Abstract: A vehicle structure includes side sills, pillars, a first battery arrangement portion provided inside the vicinity of the pillars in a vehicle width direction below a floor panel, and a second battery arrangement portion provided at a center portion in the vehicle width direction below the floor panel in a region inside an outer portion of the first battery arrangement portion in the vehicle width direction.

Abstract: An alignment apparatus and an alignment method that enables to align an optical device with a receptacle, where the optical device and the receptacle have respective axes tilted to each other. The method includes steps of: (1) obtaining a minimum pressure caused to the optical device from the receptacle as varying a rolling angle around the X-axis of the optical device but fixing the pitching angle around the Y-axis at a rotating angle around the Z-axis; (2) determining a rotating angle where thus obtained minimum pressure becomes the minimum; and (3) iterating those procedures until the rotating angle obtained as varying the rolling angle and another rotating angle obtained as varying the pitching angle substantially coincides to each other.

Abstract: An alignment apparatus and an alignment method that enables to align an optical device with a receptacle, where the optical device and the receptacle have respective axes tilted to each other. The method includes steps of: (1) obtaining a minimum pressure caused to the optical device from the receptacle as varying a rolling angle around the X-axis of the optical device but fixing the pitching angle around the Y-axis at a rotating angle around the Z-axis; (2) determining a rotating angle where thus obtained minimum pressure becomes the minimum; and (3) iterating those procedures until the rotating angle obtained as varying the rolling angle and another rotating angle obtained as varying the pitching angle substantially coincides to each other.

Abstract: Disclosed is a test apparatus including: test target sections each having a connector to connect a Device Under the Test (DUT); measuring sections that include measuring devices that have same measuring item respectively; a switch section that switches connection between the test target section and the measuring section under direction of a controller; wherein the controller selects one of the algorithms of connection, 1) searching vacancy of the measuring sections and directs the switch section to make a path between the test target section and the measuring section of vacancy, 2) holding the path that former selected.

Abstract: Disclosed is a test apparatus including: test target sections each having a connector to connect a Device Under the Test (DUT); measuring sections that include measuring devices that have same measuring item respectively; a switch section that switches connection between the test target section and the measuring section under direction of a controller; wherein the controller selects one of the algorithms of connection, 1) searching vacancy of the measuring sections and directs the switch section to make a path between the test target section and the measuring section of vacancy, 2) holding the path that former selected.

Abstract: A testing method of a semiconductor laser emitting a wavelength under a test different from a reference wavelength in a given wavelength range includes: a first step of obtaining a length of an optical fiber under the test satisfying a reference dispersion condition at the wavelength under the test, based on the reference dispersion condition for the test and a unit dispersion amount of the optical fiber; and a second step of inputting a modulation signal that is a modulated laser light of the semiconductor laser having a wavelength as the wavelength under the test into an optical fiber having substantially the same length as the length obtained in the first step and evaluating an output of the optical fiber.

Abstract: A method for controlling testing apparatus having a plurality of device stations for test, a plurality of measuring portions measuring an identical item, and a matrix switch changing a coupling combination between the plurality of the device stations for test and the plurality of the measuring portions, including: performing checking step of a measuring portion with respect to the plurality of the measuring portions, the checking step measuring the measuring portion by measuring a standard device; and performing checking step of a device station for test with respect to the plurality of the device stations for test, the checking step mounting a standard sample on the device station for test and checking the standard sample with use of the measuring portion coupled to the device station for test on which the standard sample is mounted.

Abstract: A laser module includes a semiconductor laser, an output optical system provided on an optical output side of the semiconductor laser, a temperature detecting element that detects a temperature of the output optical system; and an output controller that calculates a drive current to set an optical output intensity of the laser module at a desired value on the basis of temperature information obtained by the temperature detecting element, and outputs the drive current to the semiconductor laser.

Abstract: A laser module includes a semiconductor laser, an output optical system provided on an optical output side of the semiconductor laser, a temperature detecting element that detects a temperature of the output optical system; and an output controller that calculates a drive current to set an optical output intensity of the laser module at a desired value on the basis of temperature information obtained by the temperature detecting element, and outputs the drive current to the semiconductor laser.

Abstract: A testing method of a semiconductor laser emitting a wavelength under a test different from a reference wavelength in a given wavelength range includes: a first step of obtaining a length of an optical fiber under the test satisfying a reference dispersion condition at the wavelength under the test, based on the reference dispersion condition for the test and a unit dispersion amount of the optical fiber; and a second step of inputting a modulation signal that is a modulated laser light of the semiconductor laser having a wavelength as the wavelength under the test into an optical fiber having substantially the same length as the length obtained in the first step and evaluating an output of the optical fiber.

Abstract: A laser module includes a semiconductor laser, an output optical system provided on an optical output side of the semiconductor laser, a temperature detecting element that detects a temperature of the output optical system; and an output controller that calculates a drive current to set an optical output intensity of the laser module at a desired value on the basis of temperature information obtained by the temperature detecting element, and outputs the drive current to the semiconductor laser.

Abstract: There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.

Abstract: In the semiconductor laser module testing device, a temperature control power source changes a temperature of a wavelength locker module, and a wavelength monitoring bias circuit detects an output of a wavelength monitor in the changed temperature range and computes a correlation between a temperature of a semiconductor laser and a wavelength of light output therefrom. Moreover, the wavelength of the output light is locked by controlling the temperature of the wavelength locker module while feeding back the output of the wavelength monitor by a wavelength feedback circuit based on the obtained correlation between the temperature and the wavelength.

Abstract: In order to tune an oscillation wavelength of a semiconductor laser diode to a target wavelength, the amount of change of a wavelength to the amount of change of a wavelength varying item is determined by actual measurement and a basic wavelength coefficient is renewed by using the ratio of both amounts of change as a corrective wavelength coefficient, and thus the characteristic when the wavelength of an actual device is made closer to a target wavelength is utilized.

Abstract: An optical communication module includes: a laser light emitting unit that emits laser light; a temperature control unit that controls the temperature of the laser light emitting unit; a power intensity control unit that controls the power intensity of the laser light emitted from the laser light emitting unit; and a setting value storage unit that stores a setting value determined from an optimum power intensity that maintains a predetermined wavelength and satisfies predetermined temperature conditions and predetermined power intensity conditions, and from an optimum temperature that maintains the predetermined wavelength and satisfies the predetermined temperature conditions and the predetermined power intensity conditions. In this optical communication module, the temperature control unit and the power intensity control unit control the temperature and the power intensity of the laser light emitting unit, based on the setting value stored in the setting value storage unit.

Abstract: There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.

Abstract: In order to tune an oscillation wavelength of a semiconductor laser diode to a target wavelength, the amount of change of a wavelength to the amount of change of a wavelength varying item is determined by actual measurement and a basic wavelength coefficient is renewed by using the ratio of both amounts of change as a corrective wavelength coefficient, and thus the characteristic when the wavelength of an actual device is made closer to a target wavelength is utilized.

Abstract: In the semiconductor laser module testing device, a temperature control power source changes a temperature of a wavelength locker module, and a wavelength monitoring bias circuit detects an output of a wavelength monitor in the changed temperature range and computes a correlation between a temperature of a semiconductor laser and a wavelength of light output therefrom. Moreover, the wavelength of the output light is locked by controlling the temperature of the wavelength locker module while feeding back the output of the wavelength monitor by a wavelength feedback circuit based on the obtained correlation between the temperature and the wavelength.

Abstract: There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.

Abstract: An operation assuring structure of an electronic circuit board in a connector for the electronic circuit board including an insert plate portion disposed on an end portion of an electronic circuit board and adapted to be inserted into a receiving port of a connector, a plurality of signal electronic pads arranged on a surface of the insert plate portion, and a plurality of signal contacts disposed within the receiving port of the connector and adapted to be contacted to the signal electrode pads, wherein a cut-off grounding contact, which is not conductive to the electronic circuit board, is interposed between the signal contacts within the receiving port, and the cut-off grounding contact has a length dimension enough to extend in parallel to the signal contacts and to interpose a distal end thereof between the signal electrode pads on the insert plate portion.