pulses per one rotation of the turbine shaft, is provided.

Abstract: A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.

Abstract: A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3); a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.

Abstract: An engine in which a fluctuation in the amount of fuel injection is reduced in the entire operating tolerance of the engine. The engine (1) has an engine body (5) provided with a turbocharger (7), an engine speed sensor (21), a turbo sensor (22), a boost sensor (23), and an ECU (20) for correcting the amount of fuel injection. A control means recognizes an engine speed, a supercharging pressure, a supercharger speed, a fuel injection amount and corrects the fuel injection amount.

Abstract: Provided is an engine capable of performing post-injection control with a proper fuel injection amount. The engine (1) comprises an engine body (10) equipped with a turbocharger (7), an engine rotational speed sensor (21), an acceleration opening degree sensor (24), a boost sensor (23), a turbo sensor (22), and an ECU (100) for performing post-injection control. The ECU (100) recognizes the rotational speed of the engine, the supercharging pressure, the load on the engine, and the rotational speed of the supercharger, and so performs the post-injection control that the rotational speed of the supercharger becomes equal to the target rotational speed of the supercharger calculated in the ECU (100).

Abstract: It is an object to provide an engine that makes it possible to constantly detect the number of rotations of a supercharger with a calculation load of an ECU reduced. An engine 1 is provided with an engine base 8 comprised of a plurality of cylinders and a turbocharger 7, a crank angle sensor 4, a turbo sensor 5 that detects rotations of the turbocharger 7 as pulses, an amplifier 11 that divides the pulses by an arbitrary division ratio and calculates the divided pulses, and an ECU 10 that judges a surge condition of the turbocharger 7, wherein the ECU 10 sets a predetermined position of a piston of each cylinder in a crank angle of the engine base 8 to count start timing of the divided pulses, outputs the divided pulses counted from the count start timing to the number of predetermined rotations as a first output, and judges that, if a difference between the first outputs at every cylinder is more than a predetermined value, the turbocharger 7 is in the surge condition.

Abstract: In an engine 1 equipped with a supercharger 40 consisting of a compressor 41 having a plurality of blades 45 on a turbine shaft 42 and a turbine 42, at least one index means 44 is provided on the turbine shaft 42 or the plurality of blades 45, and a turbo angular velocity sensor 62, which detects a rotation of the index means 44 and a rotation of the plurality of blades 45 respectively, is provided and connected to an ECU 60. In the engine 1, also, a turbo angular velocity computing means, which calculates an angular velocity by obtaining a plurality of pulses per one rotation of the turbine shaft, is provided.

Abstract: A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.

Abstract: A peeling tap adhering method for adhering a peeling tape (4) to a surface protection film (11) adhered to the front surface of a wafer (20), comprises the steps of: supporting the wafer on a table (31) under the condition that the surface protection film is directed upward; adhering the peeling tape onto the surface protection film by pressing the peeling tape onto the surface protection film when a peeling tape adhering means (46) is lowered; detecting the pressure between the surface protection film of the wafer and the peeling tape adhering means; and stopping the peeling tape adhering means from lowering in the case where a pressure detection value (P) is not less than a predetermined value (P0). Due to the foregoing, it is possible to prevent the wafer from being cracked. Further, it is possible to prevent the peeling tape and the dicing tape from adhering to each other.

Abstract: A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.

Abstract: A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.

Abstract: A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3); a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.

Abstract: A cassette conveyance apparatus (10) includes: a first conveyance means (20) for conveying a first cassette (40) in a horizontal and vertical direction; and a second conveyance means (30) for conveying a second cassette (50) in a horizontal and vertical direction. In the cassette conveyance apparatus (10), the first and second cassettes are circulated between a predetermined wafer accommodation position (P1), at which a wafer (2) is accommodated in the cassette, and a predetermined cassette replacement position (P0) at which a cassette accommodating a plurality of wafers is replaced with an empty cassette. Due to the foregoing, the wafers are continuously accommodated in the cassette without stopping an operation of a pretreatment step.

Abstract: A method of calculating a quantity of light by measuring, by using an adhering force measuring unit (71), the adhering force of an ultraviolet light-curable tape (11 or 21) relying upon the quantity of ultraviolet light with which the ultraviolet light-curable tape is irradiated from an ultraviolet light irradiation unit (61), and calculating, by using a calculation unit, the quantity of ultraviolet light corresponding to a predetermined adhering force, from the measured adhering force of the ultraviolet light-curable tape, and a device therefor. The predetermined adhering force may have been stored in advance in the storage unit or the predetermined adhering force may be determined in advance relying upon at least either one of the kind of the ultraviolet light-curable tape or the elapsed time of the ultraviolet light-curable tape.

Abstract: There are provide a wafer processing method comprising the steps of securing the entirety of a wafer which is provided, on its right side, with a surface protection tape adhered thereto, to a frame by a dicing tape adhered to the underside of the wafer; irradiating the dicing tape of the wafer with ultraviolet light; and detaching the surface protection tape from the right side of the wafer, wherein the order of the occurrence of an irradiating operation for irradiating the dicing tape with ultraviolet light by the ultraviolet light irradiating portion and a detaching operation for detaching the surface protection tape by the detaching portion is determined based on a relation between the adhesive force of the surface protection tape and the adhesive force of the dicing tape before and after an ultraviolet light irradiating operation carried out by the ultraviolet light irradiating portion, and a wafer processing apparatus for carrying out the method.

Abstract: There are provided a wafer processing method comprising the steps of grinding an underside (21) of a wafer which is provided, on its front surface (29), with a plurality of semiconductor devices (10); polishing a ground surface (22) formed by the grinding operation; and carrying out a plasma-processing for a polished surface (23) formed by the polishing operation under a predetermined gaseous atmosphere in a plasma chamber, to form an oxide layer on the polished surface, and a wafer processing method comprising the steps of carrying out a first plasma-processing for a polished surface formed by the polishing operation under a first gaseous atmosphere (CF4 or SF6) in a plasma chamber, to clean the polished surface; and carrying out a second plasma-processing for the polished surface after the cleaning operation under a second gaseous atmosphere (O2) in the plasma chamber, to form an oxide layer on the polished surface, and a wafer processing apparatus for carrying out these methods.