Patents by Inventor Isamu Yuasa

Isamu Yuasa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame for use with an RF powered semiconductor
    Patent number: 6208023
    Abstract: The semiconductor device of the invention includes: a square die pad, to which a semiconductor chip is adhered via a silver paste member or the like; first leads, the inner end of each of the first leads being formed continuously and integrally with an associated shorter side of the die pad; and a pair of second leads extending in an outer direction, the inner ends of the second leads interposing the die pad therebetween. The inner end of each of the second leads includes a width-increased end portion having a larger width and being formed to be parallel to an associated longer side of the die pad. A through hole is provided in a portion connecting the width-increased end portion to the outer portion of each of the second leads. The semiconductor chip is electrically connected to the second leads via wires and to the die pad via a grounding wire.
    Type: Grant
    Filed: July 30, 1998
    Date of Patent: March 27, 2001
    Assignee: Matsushita Electronics Corporation
    Inventors: Masao Nakayama, Katsushi Tara, Isamu Yuasa, Toshio Fujiwara, Kaoru Muramatsu, Noboru Yoshida
  • Semiconductor device
    Patent number: D396846
    Type: Grant
    Filed: April 16, 1997
    Date of Patent: August 11, 1998
    Assignee: Matsushita Electronics Corporation
    Inventors: Masao Nakayama, Yukio Nakamura, Isamu Yuasa, Noboru Yoshida, Katsuji Tara, Toshio Fujiwara