Patents by Inventor Isao Yamamura

Isao Yamamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for encapsulating a semiconductor utilizing an epoxy resin and an onium salt compound
    Patent number: 5610443
    Abstract: A method of encapsulating a semiconductor comprising encapsulating a semiconductor in a curable epoxy resin composition comprising a liquid epoxy resin, an inorganic filler, an onium salt compound and an internal releasing agent, and substantially not containing a hardener, and then molding the above composition.
    Type: Grant
    Filed: September 7, 1995
    Date of Patent: March 11, 1997
    Assignee: General Instrument of Taiwan, Ltd.
    Inventors: Akihiro Inagaki, Isao Yamamura