Patents by Inventor Isao Tomomatsu
Isao Tomomatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11905399Abstract: A resin formed body obtained from a resin composition that contains a polypropylene resin and a cellulose fiber, the polypropylene resin partially containing an acid modified polypropylene resin, wherein the resin formed body has a diffraction peak derived from a polypropylene ?-crystal (040) plane at a position of a scattering vector s of 1.92±0.1 nm?1, a diffraction peak derived from a polypropylene ?-crystal (300) plane at a position of a scattering vector s of 1.83±0.1 nm?1, and a diffraction peak derived from a cellulose I? type crystal (004) plane at a position of a scattering vector s of 3.86±0.1 nm?1, observed in a wide-angle X-ray diffraction measurement, and wherein an orientation degree of the cellulose fiber in the resin formed body is larger than 0.1 and less than 0.8.Type: GrantFiled: March 15, 2021Date of Patent: February 20, 2024Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Yukihiro Ikura, Suzune Ito, Yasuo Nakajima, Kenichi Suyama, Jae Kyung Kim, Hiroki Tanaka, Isao Tomomatsu
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Publication number: 20230159714Abstract: A cellulose fiber reinforced resin formed body, which is obtained by molding a cellulose fiber reinforced resin composition containing a polypropylene resin, an alkoxysilane-modified polypropylene resin, and a cellulose fiber; and a method of producing the same.Type: ApplicationFiled: January 11, 2023Publication date: May 25, 2023Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Mayu SATAKE, Yukihiro IKURA, Suzune ITO, Yasuo NAKAJIMA, Kenichi SUYAMA, Hiroki TANAKA, Isao TOMOMATSU, Yui HAMURO
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Publication number: 20220025133Abstract: An organic fiber-reinforced resin formed body that contains a resin and a cellulose fiber, wherein the resin formed body has a density of 0.65 g/cm3 or less, and a method for producing the same.Type: ApplicationFiled: September 24, 2021Publication date: January 27, 2022Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yukihiro IKURA, Mayu SATAKE, Suzune ITO, Yasuo NAKAJIMA, Kenichi SUYAMA, Jae Kyung KIM, Hiroki TANAKA, Isao TOMOMATSU
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Publication number: 20220010113Abstract: A cellulose fiber-reinforced polypropylene resin formed body that is a resin formed body having respective diffraction peaks observed at positions of a scattering vector s of 1.61±0.1 nm?1, 1.92±0.1 nm?1, and 3.86±0.1 nm?1 in a wide-angle X-ray diffraction measurement, and is characterized by having ?T calculated by the following formula (1) of 40.0° C. or more; and a cellulose fiber-reinforced polypropylene resin formed body that is a resin formed body having the above diffraction peaks and is characterized by having ?Tm and ?Tc expressed by the following formulae (2) and (3) and satisfying ?Tm<?Tc; and a producing method of these.Type: ApplicationFiled: September 24, 2021Publication date: January 13, 2022Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yukihiro IKURA, Mayu SATAKE, Suzune ITO, Yasuo NAKAJIMA, Kenichi SUYAMA, Jae Kyung KIM, Hiroki TANAKA, Isao TOMOMATSU
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Patent number: 11192346Abstract: A laminated body, containing a fiber-reinforced resin, in which a fiber-reinforced thermoplastic resin layer (1) containing fiber bundle of reinforcing fibers and a first thermoplastic resin, and a resin layer (2) containing a second thermoplastic resin, are alternately laminated, to form the fiber-reinforced resin, and the ratio of the indentation elastic modulus EIT-B of the first thermoplastic resin portion of the laminated body with respect to the indentation elastic modulus EIT-C of the second thermoplastic resin is 1.5 or more and 5.0 or less; a fiber-reinforced composite resin material; and a method of producing these.Type: GrantFiled: October 25, 2019Date of Patent: December 7, 2021Assignee: FURUKAWA ELECTRIC CO., LTD.Inventors: Motoko Yoshizaki, Makiko Nakano, Yukihiro Ikura, Jirou Hiroishi, Isao Tomomatsu, Yousuke Kokubo, Yoichiro Negishi
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Publication number: 20210198463Abstract: A resin formed body obtained from a resin composition that contains a polypropylene resin and a cellulose fiber, the polypropylene resin partially containing an acid modified polypropylene resin, wherein the resin formed body has a diffraction peak derived from a polypropylene ?-crystal (040) plane at a position of a scattering vector s of 1.92±0.1 nm?1, a diffraction peak derived from a polypropylene ?-crystal (300) plane at a position of a scattering vector s of 1.83±0.1 nm?1, and a diffraction peak derived from a cellulose I? type crystal (004) plane at a position of a scattering vector s of 3.86±0.1 nm?1, observed in a wide-angle X-ray diffraction measurement, and wherein an orientation degree of the cellulose fiber in the resin formed body is larger than 0.1 and less than 0.8.Type: ApplicationFiled: March 15, 2021Publication date: July 1, 2021Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Yukihiro IKURA, Suzune ITO, Yasuo NAKAJIMA, Kenichi SUYAMA, Jae Kyung KIM, Hiroki TANAKA, Isao TOMOMATSU
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Publication number: 20210009846Abstract: An insulated wire, containing a conductor and an insulating film (A) provided in contact with the conductor, in which the insulating film (A) contains polyaryletherketone, the polyaryletherketone has an exothermic peak at the range of 290 to 330° C. in a differential scanning calorimetry when the polyaryletherketone is cooled at a temperature falling rate of 10° C./min from a temperature equal to or higher than the melting temperature of the polyaryletherketone, and the half width of the exothermic peak is 6° C. or more.Type: ApplicationFiled: September 29, 2020Publication date: January 14, 2021Applicants: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.Inventors: Takeshi SAITO, Satoko YAMOTO, Isao TOMOMATSU
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Publication number: 20200055294Abstract: A laminated body, containing a fiber-reinforced resin, in which a fiber-reinforced thermoplastic resin layer (1) containing fiber bundle of reinforcing fibers and a first thermoplastic resin, and a resin layer (2) containing a second thermoplastic resin, are alternately laminated, to form the fiber-reinforced resin, and the ratio of the indentation elastic modulus EIT-B of the first thermoplastic resin portion of the laminated body with respect to the indentation elastic modulus EIT-C of the second thermoplastic resin is 1.5 or more and 5.0 or less; a fiber-reinforced composite resin material; and a method of producing these.Type: ApplicationFiled: October 25, 2019Publication date: February 20, 2020Applicant: FURUKAWA ELECTRIC CO., LTD.Inventors: Motoko YOSHIZAKI, Makiko NAKANO, Yukihiro IKURA, Jirou HIROISHI, Isao TOMOMATSU, Yousuke KOKUBO, Yoichiro NEGISHI
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Patent number: 10529463Abstract: An insulated wire, having: a single conductor or multiple conductors; an insulating layer on the outer periphery of the single conductor or each of the multiple conductors; and an adhesion layer on the outer periphery of the insulating layer, wherein the thickness of the adhesion layer is 2 to 200 ?m, wherein a resin constituting the adhesion layer does not have a melting point, wherein the resin constituting the adhesion layer has a tensile modulus of 0.6×107 to 10×107 Pa at 250° C., and wherein a substance having 2 or more amino groups exists on the surface of the adhesion layer; a coil containing the insulated wire; and an electrical or electronic equipment using the coil.Type: GrantFiled: March 12, 2019Date of Patent: January 7, 2020Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.Inventors: Satoko Yamoto, Hideo Fukuda, Isao Tomomatsu
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Patent number: 10366809Abstract: An insulated wire having a thermosetting resin layer on the outer periphery of a conductor and a thermoplastic resin layer on the outer periphery of the thermosetting resin layer, wherein a total thickness of the thermosetting resin layer and the thermoplastic resin layer is 100 ?m or more and 250 ?m or less, and a degree of orientation of a thermoplastic resin in said thermoplastic resin layer, that is calculated by the following Formula 1, is 20% or more and 90% or less; a coil and an electric and electronic equipment each having the insulated wire. Formula 1 Degree of orientation H (%)=[(360??Wn)/360]×100 Wn: A half width of orientation peak in the azimuth angle intensity distribution curve by X-ray diffraction n: the number of orientation peak at a ? angle of 0° or more and 360° or less.Type: GrantFiled: January 17, 2019Date of Patent: July 30, 2019Assignees: FURUKAWA ELECTRIC CO., LTD., FURUKAWA MAGNET WIRE CO., LTD.Inventors: Hideo Fukuda, Isao Tomomatsu, Makoto Oya, Daisuke Muto
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Publication number: 20110174520Abstract: Disclosed is an insulated electric wire having a conductor and one or more insulating layers covering the conductor, the insulated electric wire comprising a polyester-based resin composition which constitutes at least one layer of the insulating layers and comprises a polyester-based resin (A) containing a liquid crystal polymer in an amount of 5-25 parts by mass relative to 75-95 parts by mass of a polyester-based resin other than liquid crystal polymers.Type: ApplicationFiled: July 29, 2008Publication date: July 21, 2011Applicant: THE FURUKAWA ELECTRIC CO., LTD.Inventors: Hideo Fukuda, Minoru Saito, Isao Tomomatsu, Tsuneo Aoi, Xiao Chuan Zhu
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Publication number: 20090292034Abstract: A polycarbonate foam that is a thermoplastic resin foam suitable for a backlight or a lighting box of an electric signboard, a luminaire, a display, and the like, has both high optical reflectivity and shape-retaining property, and has a short production cycle time. A polycarbonate foam contains a polycarbonate (A) and a fluorinated polycarbonate (B) and has a plurality of pores with a mean bubble diameter of 10 micrometers or less within. The foam is manufactured by a manufacturing method including holding a resin sheet containing the polycarbonate (A) and the fluorinated polycarbonate (B) in a pressurized inert gas atmosphere and incorporating the inert gas into the resin sheet, and heating the resin sheet incorporated with the inert gas to a temperature equal to or higher than a softening temperature of the polycarbonate under ambient pressure and foaming the resin sheet.Type: ApplicationFiled: December 26, 2006Publication date: November 26, 2009Applicant: THE FURUKAWA ELECTRIC CO., LTD.Inventors: Isao Tomomatsu, Masayasu Itoh
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Patent number: 6917345Abstract: A small antenna comprises an antenna conductor, and a dielectric chip formed at surroundings of the antenna conductor by a plurality of resin moldings.Type: GrantFiled: December 21, 2001Date of Patent: July 12, 2005Assignee: The Furukawa Electric Co., Ltd.Inventors: Hiroki Hamada, Yoshikazu Kamei, Masayuki Ishiwa, Isao Tomomatsu, Takahiro Ueno, Shinji Satoh
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Patent number: 6894646Abstract: A line-shaped comprises an antenna element in which a strip-shaped conductor is bent in a width direction of a strip, and a chamfered portion is provided on an outer edge of a bent portion of the strip-shaped conductor.Type: GrantFiled: May 15, 2002Date of Patent: May 17, 2005Assignee: The Furukawa Electric Co., Ltd.Inventors: Takanori Washiro, Isao Tomomatsu, Hiroki Hamada, Shinji Satoh
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Patent number: 6724347Abstract: Of margins of a resin molding with an antenna element buried therein which lie around the antenna element, a margin on that side of the resin molding where a gate mark remains is made larger than margins on other sides where there is no gate mark. Particularly, when the antenna element has a line antenna portion and a capacitance-adding portion provided at a distal end of the line antenna portion, the resin molding is injection-molded in such a way that a gate mark can be formed on that side where the capacitance-adding portion is located. Those portions of the resin molding where the terminal portions are led out are dented from levels of portions around those portions. This provides a chip antenna which has a simple structure with a high mechanical strength and does not prevent separation or cracking from occurring in the resin molding in which the antenna element is buried and a method of manufacturing the chip antenna.Type: GrantFiled: June 20, 2002Date of Patent: April 20, 2004Assignee: The Furukawa Electric Co., Ltd.Inventors: Isao Tomomatsu, Takahiro Ueno, Mitsuo Yoshino, Shinji Satoh, Hiroki Hamada
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Patent number: 6720924Abstract: An antenna apparatus comprises a substrate, a chip antenna mounted on the substrate, and a ground pattern disposed on the substrate, at least a portion on the side of a power supply terminal of an antenna conductor in the chip antenna being overlapped with the ground pattern.Type: GrantFiled: February 5, 2002Date of Patent: April 13, 2004Assignees: The Furukawa Electric Co., Ltd., Sony CorporationInventors: Isao Tomomatsu, Takahiro Ueno, Toshiyuki Imagawa, Minoru Oozeki, Masayuki Ishiwa
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Patent number: 6686406Abstract: A dielectric ceramic containing Bi, Zn, and Sr as constituent elements. A resin-ceramic composite material containing a mixture of the dielectric ceramic powder and an organic polymer resin. An antenna and an electrical part using the composite material, and a manufacturing method thereof.Type: GrantFiled: December 10, 2001Date of Patent: February 3, 2004Assignee: The Furukawa Electric Co., Ltd.Inventors: Isao Tomomatsu, Masayuki Ishiwa
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Patent number: 6630906Abstract: A chip antenna comprises an antenna conductor, and a dielectric chip which stacks on a portion of the antenna conductor, in which a conductor exposed portion of the antenna conductor which is not overlapped on the dielectric chip is bent along the surface of the dielectric chip.Type: GrantFiled: July 20, 2001Date of Patent: October 7, 2003Assignees: The Furukawa Electric Co., Ltd., Sony CorporationInventors: Isao Tomomatsu, Masayuki Ishiwa, Takahiro Ueno, Toshiyuki Imagawa, Minoru Oozeki
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Publication number: 20030030593Abstract: Of margins of a resin molding with an antenna element buried therein which lie around the antenna element, a margin on that side of the resin molding where a gate mark remains is made larger than margins on other sides where there is no gate mark. Particularly, when the antenna element has a line antenna portion and a capacitance-adding portion provided at a distal end of the line antenna portion, the resin molding is injection-molded in such a way that a gate mark can be formed on that side where the capacitance-adding portion is located. Those portions of the resin molding where the terminal portions are led out are dented from levels of portions around those portions. This provides a chip antenna which has a simple structure with a high mechanical strength and does not prevent separation or cracking from occurring in the resin molding in which the antenna element is buried and a method of manufacturing the chip antenna.Type: ApplicationFiled: June 20, 2002Publication date: February 13, 2003Inventors: Isao Tomomatsu, Takahiro Ueno, Mitsuo Yoshino, Shinji Satoh, Hiroki Hamada
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Publication number: 20030006940Abstract: A line-shaped comprises an antenna element in which a strip-shaped conductor is bent in a width direction of a strip, and a chamfered portion is provided on an outer edge of a bent portion of the strip-shaped conductor.Type: ApplicationFiled: May 15, 2002Publication date: January 9, 2003Inventors: Takanori Washiro, Isao Tomomatsu, Hiroki Hamada, Shinji Satoh