Abstract: An electronic apparatus reads a digital data stream including a video signal and/or an audio signal outputted from an external apparatus according to a transmission clock different from a clock for the data stream, and outputs the video signal and/or audio signal without causing any discontinuity. The electronic apparatus includes a sample rate converter that rate-converts a predetermined volume of the audio signal in synchronization with a constant sampling clock, and changes a number of samples to be outputted, based on a data volume of an audio signal outputted by the electronic apparatus and a data volume of an audio signal transmitted from the external apparatus or transmittable from the external apparatus to the electronic apparatus.

Abstract: A mineral-water supplying apparatus includes: a mineral-water producing apparatus for producing mineral water by passing raw water, such as city water, through a mineral eluting material(s); a drink conveying pipe for conveying the mineral water produced in the mineral-water producing apparatus to a drinking water spout; a cleaning water pipe diverging from the drink conveying pipe for conveying mineral water to a nozzle; a pump for forcing the mineral water produced in the mineral-water producing apparatus to flow through the drink conveying pipe and the cleaning water pipe; and a chlorine generator for increasing the concentration of chlorine in the mineral water produced in the mineral-water producing apparatus. This allows chlorine to be added to the resulting mineral water and increases the concentration of chlorine in the mineral water.

Abstract: A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.

Abstract: An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.

Abstract: An assembly device includes: a push-in unit provided in a vertically movable tool base to push a ceramic catalyst carrier together with a support mat into a recession of a shaping die; a first and second pressing units for pressing both end portions of the mat from side faces to curve them along an arc-shaped upper surface of the carrier; pressure rollers provided at the both pressing units to press the both end portions toward the carrier; a tape presser in the push-in unit for pressing an adhesive tape to an upper surfaces of engagement portions of the depression and projection in a gap formed between the both rollers and operating with the push-in unit in pushing the carrier and mat into the recession of the shaping die; and a push-up unit provided on a bottom of the recession to push up the carrier and mat.

Abstract: An IC card capable of a high-speed data transmission to/from a data transmission apparatus which is low in processing capability, is provided.

Abstract: A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.

Abstract: A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.

Abstract: There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.

Abstract: A multilayer ceramic electronic component includes a laminated ceramic body provided with terminal electrodes on side surfaces thereof and a cover for covering the laminated ceramic body. Ground terminal electrodes are provided in notches provided in opposed side surfaces opposing of the laminated ceramic body, a plurality of terminal electrodes is arranged in parallel in each of notches provided in the other side surfaces opposing each other. These terminal electrodes are formed by dividing terminal via hole conductors. The cover is disposed so as to cover elements mounted on the laminated ceramic body, and foot portions of the cover are disposed in the notches and are bonded to the ground terminal electrodes.

Abstract: A method of manufacturing a plasma display panel, which comprises the steps of filling a barrier rib-forming paste containing glass frit in a barrier ribs-forming intaglio and concurrently forming a paste layer having a constant thickness on the intaglio, superimposing a substrate on the barrier ribs-forming intaglio filled with the barrier rib-forming paste containing glass frit to thereby transfer the barrier rib-forming paste onto the substrate, and heating the barrier rib-forming paste that has been transferred to the substrate, thereby burning out existing organic components and concurrently sintering the glass frit to thereby form the barrier ribs and dielectric layer. The plasma display panel manufactured by this method is featured in that the barrier ribs and the dielectric layer are formed using the same barrier rib-forming material containing a low melting point glass frit.

Abstract: A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode.

Abstract: There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.

Abstract: A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.

Abstract: A method of manufacturing a plasma display panel, which comprises the steps of filling a barrier rib-forming paste containing glass frit in a barrier ribs-forming intaglio and concurrently forming a paste layer having a constant thickness on the intaglio, superimposing a substrate on the barrier ribs-forming intaglio filled with the barrier rib-forming paste containing glass frit to thereby transfer the barrier rib-forming paste onto the substrate, and heating the barrier rib-forming paste that has been transferred to the substrate, thereby burning out existing organic components and concurrently sintering the glass frit to thereby form the barrier ribs and dielectric layer. The plasma display panel manufactured by this method is featured in that the barrier ribs and the dielectric layer are formed using the same barrier rib-forming material containing a low melting point glass frit.

Abstract: A multilayer ceramic electronic component includes a laminated ceramic body provided with terminal electrodes on side surfaces thereof and a cover for covering the laminated ceramic body. Ground terminal electrodes are provided in notches provided in opposed side surfaces opposing of the laminated ceramic body, a plurality of terminal electrodes is arranged in parallel in each of notches provided in the other side surfaces opposing each other. These terminal electrodes are formed by dividing terminal via hole conductors. The cover is disposed so as to cover elements mounted on the laminated ceramic body, and foot portions of the cover are disposed in the notches and are bonded to the ground terminal electrodes.

Abstract: A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.

Abstract: A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.

Abstract: A ceramic multi-layer wiring substrate includes a line-shaped insulation pattern arranged to extend over a plurality of surface wiring patterns and to intersect the respective surface wiring patterns, in which soldering land electrodes are defined by the insulation patterns.

Abstract: A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.