Patents by Inventor Ismail C. Noyan
Ismail C. Noyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090302474Abstract: The present invention relates to a very thin multilayer diffusion barrier for a semiconductor device and fabrication method thereof. The multilayer diffusion barrier according to the present invention is fabricated by forming a very thin, multilayer diffusion barrier composed of even thinner sub-layers, where the sub-layers are only a few atoms thick. The present invention provides a diffusion barrier layer for a semiconductor device which is in a substantially amorphous state and thermodynamically stable, even at high temperatures.Type: ApplicationFiled: August 13, 2009Publication date: December 10, 2009Inventors: Katayun Barmak, Hyungjun Kim, Ismail C. Noyan, Stephen M. Rossnagel
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Patent number: 7214548Abstract: A method, apparatus, and computer program product for flattening a warped substrate. The substrate is placed on a planar surface of a clamping apparatus in direct mechanical contact with the planar surface. The substrate comprises surface regions S1, S2, . . . , SN having an average warpage of W1, W2, . . . , WN, respectively, wherein W1?W2? . . . ?WN and W1?WN. Zones Z1, Z2, . . . , ZN of the planar surface respectively comprise vacuum port groups G1, G2, . . . , GN. Each group comprises at least one vacuum port. N is at least 2. A vacuum pressure PV1, PV2, . . . , PVN is generated at each vacuum port within group G1, G2, . . . , GN, at a time of T1, T2, . . . , TN to clamp surface region S1, S2, . . . , SN to zone Z1, Z2, . . . , ZN, respectively. The vacuum pressure PV1, PV2, . . . , PVN is maintained at the vacuum ports of group G1, G2, . . . , GN, respectively, until time TN+1. T1<T2< . . . <TN<TN+1.Type: GrantFiled: August 30, 2004Date of Patent: May 8, 2007Assignee: International Business Machines CorporationInventors: Mohammed F. Fayaz, Steffen K. Kaldor, Conal E. Murray, Ismail C. Noyan, Anne L. Petrosky
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Patent number: 5446261Abstract: A soldering tip overcomes the gravitational effects on molten solder and supplies a large molten solder sphere for contact with a surface to which solder is to be applied. A conical or cylindrical spiral or helix of solder-wettable material, preferably in the form of a compressional spring is attached to the soldering tip with the central axis of the helix aligned with the axis of the soldering tip, preferably by welding. Solder supplied to the soldering tip flows between the coils of the helix and forms a meniscus at the lower end of the helix so that only the molten solder meniscus touches the surface during application of solder. The increased surface tension acts to overcome gravitational effects and assures a more even flow of solder to the surface.Type: GrantFiled: October 26, 1993Date of Patent: August 29, 1995Assignee: International Business Machines CorporationInventors: Bernardo Hernandez, Raymond R. Horton, Michael J. Palmer, Ismail C. Noyan, Frederick G. Weindelmayer
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Patent number: 5322204Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.Type: GrantFiled: June 21, 1993Date of Patent: June 21, 1994Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong
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Patent number: 5263620Abstract: A method and apparatus for removing wires bonded between chip contact pads and substrate contact pads using an alternating fluid flow is described. The fluid flow is preferably air. A nozzle having a plurality of air jets within a chip accommodating cavity is disposed over the chip to enclose the chip contact pads, the substrate contact pads and the wires bonded therebetween. Air is forced through the plurality of jets to cause an alternating clockwise and counter clockwise air flow which bends the plurality of wires back and forth until they fatigue at the contact points to the chip contact pads in a substrate contact pads which results in the wires being substantially simultaneously severed therefrom. The nozzle has an aperture out through which the air escapes carrying the severed wires therewith for collection in a filter.Type: GrantFiled: February 28, 1992Date of Patent: November 23, 1993Assignee: International Business Machines CorporationInventors: Bernardo Hernandez, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer, Mark B. Ritter
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Patent number: 5233221Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.Type: GrantFiled: July 26, 1991Date of Patent: August 3, 1993Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong
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Patent number: 5229328Abstract: A method for bonding conductors to semiconductor chip contact pads wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.Type: GrantFiled: June 30, 1992Date of Patent: July 20, 1993Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong
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Patent number: 5205461Abstract: Method and apparatus for fluxlessly solder bonding a solder mound to a solder wettable surface. A heated gas, preferably a reducing or non-reactive gas, is directed at a solid solder mound. Gas is heated to a temperature sufficient to melt solder mound. The heated gas is directed at the molten solder mound at a momentum sufficient to disperse an oxide layer at the surface of the molten solder mound. Dispersing the oxide layer permits the molten solder to wet the solder wettable surface. The molten solder is cooled to form a solder bond.Type: GrantFiled: May 16, 1990Date of Patent: April 27, 1993Assignee: International Business Machines CorporationInventors: Harry R. Bickford, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer, John C. Zyzo
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Patent number: 5186632Abstract: An interconnecting and mounting technology involving the use of elastomeric properties. A mounting member grips, in a notch, the edge of a device supporting planar member with the device conductors brought to that edge. Conductors are provided at the surface of the mounting member, contacting the device conductors in the notch, and connecting with external wiring conductors on an external wiring planar member. The external wiring to device conductor interconnecting conductors can be on flex tape including elastomeric contact adaptation. Retention force for mounting member compression and mounting member to external wiring planar member retention is provided.Type: GrantFiled: September 20, 1991Date of Patent: February 16, 1993Assignee: International Business Machines CorporationInventors: Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer, Mark B. Ritter
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Patent number: 5117275Abstract: A conductor attachment wherein each conductor is mounted on a dielectric tape and has an attachment portion that is supported by the tape to an adjacent location a uniform distance from the bonding location and that contacts on a level with the plane of the underside of the tape. One conductor supporting tape has portions of the tape that extend into a central contacting area opening to contact locations at contacting pads in rows remote from the edge. Another supporting tape has window openings at the contacting locations. The conductor ends are brought into the level of the underside of the tape by a manufacturing rolling operation between an elastomer surface roller and a solid backing roller.Type: GrantFiled: October 24, 1990Date of Patent: May 26, 1992Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Raymond R. Horton, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong
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Patent number: 5093879Abstract: A direct optical connector (DOC) comprised of first and second members, each including a plurality of light emitting and light detecting locations, operative in combination with energy transfer media to form direct optical connections between the light emitting locations and the light detecting locations, wherein said first and second members are adapted for reclosable connection to each other whereupon the light emitting locations on one member are aligned with the light detecting locations on the other member. The first and second members of the preferred DOC are modular. Alternative forms of energy transfer media are used in various embodiments of the invention including lenslet arrays, imaging fiber plates (IFPs), and energy transfer fiber plates (ETFPs). These media have differing alignment criteria, differing degrees of immunity from crosstalk, differing degrees of transfer efficiency, different manufacturing costs, etc.Type: GrantFiled: June 22, 1990Date of Patent: March 3, 1992Assignee: International Business Machines CorporationInventors: Mark F. Bregman, William D. Brewer, Mitchell S. Cohen, Glen W. Johnson, Ismail C. Noyan, Modest M. Oprysko, Mark B. Ritter, Dennis L. Rogers, Jeanine M. Trewhella
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Patent number: 5093890Abstract: An optical bus for interconnecting electronic devices. The bus has a substrate with through-holes therein. An optically conductive material is disposed on one side of the substrate. The material fills the through-holes and forms a layer of predetermined thickness on this side of the substrate. In the outer surface of this layer there are facets or angled regions. The surface and facets are optically reflective. Cards or modules are optically connected by means of optical connectors to the through-holes on the opposite side of the substrate. Light emitted by the connector travels to the associated faceted surface from which it reflects towards other faceted surfaces from which it is partially transmitted and partially reflected to another connector. The arrangement permits optical communication between a plurality of electronic devices.Type: GrantFiled: November 27, 1990Date of Patent: March 3, 1992Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Ismail C. Noyan, Mark B. Ritter, Harold S. Stone
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Patent number: 5074969Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.Type: GrantFiled: March 7, 1991Date of Patent: December 24, 1991Assignee: IBM CorporationInventors: William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Linda C. Matthew, Ismail C. Noyan, Michael J. Palmer, Sampath Purushothaman, David L. Rath
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Patent number: 5047834Abstract: A semiconductor packaging technique employing a high Young's modulus, localized, external connection to pad, bond immobilizing member, together with, as needed, a low Young's modulus environmental protection covering member. A chip of Si or GaAs has an annulus of high Young's modulus epoxy over the line of external connections such as beam leads or wire bonds near the edge and a coating of silicone over the entire chip surface including the annulus.Type: GrantFiled: August 27, 1990Date of Patent: September 10, 1991Assignee: International Business Machines CorporationInventors: Caroline A. Kovac, Ismail C. Noyan
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Patent number: 5038195Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.Type: GrantFiled: February 9, 1990Date of Patent: August 6, 1991Assignee: IBMInventors: William D. Brewer, Kurt R. Grebe, Raymond R. Horton, Linda C. Matthew, Ismail C. Noyan, Michael J. Palmer, Sampath Purushothaman, David L. Rath
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Patent number: 5006925Abstract: A three dimensional chip package comprising a plurality of semiconductor substrates, each having at least one semiconductor electronic device mounted thereon; wherein at least a subset of said plurality substrates are physically joined to form an enclosure within which each substrate has at least one electrical contact location to another substrate; and further wherein at least one cooling channel is provided within said enclosure into which a cooling fluid may be introduced.Type: GrantFiled: November 22, 1989Date of Patent: April 9, 1991Assignee: International Business Machines CorporationInventors: Mark F. Bregman, Raymond R. Horton, Ismail C. Noyan, Michael J. Palmer