Patents by Inventor Isao Sakamoto
Isao Sakamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230166363Abstract: A solder alloy includes 1.1% by mass or more and 8% by mass or less of Cu; 6% by mass or more and 20% by mass or less of Sb; 0.01% by mass or more and 0.5% by mass or less of Ni; and 0.001% by mass or more and 1% by mass or less of Co; a balance being Sn. An amount of Cu (% by mass) and an amount of Ni (% by mass) satisfies following formula: the amount of Ni/(the amount of Cu+the amount of Ni)<0.10.Type: ApplicationFiled: September 9, 2022Publication date: June 1, 2023Applicant: TAMURA CORPORATIONInventors: Shouichirou NARUSE, Takeshi NAKANO, Isao SAKAMOTO, Toshiaki SHIMADA, Koichi OKUBO
-
Patent number: 11618108Abstract: Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.Type: GrantFiled: September 19, 2019Date of Patent: April 4, 2023Assignee: TAMURA CORPORATIONInventors: Isao Sakamoto, Akira Kitamura, Hiroaki Taniguchi
-
Publication number: 20230069504Abstract: This sensor has a probe to be inserted into a living body and measures an analyte. The probe has a substrate, an electrode formed on the substrate, and a reference layer formed on the electrode. The upper surface of the reference layer is covered with a film, and the side surfaces thereof are exposed.Type: ApplicationFiled: February 26, 2021Publication date: March 2, 2023Inventors: Hirofumi EZAKI, Isao SAKAMOTO, Masaki FUJIWARA
-
Patent number: 10836000Abstract: A flux includes a rosin resin, an activator, a thixotropic agent, and a solvent. The solvent includes 30% by mass or more and 60% by mass or less monovalent alcohol with respect to a total mass amount of the flux. The monovalent alcohol has 18 or more and 24 or less of carbon atoms in one molecule.Type: GrantFiled: September 20, 2018Date of Patent: November 17, 2020Assignee: TAMURA CORPORATIONInventors: Masanori Shibasaki, Jun Sugimoto, Isao Sakamoto
-
Publication number: 20200101567Abstract: Molded solder includes first metal powder and second metal powder. The first metal powder has a first solidus temperature and a first liquidus temperature and includes an alloy containing metal elements. The second metal powder has a melting temperature or a second solidus temperature and a second liquidus temperature and includes single metal element or an alloy containing metal elements. The melting temperature and the second liquidus temperature are higher than the first liquidus temperature. The molded solder is so constructed that a mixture of the first metal powder and the second metal powder are press-molded. The molded solder is so constructed that a first solidus temperature of a solder becomes higher when the molded solder becomes the solder after the first metal powder has been melted by heating the molded solder at a temperature equal to or higher than the first liquidus temperature.Type: ApplicationFiled: September 19, 2019Publication date: April 2, 2020Applicant: TAMURA CORPORATIONInventors: Isao SAKAMOTO, Akira KITAMURA, Hiroaki TANIGUCHI
-
Publication number: 20190084097Abstract: A flux includes a rosin resin, an activator, a thixotropic agent, and a solvent. The solvent includes 30% by mass or more and 60% by mass or less monovalent alcohol with respect to a total mass amount of the flux. The monovalent alcohol has 18 or more and 24 or less of carbon atoms in one molecule.Type: ApplicationFiled: September 20, 2018Publication date: March 21, 2019Applicant: TAMURA CORPORATIONInventors: Masanori SHIBASAKI, Jun SUGIMOTO, Isao SAKAMOTO
-
Patent number: 9053225Abstract: A data processing apparatus comprising: a determination unit to determine whether data input from input/output module is data to be processed by a plurality of processing modules in a setting order; and a switching unit to switch a first data and second data processing path, so that when the determination unit determines that the data input from the input/output module is not data to be processed by the processing modules in the setting order, the communication modules circulate data via the first data processing path used to transfer the data in an order in which the communication modules are connected, and otherwise, the communication modules circulate data via the second data processing path used to control the communication modules to transfer the data in the setting order.Type: GrantFiled: May 24, 2011Date of Patent: June 9, 2015Assignee: CANON KABUSHIKI KAISHAInventors: Isao Sakamoto, Hisashi Ishikawa
-
Patent number: 9043524Abstract: An information processing apparatus includes a plurality of modules connected in a ring shape via a bus, and each module processes a packet flowing in a single direction on the ring in a predetermined order. The module includes a communication unit for transmitting a packet received from a first direction in the ring via the bus to a second direction, a discrimination unit for discriminating a packet from among the packets received from the first direction as a processing packet to be processed by the module, and a processing unit which is connected with the communication unit one by one and configured to process the processing packet. The communication unit transmits the packet processed by the processing unit at an interval equivalent to processing time or more for a processing packet processed by a module in a latter stage in the predetermined order among packets transmitted by the communication unit to the second direction.Type: GrantFiled: September 14, 2012Date of Patent: May 26, 2015Assignee: Canon Kabushiki KaishaInventors: Isao Sakamoto, Hisashi Ishikawa
-
Patent number: 8995476Abstract: A data processing apparatus includes an input unit to input data and processing modules. The processing modules may be connected as part of a ring-shaped data transfer path to transfer data in one direction. Each processing module includes a communication unit configured to implement a first data processing path and a setting path and a processing unit configured to process data received by the communication unit. When using switching data to switch the processing modules performing on the first data processing path to the processing modules performing on the setting path, the switching data is processed on the first data processing path.Type: GrantFiled: May 27, 2014Date of Patent: March 31, 2015Assignee: Canon Kabushiki KaishaInventors: Isao Sakamoto, Hisashi Ishikawa
-
Patent number: 8954633Abstract: In an information processing apparatus in which data processing is performed in a predetermined sequence by processing modules connected to a ring bus, if an amount of data generated by input data in the ring bus is not considered, the data amount exceeds an amount of data that can be held by the processing modules on the ring bus, and a data collision often occurs, so that processing efficiency of the ring bus deteriorates. An amount of data input into the ring bus is controlled so that the total sum of data amounts output to the ring bus from processing units used for processing does not exceed a maximum amount of data that can be held by the processing modules on the ring bus.Type: GrantFiled: April 28, 2010Date of Patent: February 10, 2015Assignee: Canon Kabushiki KaishaInventors: Daiji Kirihata, Hisashi Ishikawa, Hirowo Inoue, Isao Sakamoto
-
Publication number: 20140254601Abstract: A data processing apparatus includes an input unit to input data and processing modules. The processing modules may be connected as part of a ring-shaped data transfer path to transfer data in one direction. Each processing module includes a communication unit configured to implement a first data processing path and a setting path and a processing unit configured to process data received by the communication unit. When using switching data to switch the processing modules performing on the first data processing path to the processing modules performing on the setting path, the switching data is processed on the first data processing path.Type: ApplicationFiled: May 27, 2014Publication date: September 11, 2014Applicant: CANON KABUSHIKI KAISHAInventors: Isao Sakamoto, Hisashi Ishikawa
-
Patent number: 8799536Abstract: An apparatus, in which a plurality of modules is connected with each other and processes a packet having information, includes a storage unit for storing first information indicating an order of processing performed by its own module and second information indicating an order of modules which perform processing, a reception unit for receiving a first packet and transmitting the first packet including information corresponding to the first information, a processing unit for processing data included in the first packet, a generation unit for generating a second packet including the processed data and the second information, and a transmission unit for comparing the information included in the first packet with the second information included in the second packet, and transmitting the packet having a latter processing order.Type: GrantFiled: June 23, 2010Date of Patent: August 5, 2014Assignee: Canon Kabushiki KaishaInventors: Isao Sakamoto, Hisashi Ishikawa
-
Patent number: 8774234Abstract: A data processing apparatus includes an input unit to input data and processing modules. The processing modules may be connected as part of a ring-shaped data transfer path to transfer data in one direction. Each processing module includes a communication unit configured to implement a first data processing path and a setting path and a processing unit configured to process data received by the communication unit. When using switching data to switch the processing modules performing on the first data processing path to the processing modules performing on the setting path, the switching data is processed on the first data processing path.Type: GrantFiled: June 15, 2010Date of Patent: July 8, 2014Assignee: Canon Kabushiki KaishaInventors: Isao Sakamoto, Hisashi Ishikawa
-
Patent number: 8588234Abstract: A data processing apparatus includes a receiving unit for receiving a packet, a determining unit for determining whether to process the packet data by a self-module, based on first information contained in the packet and indicating a processing order, a processing unit for processing the data if the data should be processed by the self-module, a generating unit for generating a packet containing the first information, and one of the processed data, and second information indicating that the data to be processed is stalled, and a transmitting unit for transmitting, according to the first information, the packet to a module expected to process the packet next. The transmitting unit performs the transmission at a transmission interval longer than a predetermined time, if the first and second information indicate that the packet contains data which should be processed by a module next to the self-module in processing order and is stalled.Type: GrantFiled: November 18, 2010Date of Patent: November 19, 2013Assignee: Canon Kabushiki KaishaInventors: Isao Sakamoto, Hisashi Ishikawa
-
Publication number: 20130013838Abstract: An information processing apparatus includes a plurality of modules connected in a ring shape via a bus, and each module processes a packet flowing in a single direction on the ring in a predetermined order. The module includes a communication unit for transmitting a packet received from a first direction in the ring via the bus to a second direction, a discrimination unit for discriminating a packet from among the packets received from the first direction as a processing packet to be processed by the module, and a processing unit which is connected with the communication unit one by one and configured to process the processing packet. The communication unit transmits the packet processed by the processing unit at an interval equivalent to processing time or more for a processing packet processed by a module in a latter stage in the predetermined order among packets transmitted by the communication unit to the second direction.Type: ApplicationFiled: September 14, 2012Publication date: January 10, 2013Applicant: CANON KABUSHIKI KAISHAInventors: Isao Sakamoto, Hisashi Ishikawa
-
Patent number: 8300535Abstract: An information processing apparatus includes a plurality of modules connected in a ring shape via a bus, and each module processes a packet flowing in a single direction on the ring in a predetermined order. The module includes a communication unit for transmitting a packet received from a first direction in the ring via the bus to a second direction, a discrimination unit for discriminating a packet from among the packets received from the first direction as a processing packet to be processed by the module, and a processing unit which is connected with the communication unit one by one and configured to process the processing packet. The communication unit transmits the packet processed by the processing unit at an interval equivalent to processing time or more for a processing packet processed by a module in a latter stage in the predetermined order among packets transmitted by the communication unit to the second direction.Type: GrantFiled: February 19, 2010Date of Patent: October 30, 2012Assignee: Canon Kabushiki KaishaInventors: Isao Sakamoto, Hisashi Ishikawa
-
Patent number: 8104661Abstract: A solder bump is formed on a substrate by using a heating device where a lid structure blocks hot air from directly blowing against a solder composition. The heating device can reduce high-temperature oxygen molecules that come into contact with the solder composition, oxidation of the solder composition is suppressed. As a result, although the hot air is used for heating, a solder bump can be formed by the liquid-like solder composition. Further, because the lid structure is uniformly heated by the hot air, radiation heat from the lid structure is also uniform, and a container is more uniformly heated. In addition, because the hot air is suppressed from directly blowing against a liquid surface, the liquid-like solder composition is not scattered by the hot air.Type: GrantFiled: March 22, 2006Date of Patent: January 31, 2012Assignee: Tamura CorporationInventors: Junichi Onozaki, Masahiko Furuno, Hiroshi Saito, Isao Sakamoto, Masaru Shirai
-
Publication number: 20110320677Abstract: A data processing apparatus comprising: a determination unit to determine whether data input from input/output module is data to be processed by a plurality of processing modules in a setting order; and a switching unit to switch a first data and second data processing path, so that when the determination unit determines that the data input from the input/output module is not data to be processed by the processing modules in the setting order, the communication modules circulate data via the first data processing path used to transfer the data in an order in which the communication modules are connected, and otherwise, the communication modules circulate data via the second data processing path used to control the communication modules to transfer the data in the setting order.Type: ApplicationFiled: May 24, 2011Publication date: December 29, 2011Applicant: CANON KABUSHIKI KAISHAInventors: Isao Sakamoto, Hisashi Ishikawa
-
Patent number: 8042727Abstract: An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side.Type: GrantFiled: March 29, 2005Date of Patent: October 25, 2011Assignees: Tamura Corporation, Japan Science and Technology AgencyInventors: Masaru Shirai, Junichi Onozaki, Hiroshi Saito, Isao Sakamoto, Masahiko Furuno, Haruhiko Ando, Atsushi Hiratsuka
-
Publication number: 20110149974Abstract: A data processing apparatus includes a receiving unit for receiving a packet, a determining unit for determining whether to process the packet data by a self-module, based on first information contained in the packet and indicating a processing order, a processing unit for processing the data if the data should be processed by the self-module, a generating unit for generating a packet containing the first information, and one of the processed data, and second information indicating that the data to be processed is stalled, and a transmitting unit for transmitting, according to the first information, the packet to a module expected to process the packet next. The transmitting unit performs the transmission at a transmission interval longer than a predetermined time, if the first and second information indicate that the packet contains data which should be processed by a module next to the self-module in processing order and is stalled.Type: ApplicationFiled: November 18, 2010Publication date: June 23, 2011Applicant: CANON KABUSHIKI KAISHAInventors: Isao Sakamoto, Hisashi Ishikawa