Abstract: A gripping device includes a partition film that is elastically deformable, a vacuum pump (deformation unit) that elastically deforms the partition film, and a cylindrical gripping portion that extends from the peripheral edge of the partition film and is elastically deformed in the central axis direction along with the elastic deformation of the partition film to wrap a workpiece. When the gripping portion comes into contact with the workpiece, a sealed space is formed between the workpiece, the gripping portion, and the partition film. Since the volume of the sealed space increases due to the elastic deformation of the partition film, a negative pressure is generated in the sealed space. The gripping device reliably grips the workpiece by a frictional force acting between the workpiece and the gripping portion and a suction force due to a negative pressure generated in the sealed space.

Abstract: A method for producing a three-dimensional molded object includes a solidified layer forming step, a cooling step, and a warpage measuring step. The solidified layer forming step is performing a recoating step and a solidifying step and maintaining a solidified layer at a molding temperature which is equal to or more than a martensitic transformation start temperature. The cooling step is cooling the solidified layer from the molding temperature to a cooling temperature which is less than the molding temperature and equal to or less than a martensitic transformation finish temperature. The warpage measuring step is measuring warpage of the solidified layer or warpage of a portion that deforms with a deformation of the solidified layer. The solidified layer forming step and the cooling step are repeated while a difference between the molding temperature and the cooling temperature is changed according to the magnitude of the warpage.

Abstract: A manufacturing method for a three-dimensional molded object includes repeating formation of a material layer and formation of a solidified layer, the material layer being formed by spreading a metal material on a base plate and the solidified layer being formed by irradiating the material layer with a laser beam or an electron beam, thereby molding a solidified body which is a laminated solidified layer on the base plate; and subjecting the base plate and the solidified body after molding to a heat treatment.

Abstract: The method for producing a three-dimensional molded object comprises a placing step, a molding step, and an upper surface processing step. The placing step is a step of placing a base plate and a mounting plate within a molding region. A first material powder layer is formed on the base plate; and the base plate is fixed to the mounting plate at a central part of the base plate to an extent that the base plate is not displaced. The molding step is a step of laminating sintered layers to form a sintered body. The sintered layers are laminated by repeatedly spreading material powder to form a material powder layer and irradiating the material powder layer with a beam to form the sintered layer. The upper surface processing step is a step of planarizing an upper surface of the sintered body to form a processed surface.

Abstract: In the solidified layer forming step, at least one solidified layer is formed. In the temperature lowering step, the solidified layer is cooled from the first temperature equal to or higher than a martensitic transformation finish temperature to the second temperature lower than the first temperature and equal to or lower than a martensitic transformation start temperature. In the temperature maintaining step, a temperature of the solidified layer lowered to the second temperature is maintained at a predetermined cutting temperature. In the roughing step, a surface of the solidified layer is processed so as to leave a predetermined processing margin.

Abstract: A manufacturing method for a three-dimensional molded object includes repeating formation of a material layer and formation of a solidified layer, the material layer being formed by spreading a metal material on a base plate and the solidified layer being formed by irradiating the material layer with a laser beam or an electron beam, thereby molding a solidified body which is a laminated solidified layer on the base plate; and subjecting the base plate and the solidified body after molding to a heat treatment.

Abstract: A method for producing a three-dimensional molded object includes a solidified layer forming step, a cooling step, and a warpage measuring step. The solidified layer forming step is performing a recoating step and a solidifying step and maintaining a solidified layer at a molding temperature which is equal to or more than a martensitic transformation start temperature. The cooling step is cooling the solidified layer from the molding temperature to a cooling temperature which is less than the molding temperature and equal to or less than a martensitic transformation finish temperature. The warpage measuring step is measuring warpage of the solidified layer or warpage of a portion that deforms with a deformation of the solidified layer. The solidified layer forming step and the cooling step are repeated while a difference between the molding temperature and the cooling temperature is changed according to the magnitude of the warpage.

Abstract: The method for producing a three-dimensional molded object comprises a placing step, a molding step, and an upper surface processing step. The placing step is a step of placing a base plate and a mounting plate within a molding region. A first material powder layer is formed on the base plate; and the base plate is fixed to the mounting plate at a central part of the base plate to an extent that the base plate is not displaced. The molding step is a step of laminating sintered layers to form a sintered body. The sintered layers are laminated by repeatedly spreading material powder to form a material powder layer and irradiating the material powder layer with a beam to form the sintered layer. The upper surface processing step is a step of planarizing an upper surface of the sintered body to form a processed surface.

Abstract: A three-dimensional (3D) printer includes a powder layer forming device (2) uniformly spreading material powder in a molding space (R) in a chamber (1) to form a powder layer (8), and a laser irradiation device (4) irradiating a laser beam (L) on a predetermined irradiation region of the powder layer to form a sintered layer (9). The powder layer forming device includes a recoater head (23) discharging the contained material powder to the molding space, a blade (31, 33) leveling the discharged material powder to a predetermined thickness, and a holding member (35, 37) holding the blade on the recoater head, wherein the blade is flexible, and the blade and the holding member are nonmagnetic and electrically conductive.

Abstract: A three-dimensional (3D) printer includes a powder layer forming device (2) uniformly spreading material powder in a molding space (R) in a chamber (1) to form a powder layer (8), and a laser irradiation device (4) irradiating a laser beam (L) on a predetermined irradiation region of the powder layer to form a sintered layer (9). The powder layer forming device includes a recoater head (23) discharging the contained material powder to the molding space, a blade (31, 33) leveling the discharged material powder to a predetermined thickness, and a holding member (35, 37) holding the blade on the recoater head, wherein the blade is flexible, and the blade and the holding member are nonmagnetic and electrically conductive.

Abstract: Each flip-flop-to-flip-flop path delay and a target machine cycle obtained in the stages of physical design and packaging design are used as input, and with respect to a path in which the path delay is not less than the target machine cycle, a closed loop including the path is extracted, and the timing of a clock signal of each flip-flop is adjusted so as to permit data transmission along the closed loop in a required cycle-number. At this time, a path along which data transmission is impossible in the target machine cycle or a closed loop including the path is listed in order to be modified. As methods of supplying a clock signal to each flip-flop, a plurality of methods different in the adjustable range of clock timing are combined and used.

Abstract: Each flip-flop-to-flip-flop path delay and a target machine cycle obtained in the stages of physical design and packaging design are used as input, and with respect to a path in which the path delay is not less than the target machine cycle, a closed loop including the path is extracted, and the timing of a clock signal of each flip-flop is adjusted so as to permit data transmission along the closed loop in a required cycle-number. At this time, a path along which data transmission is impossible in the target machine cycle or a closed loop including the path is listed in order to be modified. As methods of supplying a clock signal to each flip-flop, a plurality of methods different in the adjustable range of clock timing are combined and used.