Patents by Inventor Issei Okada

Issei Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chain-structure metal powder, manufacturing method thereof, and conductivity-afforded material
    Publication number: 20040221683
    Abstract: A metal powder composed of nickel or an alloy thereof and used for a producing a conductivity-afforded material is provided, in which particles are integrated in particle aggregates having a chain structure. The average diameter of the particle aggregates is in the range of 30 to 200 nm, and the average length thereof is in the range of 0.5 to 50 &mgr;m. The increased conductivity bestowing effect can be obtained by the addition of a small amount of the metal powder.
    Type: Application
    Filed: February 23, 2004
    Publication date: November 11, 2004
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kohei Shimoda, Masatoshi Majima, Keiji Koyama, Issei Okada, Tetsuya Kuwabara