Abstract: A method of manufacturing a semiconductor device, includes: preparing a semiconductor IC chip and an external electrode terminal which is positioned away from the semiconductor IC chip, wherein the semiconductor IC chip has first and second electrode pads thereon, the second electrode pad being positioned between the first electrode pad and the external electrode terminal; connecting the first electrode pad and the external electrode terminal by a loop-like wire; and pressing a portion of the loop-like wire toward the semiconductor IC chip, thereby connecting the portion of the loop-like wire with the second electrode pad.

Abstract: A method of manufacturing a semiconductor device, includes: preparing a semiconductor IC chip and an external electrode terminal which is positioned away from the semiconductor IC chip, wherein the semiconductor IC chip has first and second electrode pads thereon, the second electrode pad being positioned between the first electrode pad and the external electrode terminal; connecting the first electrode pad and the external electrode terminal by a loop-like wire; and pressing a portion of the loop-like wire toward the semiconductor IC chip, thereby connecting the portion of the loop-like wire with the second electrode pad.

Abstract: In a superconductive coil having no bobbin in its inside, there is provided a method for producing a superconducting coil having a good cooling ability. The method is characterized in that the superconducting coil is formed around a bobbin, a support cylinder is fitted around the outer periphery of the bobbin and thereafter, the bobbin is removed apart from the coil. A desired prestress may be applied from the support cylinder to the outer periphery of the coil. Therefore, it is possible to improve a thermal conductance and prevent the coil from moving during the superconducting operation.