Abstract: In a method of resin-sealing a semiconductor device having a circuit board with an IC thereon, a metal mold formed of upper and lower metal molds is prepared. The upper metal mold has a pressing member, and the lower metal mold has a cavity for mounting the circuit board therein, a pinpoint gate formed at a lower portion of the cavity and a runner section formed below the cavity and communicating with the pinpoint gate. The circuit board is positioned in the cavity of the lower metal mold, and is set such that the IC faces downward. A rear surface of the circuit board where the IC is not mounted is pressed by the pressing member, and a resin is filled in the cavity through the runner section and the pinpoint gate to thereby seal the IC mounted on the circuit board by the resin.

Abstract: A storage and safety device includes an enclosure frame for storing an article being stored, a lock mechanism for locking the article contained in the enclosure frame so as not to allow the article to be taken out, and a release jig for releasing the lock mechanism. The enclosure frame is a parallelepiped having two pairs of side frames, upper and lower frames, one of which is formed with an opening for insertion and taking-out of the article being stored, and the interior configuration of the enclosure frame is sized to enable the article being stored to move. The lock mechanism is constructed to be integral with the enclosure frame and can be inserted into and removed from a gap formed between the article contained in the enclosure frame and one of the side frames.

Abstract: A method for manufacturing a substrate for an IC card in which, after a synthetic resin is filled into a cavity in an IC card substrate forming mold, or after a core pin for forming an IC module housing recessed section in the cavity in an IC card substrate forming mold is caused to project as far as an intermediate position, and the synthetic resin is filled into the cavity, the core pin is further caused to project to a specified position to form the IC module housing recessed section while the synthetic resin is in the mobile state.

Abstract: A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Abstract: A resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Abstract: A method of making a resin encapsulated pin grid array includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Abstract: A molded part formed by outsert-molding a resin into a through hole of a pipe part includes a pipe part and a resin part. The pipe part includes a hole having a tapered surface whose size is gradually reduced inward from an end portion of a through hole formed in an outsert-molded part such as a metal part, and a resin part has an outer shape matching the tapered surface. The resin part is formed in the pipe part by outsert molding.

Abstract: A method of making a resin encapsulated pin grid array which includes an IC chip mounted on a resin substrate having a plurality of contact pins on its lower surface and resin-encapsulated by injection molding. A metal heat radiating member is integrally formed on the upper surface of the encapsulating resin when the encapsulating resin is injection-molded.

Abstract: An IC card includes an IC module and a card base. The IC module is constituted by a circuit board having contact patterns formed thereon and an IC chip mounted on the circuit board. The card base houses the IC module so as to expose the contact patterns. The circuit board of the IC module is constituted by a pattern portion on which the contact patterns are formed and bent portions formed by bending the pattern portion. The card base includes an opening for exposing the contact patterns of the IC module, and clamping portions, formed on peripheral portions of the opening, for fixing the bent portions. The bent portions of the IC module are fixedly clamped by the clamping portions such that the contact patterns are arranged on substantially the same plane as a surface of the card base.

Abstract: A resin encapsulating method includes the steps of mounting a plate having a gate groove on a substrate to form a side gate, connected to the side surface of a cavity, between the plate and one of the upper and lower half molds, and filling a resin in the cavity.

Abstract: A receiving unit for timepieces, especially an improved receiving unit for a self-winding mechanism of self-winding timepieces. The receiving unit comprises guide portions and springs which are formed together as a unitary structure using resin.