Patents by Inventor Itaru Takeda

Itaru Takeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150310168
    Abstract: This invention provides a method for predicting a gene cluster including secondary metabolism-related genes with high accuracy, independent of information concerning core genes. Such method comprises: a step of identifying a region the gene arrangement of which is conserved in nucleotide sequence information of another genome as a gene cluster on the basis of the results of homology search conducted with the use of nucleotide sequence information of at least a pair of genomes; and a step of determining whether or not the gene cluster of interest includes secondary metabolism-related gems on the basis of the proportion of synteny-like regions within the gene cluster identified by the above step.
    Type: Application
    Filed: September 24, 2013
    Publication date: October 29, 2015
    Inventors: Masayuki MACHIDA, Maiko UMEMURA, Hideaki KOIKE, Itaru TAKEDA
  • Patent number: 8305768
    Abstract: In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.
    Type: Grant
    Filed: October 15, 2008
    Date of Patent: November 6, 2012
    Assignee: Mitsumi Electric Co., Ltd.
    Inventors: Itaru Takeda, Tomoyuki Kato, Yasuo Shoji
  • Publication number: 20090072008
    Abstract: In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.
    Type: Application
    Filed: October 15, 2008
    Publication date: March 19, 2009
    Applicant: Mitsumi Electric Co. Ltd.
    Inventors: Itaru TAKEDA, Tomoyuki Kato, Yasuo Shoji
  • Publication number: 20060215376
    Abstract: In a lead mounting method of mounting, onto a principal surface of a printed board, a lead to be connected to a terminal, a flat lead is prepared which lead has a mounted part to be disposed on the principal surface of the printed board and a connected part to be connected to the terminal. The flat lead is bent into an L shape so that the mounted part and the connected part are perpendicular to each other to obtain an L-shaped lead. The mounted part of the L-shaped lead is connected and fixed onto the principal surface of the printed board by soldering.
    Type: Application
    Filed: December 29, 2005
    Publication date: September 28, 2006
    Applicant: Mitsumi Electric Co. Ltd.
    Inventors: Itaru Takeda, Tomoyuki Kato, Yasuo Shoji
  • Patent number: 6593526
    Abstract: In a mounting mechanism of a metal plate on a printed board housed in a portable telephone or the like, a metal plate connected with a terminal portion of a cell or the like is joined to a land via solder, and a cut-out portion is provided at a joining portion of the metal plate which is joined to the land, and the total length of fillets of the solder between the land and the joining portion is extended by the cut-out portion. Accordingly, the mounting strength of a metal plate mounted to the land disposed on the printed board can be improved.
    Type: Grant
    Filed: June 13, 2001
    Date of Patent: July 15, 2003
    Assignee: Mitsumi Electric Co., Ltd.
    Inventor: Itaru Takeda
  • Publication number: 20020038723
    Abstract: In a mounting mechanism of a metal plate on a printed board housed in a portable telephone or the like, a metal plate connected with a terminal portion of a cell or the like is joined to a land via solder, and a cut-out portion is provided at a joining portion of the metal plate which is joined to the land, and the total length of fillets of the solder between the land and the joining portion is extended by the cut-out portion. Accordingly, the mounting strength of a metal plate mounted to the land disposed on the printed board can be improved.
    Type: Application
    Filed: June 13, 2001
    Publication date: April 4, 2002
    Inventor: Itaru Takeda
  • Patent number: 5080959
    Abstract: A multilayer tile, wherein the tile-materials of the first and third layers are substantially equal to each other in shrinkage during drying and firing and in thermal expansion coefficient after firing.
    Type: Grant
    Filed: December 19, 1988
    Date of Patent: January 14, 1992
    Assignee: Inax Corporation
    Inventors: Hideo Tanaka, Itaru Takeda, Hiroyuki Tada