Abstract: In a surface treating apparatus using atomic hydrogen for causing atomic hydrogen to come in contact with a treating object 5 such as a substrate accommodated in a treating chamber 3, thereby carrying out a surface treatment, an atomic hydrogen generator 11 having the function of generating the atomic hydrogen by causing a hydrogen gas to come in contact with a tungsten heater incorporated into a heater cassette 12 in a generating chamber 21a, and the treating chamber 3 can communicate with each other through an opening portion 2c for introduction, and the opening portion 2c for introduction is constituted to be freely opened and closed by means of a shutter member 7. Consequently, it is possible to maintain the generating chamber 21a into a pressure reducing state irrespective of the state of the treating chamber 3, thereby eliminating a waiting time for raising a temperature of the tungsten heater and cooling the tungsten heater.

Abstract: Front and reverse surfaces of a workpiece are treated with plasma simultaneously while the workpiece is arranged between electrodes in such a manner that one of the electrode is opposite to the front surface, and another of the electrodes is opposite to the back surface, and a voltage supplied to each of the electrodes is changed frequently.

Abstract: A voltage is applied between a first cleaning electrode that in contact with an electrode on a workpiece such as a printed circuit board or a chip, and a second cleaning electrode located in the vicinity of the electrode on the workpiece, from a voltage application circuit so as to produce an electric discharge on the electrode on the workpiece, whereby contamination sticking to the electrode on the workpiece is locally removed by heat generated from the electric discharge.

Abstract: A wire bonding apparatus has a sealed casing having an opening which can be opened and closed, a device for gas-tightly dividing the casing into first and second chambers, a sealing device that is movable for communicating the two chambers with each other, a device for supplying an inert gas into the first chamber, a device for supplying oxygen gas or ozone gas into the second chamber, a device for connecting an electrode of the substrate to an electrode of the semiconductor chip via the wire in the first chamber, a device for generating glow discharge in the second chamber, and a device for transporting the substrate between the first and second chambers. Wire bonding is immediately performed after impurities are removed from the electrodes by electrical discharge.

Abstract: A low pressure vapor phase growth apparatus is disclosed. The apparatus comprises a window made of a light-transmissive material, a gas feeder for feeding a reactive gas, an exhauster for pumping gases out after a chemical reaction, a lamp for effecting radiant heating of a substrate with a radiation emitted therefrom and transmitted through said light-transmissive window, and a cooling mechanism for forcibly cooling said light-transmissive window. The substrate and the light-transmissive window are maintained in no mutual contact with a gap therebetween having a width of at most the mean free path of a gas existing in the gap. The reactive gas fed through the gas feeder undergoes the chemical reaction on the obverse surface of the substrate to form a thin film thereon.

Abstract: In a mass spectrometer, a quadrupole electrode comprises four electrodes arranged at a predetermined interval about a device axis along which the mass spectrometer successively comprises an ionized gas source, the quadrupole electrode, and a detector for detecting the gas particles separated in reference to mass-to-charge ratio. At least one of the electrodes comprises a plurality of electrode elements which are divided along the device axis. Each of the electrode elements has a longitudinal axis. The electrode elements are mechanically connected by a mechanically connecting member so that the longitudinal axis are coincident with one another and parallel to the device axis. The electrode elements are electrically connected by an electrically connecting member.