Abstract: A composite tungsten oxide film having high film smoothness, with a function to shield infrared light by reflecting infrared light by a thermal insulation, while maintaining transparency in a visible light region, and a method for manufacturing the composite tungsten oxide film, and a film-deposited base material or an article using these functions. A composite tungsten oxide film including a composition with a general formula MxWyOz as main components, wherein 0.001?x/y?1, 2.2?z/y?3.0, organic components are not contained substantially, a transmittance in a wavelength of 550 nm is 50% or more, a transmittance in a wavelength of 1400 nm is 30% or less, and also, a reflectance in a wavelength of 1400 nm is 35% or more.

Abstract: A composite tungsten oxide film includes a composition represented by a general formula MxWyOz (wherein, an element M is one or more elements selected from alkaline metal, alkaline earth metal, Fe, In, Tl, and Sn, an element W is tungsten, and an element O is oxygen) as main components, wherein 0.001?x/y?1, 2.2?z/y?3.0, organic components are not contained substantially, a sheet resistance is 105 ohms per square or more, a transmittance in a wavelength of 550 nm is 50% or more, a transmittance in a wavelength of 1400 nm is 30% or less, and also, an absorptance in a wavelength of 1400 nm is 35% or more, and an absorptance in a wavelength of 800 nm with respect to an absorptance in a wavelength of 1400 nm is 80% or less.

Abstract: [Object] An object is to provide a Sn—Zn—O-based oxide sintered body which has a mechanical strength, a high density, and a low resistance characteristic and which is applied as a sputtering target, and a method for producing the same. [Solving Means] In this oxide sintered body, Sn is contained with an atomic ratio of Sn/(Sn+Zn) being 0.1 or more and 0.9 or less, and a first additional element M is contained with an atomic ratio of M/(Sn+Zn+M+X) being 0.0001 or more and 0.04 or less relative to a total amount of all the metal elements, and a second additional element X is contained with an atomic ratio of X/(Sn+Zn+M+X) being 0.0001 or more and 0.

Abstract: A composite tungsten oxide film having high film smoothness, with a function to shield infrared light by reflecting infrared light by a thermal insulation, while maintaining transparency in a visible light region, and a method for manufacturing the composite tungsten oxide film, and a film-deposited base material or an article using these functions. A composite tungsten oxide film including a composition with a general formula MxWyOz as main components, wherein 0.001?x/y?1, 2.2?z/y?3.0, organic components are not contained substantially, a transmittance in a wavelength of 550 nm is 50% or more, a transmittance in a wavelength of 1400 nm is 30% or less, and also, a reflectance in a wavelength of 1400 nm is 35% or more.

Abstract: A cesium tungsten oxide film has high heat ray shielding performance and a radio wave transmissivity, and a method for manufacturing a cesium tungsten oxide film capable of manufacturing such film by a dry method. A cesium tungsten oxide film including cesium, tungsten and oxygen as main components, wherein, an atomic ratio of the cesium and the tungsten is Cs/W, which is 0.1 or more and 0.5 or less, and the cesium tungsten oxide film is having a hexagonal crystal structure. A method for manufacturing a cesium tungsten oxide film including cesium, tungsten and oxygen as main components, including: a film deposition process using a cesium tungsten oxide target; and a heat treatment process for heat-treating the film at a temperature of 400° C. or more and less than 1000° C., wherein either the film deposition process or the heat treatment process is performed in an atmosphere containing oxygen.

Abstract: Provided is a sputtering target having extremely low occurrence of arcing or nodules, and a method for manufacturing such a sputtering target. A flat plate-shaped or cylindrical target material (3, 13) is obtained by processing a material composed of an oxide sintered body. In doing so, a grindstone having a specified grade is used to perform rough grinding of a surface of the material that will become a sputtering surface (5, 15) one or more times in accordance to the grade of the grindstone, after which zero grinding is performed one or more times so that the surface roughness of the sputtering surface (5, 15) has an arithmetic mean roughness Ra of 0.9 ?m or more, a maximum height Rz of 10.0 ?m or less, and RzJIS roughness of 7.0 ?m or less. A sputtering target (1, 11) is obtained by bonding the obtained target material (3, 13) to a backing body (2, 12) by way of a bonding layer (4, 14).

Abstract: The present invention provides: an oxide sintered body having superior manufacturing stability, film stability, discharge stability, and mechanical strength; a process for manufacturing the same; and an oxide film obtained by using the oxide sintered body and having an intermediate refractive index. The oxide sintered body comprising In and Si, wherein a Si content is 0.65 to 1.75 in Si/In atomic ratio, a relative density is 90% or more, and a bending strength is 90 N/mm2 or more, is manufactured, and the oxide film with refractive index of 1.70 to 1.90 by a sputtering process using the oxide sintered body is manufactured.

Abstract: Provided is a sputtering target having extremely low occurrence of arcing or nodules, and a method for manufacturing such a sputtering target. A flat plate-shaped or cylindrical target material (3, 13) is obtained by processing a material composed of an oxide sintered body. In doing so, a grindstone having a specified grade is used to perform rough grinding of a surface of the material that will become a sputtering surface (5, 15) one or more times in accordance to the grade of the grindstone, after which zero grinding is performed one or more times so that the surface roughness of the sputtering surface (5, 15) has an arithmetic mean roughness Ra of 0.9 ?m or more, a maximum height Rz of 10.0 ?m or less, and RzJIS roughness of 7.0 ?m or less. A sputtering target (1, 11) is obtained by bonding the obtained target material (3, 13) to a backing body (2, 12) by way of a bonding layer (4, 14).

Abstract: The present invention provides: an oxide sintered body having superior manufacturing stability, film stability, discharge stability, and mechanical strength; a process for manufacturing the same; and an oxide film obtained by using the oxide sintered body and having an intermediate refractive index. The oxide sintered body comprising In and Si, wherein a Si content is 0.65 to 1.75 in Si/In atomic ratio, a relative density is 90% or more, and a bending strength is 90 N/mm2 or more, is manufactured, and the oxide film with refractive index of 1.70 to 1.90 by a sputtering process using the oxide sintered body is manufactured.

Abstract: Provided are a method for producing a Cu—Ga alloy powder, by which a high quality Cu—Ga alloy powder to be produced readily; a Cu—Ga alloy powder; a method for producing a Cu—Ga alloy sputtering target; and a Cu—Ga alloy sputtering target. Specifically, a Cu—Ga alloy powder is produced by stirring a mixed powder containing a Cu powder and a Ga in a mass ratio of 85:15 to 55:45 at a temperature of 30 to 700° C. in an inert atmosphere thereby accomplishing alloying. Also a Cu—Ga alloy sputtering target is produced by molding the Cu—Ga alloy powder followed by sintering.

Abstract: Provided are a method for producing a Cu—Ga alloy powder, by which a high quality Cu—Ga alloy powder to be produced readily; a Cu—Ga alloy powder; a method for producing a Cu—Ga alloy sputtering target; and a Cu—Ga alloy sputtering target. Specifically, a Cu—Ga alloy powder is produced by stirring a mixed powder containing a Cu powder and a Ga in a mass ratio of 85:15 to 55:45 at a temperature of 30 to 700° C. in an inert atmosphere thereby accomplishing alloying. Also a Cu—Ga alloy sputtering target is produced by molding the Cu—Ga alloy powder followed by sintering.

Abstract: An apparatus for mounting an electromagnetic unit on a frame includes a mounting recess at the bottom of the main body of the electromagnetic unit, a guide recess which is communicated with the mounting recess at one side thereof so that it is normal to the mounting recess, and a slidable member which is slidably inserted into the guide recess and normally biased toward the mounting recess by means of a spring supported by a projection disposed in the guide recess, the improvement comprising a stopper disposed in a hole formed in the slidable member, which opposes the spring bearing in the guide recess. The stopper in the hole also serves as a spring guide.