Abstract: A nuclear power plant construction preparation unit includes: a device main body which enters into a space; a moving part which causes the device main body to enter into the space; an eddy-current inspection sensor which is provided on the device main body, and which detects a target portion of a member surface within the space; a punch marking part which is provided on the device main body, and which performs marking on the member surface; and a control part which controls the moving part and the marking device based on detection results from the target portion detection device, to thereby perform marking at a relative position with respect to the target portion.

Abstract: A construction method of a pipeline that forms a pipeline by joining tubular members to each other by butt welding, includes: a tubular member preparation step for preparing a tubular member having a smooth length of an outer surface along an axial direction from a joined end, which is set based on conditions of ultrasonic inspection of a welded portion, which are determined by usage conditions of the pipeline; a tubular member welding step for welding together prepared tubular members; and a welded portion inspection step for inspecting a welded portion by ultrasonic inspection.

Abstract: A nuclear power plant construction preparation unit includes: a device main body which enters into a space; a moving part which causes the device main body to enter into the space; an eddy-current inspection sensor which is provided on the device main body, and which detects a target portion of a member surface within the space; a punch marking part which is provided on the device main body, and which performs marking on the member surface; and a control part which controls the moving part and the marking device based on detection results from the target portion detection device, to thereby perform marking at a relative position with respect to the target portion.

Abstract: A construction method of a pipeline that forms a pipeline by joining tubular members to each other by butt welding, includes: a tubular member preparation step for preparing a tubular member having a smooth length of an outer surface along an axial direction from a joined end, which is set based on conditions of ultrasonic inspection of a welded portion, which are determined by usage conditions of the pipeline; a tubular member welding step for welding together prepared tubular members; and a welded portion inspection step for inspecting a welded portion by ultrasonic inspection.

Abstract: A semiconductor chip has a quadrangle main surface, a wiring substrate, and a resin seal member for sealing the semiconductor chip, in which the resin seal member has a quadrangle main surface which confronts the main surface of the semiconductor chip. A gate cut trace portion is formed on a side face extending along a first side of the main surface of the resin seal member. A sectional area of an area between the main surface of the wiring substrate and the main surface of the resin seal member at a position outside a side face of the semiconductor chip is smaller than a sectional area of an area between the main surface of the semiconductor chip and the main surface of the resin seal member.

Abstract: A thin, forged magnesium alloy casing is integrally constituted by a thin plate with projections on either or both surfaces, and the thin plate is as thin as about 1.5 mm or less. The thin forged casing can be produced by (a) carrying out a first forging step for roughly forging a magnesium alloy plate to form an intermediate forged product under the conditions of a preheating temperature of the magnesium alloy plate of 350-500° C., a die temperature of 350-450° C., a compression pressure of 3-30 tons/cm2, a compressing speed of 10-500 mm/sec. and a compression ratio of 75% or less; and (b) carrying out a second forging step for precisely forging the intermediate forged product under the conditions of a preheating temperature of the intermediate forged product of 300-500° C., a die temperature of 300-400° C., a compression pressure of 1-20 tons/cm2, a compressing speed of 1-200 mm/sec., and a compression ratio of 30% or less.

Abstract: A semiconductor device comprising a semiconductor chip having a quadrangular main surface, a wiring substrate with the semiconductor chip disposed on a main surface thereof, a resin seal member for sealing the semiconductor chip, the resin seal member having a quadrangular main surface which confronts the main surface of the semiconductor chip, and a gate cut trace portion formed on a side face extending along a first side of the main surface of the resin seal member, wherein the first side of the main surface of the resin seal member extends along a first side of the main surface of the semiconductor chip, the main surface of the resin seal member has a second side intersecting the first side thereof, the second side of the main surface of the resin seal member extending along a second side of the main surface of the semiconductor chip which second side intersects the first side of the chip main surface, and in a section orthogonal to the second side of the main surface of the semiconductor chip, a sectional

Abstract: A thin, forged magnesium alloy casing is integrally constituted by a thin plate with projections on either or both surfaces, and the thin plate is as thin as about 1.5 mm or less. The thin forged casing can be produced by (a) carrying out a first forging step for roughly forging a magnesium alloy plate to form an intermediate forged product under the conditions of a preheating temperature of the magnesium alloy plate of 350-500° C., a die temperature of 350-450° C., a compression pressure of 3-30 tons/cm2, a compressing speed of 10‥500 mm/sec. and a compression ratio of 75% or less; and (b) carrying out a second forging step for precisely forging the intermediate forged product under the conditions of a preheating temperature of the intermediate forged product of 300-500° C., a die temperature of 300-400° C., a compression pressure of 1-20 tons/cm2, a compressing speed of 1-200 mm/sec., and a compression ratio of 30% or less.

Abstract: A thin, forged magnesium alloy casing is integrally constituted by a thin plate with projections on either or both surfaces, and the thin plate is as thin as about 1.5 mm or less. The thin forged casing can be produced by (a) carrying out a first forging step for roughly forging a magnesium alloy plate to form an intermediate forged product under the conditions of a preheating temperature of the magnesium alloy plate of 350-500° C., a die temperature of 350-450° C., a compression pressure of 3-30 tons/cm2, a compressing speed of 10-500 mm/sec. and a compression ratio of 75% or less; and (b) carrying out a second forging step for precisely forging the intermediate forged product under the conditions of a preheating temperature of the intermediate forged product of 300-500° C., a die temperature of 300-400° C., a compression pressure of 1-20 tons/cm2, a compressing speed of 1-200 mm/sec., and a compression ratio of 30% or less.

Abstract: Use of dithiocarbamic acid derivatives having the structure ##STR1## in which R.sub.1, R.sub.2 and R.sub.3 are various organic radicals as preventive and curative agents against mycoplasmosis. These derivatives are prepared from the starting materials having the structure ##STR2## by reaction with carbon disulfide or from the starting materials having the structure ##STR3## BY REACTION WITH R.sub.3 -halide.