Patents by Inventor Isao Arai
Isao Arai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11753733Abstract: In a method for producing high-purity electrolytic copper, a first additive (A) containing an aromatic ring of a hydrophobic group and a polyoxyalkylene group of a hydrophilic group, a second additive (B) formed of polyvinyl alcohols, and a third additive (C) formed of tetrazoles are added to a copper electrolyte, copper electrolysis is performed by controlling each concentration of the first additive (A), the second additive (B), and the third additive (C), a current density and a bath temperature, and accordingly, electrolytic copper in which a concentration of Ag is less than 0.2 mass ppm, a concentration of S is less than 0.07 mass ppm, a concentration of all impurities is less than 0.2 mass ppm, and an area ratio of crystal grains having an average crystal grain misorientation (referred to as a GOS value) exceeding 2.5° is 10% or less is obtained.Type: GrantFiled: June 1, 2018Date of Patent: September 12, 2023Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota, Kiyotaka Nakaya, Isao Arai
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Patent number: 11453953Abstract: The present invention provides a high-purity electrolytic copper 10 having a Cu purity excluding gas components (O, F, S, C, and Cl) is 99.9999 mass % or more, a content of S is 0.1 mass ppm or less, and an area ratio of crystals having a (101)±10° orientation is less than 40%, when crystal orientation is measured by electron backscatter diffraction in a cross section along a thickness direction.Type: GrantFiled: June 1, 2018Date of Patent: September 27, 2022Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshie Tarutani, Kenji Kubota, Kiyotaka Nakaya, Isao Arai
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Patent number: 10889889Abstract: A high purity copper sputtering target material includes Cu at a purity of 99.99998 mass % or more excluding O, H, N and C, wherein an Al content is 0.005 mass ppm or less, a Si content is 0.05 mass ppm or less, an Fe content is 0.02 mass ppm or less, a S content is 0.03 mass ppm or less, Cl content is 0.1 mass ppm or less, n O content is 1 mass ppm or less, H content is 1 mass ppm or less, a N content is 1 mass ppm or less, and a C content is 1 mass ppm or less.Type: GrantFiled: August 3, 2016Date of Patent: January 12, 2021Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Satoru Mori, U Tani, Yuuji Sato, Fumitake Kikuchi, Isao Arai
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Publication number: 20200181788Abstract: In a method for producing high-purity electrolytic copper, a first additive (A) containing an aromatic ring of a hydrophobic group and a polyoxyalkylene group of a hydrophilic group, a second additive (B) formed of polyvinyl alcohols, and a third additive (C) formed of tetrazoles are added to a copper electrolyte, copper electrolysis is performed by controlling each concentration of the first additive (A), the second additive (B), and the third additive (C), a current density and a bath temperature, and accordingly, electrolytic copper in which a concentration of Ag is less than 0.2 mass ppm, a concentration of S is less than 0.07 mass ppm, a concentration of all impurities is less than 0.2 mass ppm, and an area ratio of crystal grains having an average crystal grain misorientation (referred to as a GOS value) exceeding 2.5° is 10% or less is obtained.Type: ApplicationFiled: June 1, 2018Publication date: June 11, 2020Inventors: Yoshie Tarutani, Kenji Kubota, Kiyotaka Nakaya, Isao Arai
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Publication number: 20200173048Abstract: The present invention provides a high-purity electrolytic copper 10 having a Cu purity excluding gas components (O, F, S, C, and Cl) is 99.9999 mass % or more, a content of S is 0.1 mass ppm or less, and an area ratio of crystals having a (101)±10° orientation is less than 40%, when crystal orientation is measured by electron backscatter diffraction in a cross section along a thickness direction.Type: ApplicationFiled: June 1, 2018Publication date: June 4, 2020Inventors: Yoshie Tarutani, Kenji Kubota, Kiyotaka Nakaya, Isao Arai
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Publication number: 20180237901Abstract: A high purity copper sputtering target material includes Cu at a purity of 99.99998 mass % or more excluding O, H, N and C, wherein an Al content is 0.005 mass ppm or less, a Si content is 0.05 mass ppm or less, an Fe content is 0.02 mass ppm or less, a S content is 0.03 mass ppm or less, Cl content is 0.1 mass ppm or less, n O content is 1 mass ppm or less, H content is 1 mass ppm or less, a N content is 1 mass ppm or less, and a C content is 1 mass ppm or less.Type: ApplicationFiled: August 3, 2016Publication date: August 23, 2018Inventors: Satoru Mori, U Tani, Yuuji Sato, Fumitake Kikuchi, Isao Arai
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Patent number: 9938606Abstract: A hot-rolled copper plate consists of pure copper having a purity of 99.99 mass % or greater, the hot-rolled copper plate having an average crystal grain diameter of 40 ?m or less, and a (?3+?9) grain boundary length ratio (L (?3+?9)/L), which is a ratio between a total crystal grain boundary length L measured by an EBSD method and a sum L (?3+?9) of a ?3 grain boundary length L?3 and a ?9 grain boundary length L?9, being 28% or greater.Type: GrantFiled: April 8, 2014Date of Patent: April 10, 2018Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Kazunari Maki, Hiroyuki Mori, Isao Arai, Norihisa Iida, Takahiro Takeda, Shigeru Shimoizumi, Shin Oikawa
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Publication number: 20170016773Abstract: A wireless temperature sensor that has an ease of manufacture and an improved reliability is provided. The wireless temperature sensor includes a first structure having an antenna having an antenna electrode and a GND electrode disposed in an insulating substrate, a temperature detection device fixed on an opposite surface of the first structure to a surface in which the antenna electrode is disposed, and a second structure disposed on the side of a side wall of the temperature detection device and joined to the first structure. The temperature detection device is fixed on the first structure so as to be electrically connected to the antenna electrode and the GND electrode.Type: ApplicationFiled: March 4, 2015Publication date: January 19, 2017Inventors: Isao ARAI, Shinichi KOMINE, Youichi NONOGAKI, Satoshi SOHDA, Yoshitaka KINOSHITA
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Publication number: 20160047017Abstract: A hot-rolled copper plate consists of pure copper having a purity of 99.99 mass % or greater, the hot-rolled copper plate having an average crystal grain diameter of 40 ?m or less, and a (?3+?9) grain boundary length ratio (L ?3+?9)/L), which is a ratio between a total crystal grain boundary length L measured by an EBSD method and a sum L (?3+?9) of a ?3 grain boundary length L?3 and a ?9 grain boundary length L?9, being 28% or greater.Type: ApplicationFiled: April 8, 2014Publication date: February 18, 2016Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Kazunari MAKI, Hiroyuki MORI, Isao ARAI, Norihisa IIDA, Takahiro TAKEDA, Shigeru SHIMOIZUMI, Shin OIKAWA
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Patent number: 9066433Abstract: A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.Type: GrantFiled: August 10, 2012Date of Patent: June 23, 2015Assignee: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshirou Kuromitsu, Yoshiyuki Nagatomo, Nobuyuki Terasaki, Toshio Sakamoto, Kazunari Maki, Hiroyuki Mori, Isao Arai
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Publication number: 20140192486Abstract: A power module substrate includes an insulating substrate, and a circuit layer that is formed on one surface of the insulating substrate. The circuit layer is formed by bonding a first copper plate onto one surface of the insulating substrate. Prior to bonding, the first copper plate has a composition containing at least either a total of 1 to 100 mol ppm of one or more kinds among an alkaline-earth element, a transition metal element, and a rare-earth element, or 100 to 1000 mol ppm of boron, the remainder being copper and unavoidable impurities.Type: ApplicationFiled: August 10, 2012Publication date: July 10, 2014Applicant: MITSUBISHI MATERIALS CORPORATIONInventors: Yoshirou Kuromitsu, Yoshiyuki Nagatomo, Nobuyuki Terasaki, Toshio Sakamoto, Kazunari Maki, Hiroyuki Mori, Isao Arai
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Patent number: 8558435Abstract: A piezoelectric device has a piezoelectric vibration element mounted in a package wherein the piezoelectric vibration element comprises two stick-like vibration legs; a central leg provided between the two vibration legs; a coupling portion that couples one end of each of the two vibration legs and one end of the central leg; and a protrusion portion that is coupled to another end of the central leg, has a predetermined angle, neither 0 nor 180 degrees, to the length direction of the central leg, and extends into a direction not interfering with the driving legs. In making the piezoelectric device smaller and thinner, this configuration avoids interference between a support point on the central leg, provided for supporting the vibration element, and conductive electrodes, improves insulation between the conductive electrodes, and reduces the generation of short-circuits between the conductive electrodes.Type: GrantFiled: March 17, 2009Date of Patent: October 15, 2013Assignee: Citizen Holdings Co., Ltd.Inventors: Kazuo Murata, Kazuhiro Toriumi, Toshiya Kubo, Takashi Maruyama, Tomoyuki Nakazawa, Taichi Tsuchiya, Izumi Yamamoto, Akiko Katoh, Sadao Horiuchi, Hiroshi Miyauchi, Isao Arai, Akihiro Shioji, Tomoo Ikeda, Maki Takizawa, Keisuke Kigawa
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Patent number: 8028579Abstract: A vibration body for angular speed sensor has a vibrator that includes vibration pieces, a supporting part for supporting the vibration pieces, and a mounting substrate for mounting the vibrator. The mounting substrate has a seat part for fixing the supporting part and supporting the vibrator and a base part. The seat part has a level difference representing a predetermined height from the base part. The predetermined height is set larger than an oscillation width of the vibration pieces. The seat part also has an edge portion that has a shape of a curved line, and each line in a direction perpendicular to each position on the edge portion determines a mounting angle for mounting the vibrator and has an angle in the same direction as a reference direction defined in the mounting substrate or in a direction at least one being different from it.Type: GrantFiled: January 11, 2007Date of Patent: October 4, 2011Assignee: Citizen Holdings Co., Ltd.Inventors: Isao Arai, Yoichi Nagata
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Publication number: 20110193679Abstract: Provided is an electronic shelf label system capable of shortening a period of time required in distributing a large amount of information such as update information for all electronic shelf labels. In the electronic shelf label system, a communication control device (200) distributes shelf label information for an electronic shelf label. A relay station device (300a, 300b) has an electronic shelf label allocated thereto as a relay destination of the shelf label information, and relays only a piece of the shelf label information for the electronic shelf label device that is allocated to the relay station device. The electronic shelf label receives the shelf label information relayed by the relay station device (300a, 300b), to thereby perform display based on the shelf label information.Type: ApplicationFiled: August 21, 2008Publication date: August 11, 2011Inventors: Akihiro Okabe, Isao Arai, Yoshio Kobayashi, Tatsuru Sato, Masahito Aihara, Kaori Takano, Yoshiyuki Kikuchi
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Publication number: 20110186633Abstract: Provided are an electronic shelf label system, a product price management device, a portable terminal device, an electronic shelf label device, a product price management method, a product price update method, a product price management program, and a product price update program, which are capable of changing display of an electronic shelf label in a place where the electronic shelf label is installed. A handy terminal (105) reads, from a shelf label (104), identification information of the shelf label (104), and transmits, to a communication controller (102), price information of a product that is input to the handy terminal (105) itself and the identification information of the shelf label (104).Type: ApplicationFiled: August 21, 2008Publication date: August 4, 2011Inventors: Akihiro Okabe, Yoshio Kobayashi, Isao Arai, Tatsuru Sato, Masahito Aihara, Kaori Takano, Yoshiyuki Kikuchi
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Publication number: 20110018399Abstract: A piezoelectric device has a piezoelectric vibration element mounted in a package wherein the piezoelectric vibration element comprises two stick-like vibration legs; a central leg provided between the two vibration legs; a coupling portion that couples one end of each of the two vibration legs and one end of the central leg; and a protrusion portion that is coupled to another end of the central leg, has a predetermined angle, neither 0 nor 180 degrees, to the length direction of the central leg, and extends into a direction not interfering with the driving legs. In making the piezoelectric device smaller and thinner, this configuration avoids interference between a support point on the central leg, provided for supporting the vibration element, and conductive electrodes, improves insulation between the conductive electrodes, and reduces the generation of short-circuits between the conductive electrodes.Type: ApplicationFiled: March 17, 2009Publication date: January 27, 2011Applicant: CITIZEN HOLDINGS CO., LTD.Inventors: Kazuo Murata, Kazuhiro Toriumi, Toshiya Kubo, Takashi Maruyama, Tomoyuki Nakazawa, Taichi Tsuchiya, Izumi Yamamoto, Akiko Katoh, Sadao Horiuchi, Hiroshi Miyauchi, Isao Arai, Akihiro Shioji, Tomoo Ikeda, Maki Takizawa, Keisuke Kigawa
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Patent number: 7639096Abstract: An object of the present invention is to provide a compact and highly reliable oscillator device having stable vibration characteristics, the object being achieved by constructing the oscillator device by bonding an oscillator in place by accurately positioning it, in a prescribed position and at a prescribed angle, inside a package. The oscillator device according to the present invention includes an oscillator having a vibrating prong and a base portion with a first reference portion, a package, a mounting base with a second reference portion provided inside the package, and a bonding material for fixing the oscillator to the mounting base by aligning the first reference portion with the second reference portion by utilizing a self-alignment effect occurring due to surface tension.Type: GrantFiled: February 23, 2005Date of Patent: December 29, 2009Assignee: Citizen Holdings Co., Ltd.Inventors: Tomoo Ikeda, Isao Arai, Hiroshi Miyauchi
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Publication number: 20090288486Abstract: A vibration body 1 includes a vibrator 2 having vibration pieces 7 and a supporting part 5, and a mounting substrate 11 for mounting the vibrator. The mounting substrate has a seat part 13 for supporting the supporting part, and a base part 12. The seat part 13 has a level difference above the base part, the level difference being at least equal to or higher than the oscillation width of the vibration pieces, and the seat part is also provided with an edge portion 14 having a curved line shape. A normal line direction at each position on the edge portion is the same as a reference direction determined for the mounting substrate, or has at least one different angle with respect to the reference direction. When the vibrator is mounted on the seat part 13, tangential directions at the end portion of the supporting part and the edge portion of the seat part coincide with each other at a mounting position selected from the edge portion having the curved line shape of the seat part.Type: ApplicationFiled: January 11, 2007Publication date: November 26, 2009Applicant: CITIZEN HOLDINGS CO., LTD.Inventors: Isao Arai, Yoichi Nagata
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Publication number: 20070188045Abstract: An object of the present invention is to provide a compact and highly reliable oscillator device having stable vibration characteristics, the object being achieved by constructing the oscillator device by bonding an oscillator in place by accurately positioning it, in a prescribed position and at a prescribed angle, inside a package. The oscillator device according to the present invention includes an oscillator having a vibrating prong and a base portion with a first reference portion, a package, a mounting base with a second reference portion provided inside the package, and a bonding material for fixing the oscillator to the mounting base by aligning the first reference portion with the second reference portion by utilizing a self-alignment effect occurring due to surface tension.Type: ApplicationFiled: February 23, 2005Publication date: August 16, 2007Applicant: CITIZEN WATCH CO., LTD.Inventors: Tomoo Ikeda, Isao Arai, Hiroshi Miyauchi
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Patent number: 7098626Abstract: A power supply apparatus has a battery and a temperature detection circuit. The battery has n battery cells, and the temperature detection circuit has m temperature detection units. Each temperature detection units has a temperature sensor that is thermally coupled to one or more of the battery cells and whose electrical resistance decreases as the temperature of the battery cell or battery cells to which it is thermally coupled increases, a serial resistor that is connected in series with the temperature sensor, and a first diode whose cathode is connected to the node between the temperature sensor and the serial resistor. The serial circuit formed by the temperature sensor and the serial resistor receives a predetermined voltage such that, as the electrical resistance of the temperature sensor decreases, the voltage at the node decreases. The first diodes have anodes thereof connected together.Type: GrantFiled: March 17, 2005Date of Patent: August 29, 2006Assignee: Sanyo Electric Co., Ltd.Inventors: Kazuhiro Seo, Kimihiko Furukawa, Isao Arai