Patents by Inventor Isao Iida
Isao Iida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240149940Abstract: A steering control device includes a processor configured to execute a reaction force control process. The reaction force control process includes a reaction force torque calculation process of calculating a reaction force torque operation amount. The reaction force torque calculation process includes a deviation compensation calculation process of calculating a deviation-compensating component. The deviation compensation calculation process includes a process of calculating a positional deviation, a process of calculating the deviation-compensating component based on the positional deviation, and a process of switching among a plurality of calculation states for calculating the deviation-compensating component. The process of switching among the calculation states is a process of permitting switching among the calculation states on the condition that a permission condition is met.Type: ApplicationFiled: October 25, 2023Publication date: May 9, 2024Applicants: JTEKT CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Satoshi MATSUDA, Isao NAMIKAWA, Koji ANRAKU, Tomoyuki IIDA, Kenji SHIBATA
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Patent number: 11814521Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.Type: GrantFiled: June 24, 2021Date of Patent: November 14, 2023Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Atsushi Sakamoto, Isao Iida
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Patent number: 11739245Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.Type: GrantFiled: July 20, 2017Date of Patent: August 29, 2023Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Masanori Takanashi, Isao Iida, Daigo Hirakawa, Kenji Takenaka, Eiji Tanigawa
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Publication number: 20230227651Abstract: A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional groups per molecule; (b) a crosslinking agent having per molecule two or more crosslinkable groups having reactivity with the curable functional groups of the component (a); (c) a curing catalyst capable of catalyzing a crosslinking reaction of the component (a) and the component (b); (d) a pigment which itself does not emit a fluorescent light; and (e) a UV tracer. The composition can be used as an adhesive.Type: ApplicationFiled: June 1, 2021Publication date: July 20, 2023Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Isao IIDA, Kazuhisa ONO, Koji MIYATA
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Publication number: 20230068114Abstract: A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR2 groups bonded to an Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) surface-treated silica.Type: ApplicationFiled: December 10, 2020Publication date: March 2, 2023Applicants: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC, DAIKIN INDUSTRIES, LTD.Inventors: Isao IIDA, Kazuhisa ONO, Tetsuo FUJIMOTO, Kazuki MARUHASHI, Hisashi MITSUHASHI
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Publication number: 20230068054Abstract: A curable composition includes a perfluoro(poly)ether group-containing silane compound represented by the general formula (I) (wherein, definitions of each group are as described in the specification); (b) an organic silicon compound having at least two OR2 groups bonded to Si atom (here, R2s are each independently a hydrogen atom or a monovalent organic group at each appearance) or a partially hydrolyzed condensate thereof; and (c) a condensation catalyst.Type: ApplicationFiled: December 10, 2020Publication date: March 2, 2023Applicants: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC, DAIKIN INDUSTRIES, LTD.Inventors: Isao IIDA, Kazuhisa ONO, Tetsuo FUJIMOTO, Kazuki MARUHASHI, Hisashi MITSUHASHI
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Publication number: 20230068751Abstract: A curable composition includes: (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and hydrolyzable groups; (B) a compound having at least two OR2 groups (in the formula, R2 is independently a hydrogen atom or a monovalent organic group at each occurrence) bonded to an Si atom (provided that (A) and (D) are excluded) or a partially hydrolyzed condensate thereof; (C) a condensation catalyst; and (D) a compound containing two or more alkoxysilyl groups in one molecule or a partially hydrolyzed condensate thereof (provided that (A) is excluded), with the linking group between the alkoxysilyl groups being a group other than that selected from the group consisting of an —O— group and a group having a siloxane bond.Type: ApplicationFiled: December 10, 2020Publication date: March 2, 2023Applicants: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC, DAIKIN INDUSTRIES, LTD.Inventors: Isao IIDA, Kazuhisa ONO, Tetsuo FUJIMOTO, Kazuki MARUHASHI, Hisashi MITSUHASHI
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Publication number: 20230059791Abstract: A moisture-curable curable composition includes a perfluoro(poly)ether group-containing silane compound (a1) represented by formula (I); a perfluoro(poly)ether group-containing silane compound (a2) represented by formula (II) (in each formula, the definition of each group is as defined in the specification); (b) an organic silicon compound having at least two OR2 groups (here, R2s are each independently a hydrogen atom or a monovalent organic group at each appearance) bonded to Si atom or a partially hydrolyzed condensate thereof; and (c) a condensation catalyst.Type: ApplicationFiled: December 10, 2020Publication date: February 23, 2023Applicants: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC, DAIKIN INDUSTRIES, LTD.Inventors: Isao IIDA, Kazuhisa ONO, Tetsuo FUJIMOTO, Kazuki MARUHASHI, Hisashi MITSUHASHI
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Publication number: 20230055125Abstract: A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR2 groups bonded to an Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) an inorganic filler with a primary particle size from 0.01 to 0.1 ?m.Type: ApplicationFiled: December 10, 2020Publication date: February 23, 2023Applicants: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC, DAIKIN INDUSTRIES, LTD.Inventors: Isao IIDA, Kazuhisa ONO, Tetsuo FUJIMOTO, Kazuki MARUHASHI, Hisashi MITSUHASHI
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Publication number: 20220098370Abstract: A two-part RTV silicone is shown and described herein. In one aspect, provided is an electrostatically dissipative, two-part RTV silicone material. In embodiments, the silicone is white and exhibits a low thermal conductivity.Type: ApplicationFiled: December 3, 2019Publication date: March 31, 2022Inventors: Vinodh RAJENDRA, Isao IIDA, Tetsuo FUJIMOTO, Ramasubramanian NARAYANAN
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Patent number: 11286349Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.Type: GrantFiled: July 20, 2017Date of Patent: March 29, 2022Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Eiji Tanigawa, Masanori Takanashi, Isao Iida, Daigo Hirakawa, Kenji Takenaka
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Patent number: 11254849Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.Type: GrantFiled: November 2, 2016Date of Patent: February 22, 2022Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Eiji Tanigawa, Masanori Takanashi, Isao Iida, Daigo Hirakawa, Kenji Takenaka
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Publication number: 20210317313Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Atsushi SAKAMOTO, Isao IIDA
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Patent number: 11118056Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).Type: GrantFiled: July 20, 2017Date of Patent: September 14, 2021Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Daigo Hirakawa, Masanori Takanashi, Isao Iida, Kenji Takenaka, Eiji Tanigawa
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Patent number: 11084927Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).Type: GrantFiled: July 20, 2017Date of Patent: August 10, 2021Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Daigo Hirakawa, Masanori Takanashi, Isao Iida, Kenji Takenaka, Eiji Tanigawa
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Publication number: 20210147633Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.Type: ApplicationFiled: July 20, 2017Publication date: May 20, 2021Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Eiji TANIGAWA, Masanori TAKANASHI, Isao IIDA, Daigo HIRAKAWA, Kenji TAKENAKA
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Publication number: 20210147738Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structureType: ApplicationFiled: July 20, 2017Publication date: May 20, 2021Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Masanori TAKANASHI, Isao IIDA, Daigo HIRAKAWA, Kenji TAKENAKA, Eiji TANIGAWA
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Publication number: 20210147681Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).Type: ApplicationFiled: July 20, 2017Publication date: May 20, 2021Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Daigo HIRAKAWA, Masanori TAKANASHI, Isao IIDA, Kenji TAKENAKA, Eiji TANIGAWA
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Publication number: 20200157350Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.Type: ApplicationFiled: May 31, 2018Publication date: May 21, 2020Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Atsushi SAKAMOTO, Isao IIDA
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Publication number: 20190161666Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.Type: ApplicationFiled: November 2, 2016Publication date: May 30, 2019Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLCInventors: Eiji TANIGAWA, Masanori TAKANASHI, Isao IIDA, Daigo HIRAKAWA, Kenji TAKENAKA