Patents by Inventor Itsuhiro Hatanaka
Itsuhiro Hatanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240093060Abstract: Provided is a hot-melt PSA composition having a low viscosity when melted with heat and capable of suitably forming a PSA layer. A hot-melt PSA composition comprising a base polymer is provided. The base polymer comprises acrylic polymers A and B. The acrylic polymer A is a polymer of monomers comprising, as the primary component, a (meth)acrylic monomer A having an alkyl group with 4 to 8 carbon atoms. The acrylic polymer B is a polymer of monomers comprising, as a primary component, a (meth)acrylic monomer B having an alkyl group with 9 to 12 carbon atoms. In the base polymer, with the total amount of the acrylic polymers A and B being 100% by weight, the acrylic polymer B content is 10% by weight or more and 90% by weight or less.Type: ApplicationFiled: January 26, 2022Publication date: March 21, 2024Applicant: NITTO DENKO CORPORATIONInventors: Akinori TAMURA, Itsuhiro HATANAKA, Nobukazu NEGISHI
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Publication number: 20230340301Abstract: Provided is a hot-melt pressure-sensitive adhesive composition which enables to form a pressure-sensitive adhesive layer without allowing the progression of rapid gelation at the time of heating and melting. The pressure-sensitive adhesive composition provided by the present invention is a solvent-free hot-melt pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition includes a base polymer, an isocyanate crosslinking agent, and a tackifier T which is a reaction product of a compound X and a compound Y. A content of the tackifier T with respect to 100 parts by weight of the base polymer is 20 parts by weight or more and 40 parts by weight or less.Type: ApplicationFiled: February 17, 2021Publication date: October 26, 2023Applicant: NTTO DENKO CORPORATIONInventors: Nobukazu NEGISHI, Itsuhiro HATANAKA, Hiroaki TAKAHASHI
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Publication number: 20230096432Abstract: Provided is a hot-melt pressure-sensitive adhesive composition which enables to form a pressure-sensitive adhesive layer without allowing the progression of rapid gelation at the time of heating and melting. The pressure-sensitive adhesive composition provided by the present invention is a solvent-free hot-melt pressure-sensitive adhesive composition. The pressure-sensitive adhesive composition includes a base polymer, an isocyanate crosslinking agent, and a tackifier A represented by the following general formula (1): R—[(CH3)2C6H2—(CH2O)n—CH2]m—OH (1) (in the general formula (1), R is a hydrogen atom or a hydroxyl group, m is 9 to 16, and n is 0 to 3). A content of the tackifier A with respect to 100 parts by weight of the base polymer is 1 part by weight to 10 parts by weight.Type: ApplicationFiled: February 17, 2021Publication date: March 30, 2023Applicant: NITTO DENKO CORPORATIONInventors: Nobukazu NEGISHI, Itsuhiro HATANAKA, Hiroaki TAKAHASHI
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Publication number: 20230052577Abstract: A PSA composition comprising a block copolymer of a monovinyl-substituted aromatic compound and a conjugated diene compound, a tackifier resin, and a softening agent is provided. The tackifier resin comprises a natural product-based tackifier resin (A) having a softening point higher than 80° C. and containing no aromatic ring, and a petroleum-based tackifier resin (B) having a softening point higher than 100° C. and containing an aromatic ring. The content of the tackifier resin (A) is 40 to 120 parts by weight, the content of the tackifier resin (B) is 5 to 40 parts by weight, the total amount of the tackifier resin is 60 to 160 parts by weight, and the content of the softening agent is 5 to 40 parts by weight with respect to 100 parts by weight of the block copolymer, with respect to 100 parts by weight of the block copolymer.Type: ApplicationFiled: August 3, 2022Publication date: February 16, 2023Applicant: NITTO DENKO CORPORATIONInventors: Muneshige NAKAGAWA, Hiroaki TAKAHASHI, Fumika KAWATAKE, Nobukazu NEGISHI, Itsuhiro HATANAKA
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Patent number: 11319462Abstract: The pressure sensitive adhesive sheet is a sheet shaped pressure sensitive adhesive including an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment, and a content of the urethane-based segment is 3 to 30 parts by weight based on 100 parts by weight of the acryl-based segment. The urethane-based segment includes at least one urethane chain selected from the group consisting of a polyether urethane and a polyester urethane. The content of the urethane-based segment other than the polyether urethane-based segment is 15 parts by weight or less based on 100 parts by weight of the acryl-based segment.Type: GrantFiled: January 29, 2019Date of Patent: May 3, 2022Assignee: NITTO DENKO CORPORATIONInventors: Itsuhiro Hatanaka, Masahito Niwa, Taiki Shimokuri, Shou Takarada, Takahiro Nonaka, Keisuke Hirano, Fumika Kawatake, Mika Ikemura
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Patent number: 11319470Abstract: A pressure sensitive adhesive includes an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment. In the acryl-based base polymer, the content of the urethane-based segment is 3 to 20 parts by weight based on 100 parts by weight of the acryl-based segment. A pressure sensitive adhesive sheet can be obtained by applying a pressure sensitive adhesive composition on a substrate in a layer form. The pressure sensitive adhesive composition may be curable and may include a polymerization initiator. In formation of the pressure sensitive adhesive sheet, the curable pressure sensitive adhesive composition may be, as necessary.Type: GrantFiled: January 29, 2019Date of Patent: May 3, 2022Assignee: NITTO DENKO CORPORATIONInventors: Masahito Niwa, Itsuhiro Hatanaka, Taiki Shimokuri, Shou Takarada, Takahiro Nonaka, Keisuke Hirano, Fumika Kawatake, Mika Ikemura
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Publication number: 20190233683Abstract: The pressure sensitive adhesive sheet is a sheet shaped pressure sensitive adhesive including an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment, and a content of the urethane-based segment is 3 to 30 parts by weight based on 100 parts by weight of the acryl-based segment. The urethane-based segment includes at least one urethane chain selected from the group consisting of a polyether urethane and a polyester urethane. The content of the urethane-based segment other than the polyether urethane-based segment is 15 parts by weight or less based on 100 parts by weight of the acryl-based segment.Type: ApplicationFiled: January 29, 2019Publication date: August 1, 2019Applicant: NITTO DENKO CORPORATIONInventors: Itsuhiro HATANAKA, Masahito NIWA, Taiki SHIMOKURI, Shou TAKARADA, Takahiro NONAKA, Keisuke HIRANO, Fumika KAWATAKE, Mika IKEMURA
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Publication number: 20190233681Abstract: A pressure sensitive adhesive includes an acryl-based base polymer. The acryl-based base polymer contains an acryl-based segment and a urethane-based segment. In the acryl-based base polymer, the content of the urethane-based segment is 3 to 20 parts by weight based on 100 parts by weight of the acryl-based segment. A pressure sensitive adhesive sheet can be obtained by applying a pressure sensitive adhesive composition on a substrate in a layer form. The pressure sensitive adhesive composition may be curable and may include a polymerization initiator. In formation of the pressure sensitive adhesive sheet, the curable pressure sensitive adhesive composition may be, as necessary.Type: ApplicationFiled: January 29, 2019Publication date: August 1, 2019Applicant: NITTO DENKO CORPORATIONInventors: Masahito NIWA, Itsuhiro HATANAKA, Taiki SHIMOKURI, Shou TAKARADA, Takahiro NONAKA, Keisuke HIRANO, Fumika KAWATAKE, Mika IKEMURA
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Publication number: 20170121481Abstract: Provided is a resin foam (13) that highly restrains the occurrence of display irregularities in a display unit when the resin foam is used in a touch-screen-equipped device (1), where the display irregularities may occur with user's touch operations. The resin foam (13) according to the present invention is obtained by expansion of a resin composition including a resin. The resin foam has a 25% compression load of 0.1 N/cm2 to 8.0 N/cm2 and is used in the touch-screen-equipped device (1). The resin is preferably at least one resin selected from the group consisting of polyolefin resins, polyester resins, and acrylic resins.Type: ApplicationFiled: March 12, 2015Publication date: May 4, 2017Applicant: NITTO DENKO CORPORATIONInventors: Itsuhiro HATANAKA, Tetsuya OTSUKA, Yusuke YAMANARI, Hiroyuki SUZUKI, Kazumichi KATO, Kohei DOI
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Patent number: 9522985Abstract: There is provided a polyester elastomer foam having a micro and uniform cell structure. The polyester elastomer foam is formed by allowing a polyester elastomer composition containing a polyester elastomer and a surface-treated inorganic substance (except hydroxides) to expand. A residue on a 166 mesh sieve in the surface-treated inorganic substance (except hydroxides) is preferably not more than 0.01%.Type: GrantFiled: July 10, 2012Date of Patent: December 20, 2016Assignee: NITTO DENKO CORPORATIONInventors: Kiyoaki Kodama, Makoto Saitou, Kazumichi Kato, Itsuhiro Hatanaka
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Patent number: 9156959Abstract: There is provided a polyester elastomer which is excellent in compression set characteristics and has a micro cell structure. The polyester elastomer foam is formed by allowing a polyester elastomer composition containing a polyester elastomer having a melting point of 180 to 240° C. and an epoxy-modified polymer to expand. The epoxy-modified polymer is an epoxy-modified polymer having a weight average molecular weight of 5,000 to 100,000 and an epoxy equivalent of 100 to 3000 g/eq.Type: GrantFiled: July 3, 2012Date of Patent: October 13, 2015Assignee: NITTO DENKO CORPORATIONInventors: Kazumichi Kato, Makoto Saitou, Kiyoaki Kodama, Itsuhiro Hatanaka
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Patent number: 9150716Abstract: There is provided a resin foam excellent in dustproof performance, particularly dustproof performance in a dynamic environment. The resin foam of the present invention has a thickness recovery ratio of 65% or more, wherein the thickness recovery ratio is defined as a ratio of a thickness 1 second after releasing a compressed state to an initial thickness, when the resin foam is compressed for 1 minute in the thickness direction so as to give a thickness equal to 20% of the initial thickness in a 23° C. atmosphere; and then the compressed state is released in a 23° C. atmosphere.Type: GrantFiled: November 29, 2011Date of Patent: October 6, 2015Assignee: NITTO DENKO CORPORATIONInventors: Makoto Saitou, Itsuhiro Hatanaka, Kazumichi Kato, Kiyoaki Kodama
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Publication number: 20150218422Abstract: A resin foam having a repulsive stress when compressed by 80% of 1.0 to 9.0 N/cm2, a maximum breaking strength of 1.0 to 10.0 MPa, and a ratio of the maximum breaking strength to a breaking strength in a direction orthogonal to a maximum breaking strength direction (maximum breaking strength/breaking strength in the direction orthogonal to the maximum breaking strength direction) of 1.0 to 5.0. The maximum breaking strength is defined as: a resin foam in a sheet form is measured for a breaking strength in an arbitrary direction in the horizontal direction of the sheet; next, the arbitrary direction is rotated about an axis by 10° intervals to measure a breaking strength in each direction; a direction where the highest breaking strength is measured is defined as the maximum breaking strength direction; and a breaking strength in the maximum breaking strength direction is defined as the maximum breaking strength.Type: ApplicationFiled: May 21, 2013Publication date: August 6, 2015Applicant: NITTO DENKO CORPORATIONInventors: Kazumichi Kato, Makoto Saitou, Itsuhiro Hatanaka, Kiyoaki Kodama
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Publication number: 20150174865Abstract: A repeelable foam laminate for use of an electronic device has a structure in which a layer containing a polyolefin-based resin is laminated to at least one surface of a foam layer, and surface roughness Sa of the layer containing a polyolefin-based resin is no more than 10 micrometers.Type: ApplicationFiled: July 22, 2013Publication date: June 25, 2015Applicant: NITTO DENKO CORPORATIONInventors: Itsuhiro Hatanaka, Yusuke Yamanari
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Publication number: 20150118481Abstract: The present invention has the object of providing a resin foam and a foam material that exhibits superior dust resistance characteristics in a dynamic environment at the same time as having excellent light shielding characteristics, and is a resin foam having a repulsive force during an 80% compression at 23 degrees C. of 0.1 to 5.0 N/cm2, a surface coverage rate of a foam surface of at least 50%, and a thickness recovery rate as defined below of at least 50%, the thickness recovery rate is defined as the ratio to an initial thickness of the thickness one second after release of a compressed state that is obtained by releasing a compressed state after compressing resin foam for one minute to a thickness of 20% relative to the initial thickness.Type: ApplicationFiled: June 5, 2013Publication date: April 30, 2015Applicant: NITTO DENKO CORPORATIONInventors: Kiyoaki Kodama, Makoto Saitou, Itsuhiro Hatanaka, Kazumichi Kato
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Patent number: 8846774Abstract: The present invention relates to a resin composition for a polyolefin resin foam, including: a polyolefin (A) having a melt flow rate (MFR) at a temperature of 230° C. of 0.2 to 0.7 g/10 min and a melt tension at break measured at a temperature of 190° C. of 30 cN or more; and a polyolefin (B) having a melt flow rate (MFR) at a temperature of 230° C. of 1.5 to 10 g/10 min and a melt tension at break measured at a temperature of 190° C. of 10 cN or more, in which the polyolefin (B) is contained in an amount of from 15 to 75 parts by weight based on 100 parts by weight of the polyolefin (A).Type: GrantFiled: July 27, 2012Date of Patent: September 30, 2014Assignee: Nitto Denko CorporationInventors: Naomi Jintoku, Itsuhiro Hatanaka, Tetsurou Kobayashi
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Publication number: 20140242371Abstract: There is provided a resin foam sheet low in the apparent density and thin and flexible, and excellent in the stability in winding-up (wind-up stability). The resin foam sheet according to the present invention has an apparent density of 0.03 to 0.30 g/cm3, a compression stress at 50%-compression of not more than 5.0 N/cm2, a thickness of not less than 0.05 mm and not more than 0.40 mm, a length of not less than 5 m, and a width of not less than 300 mm. The value determined by the following expression (1) of the resin foam sheet is preferably not more than 25%.Type: ApplicationFiled: September 10, 2012Publication date: August 28, 2014Applicant: NITTO DENKO CORPORATIONInventors: Itsuhiro Hatanaka, Makoto Saitou, Kazumichi Kato
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Publication number: 20140162050Abstract: There is provided a polyester elastomer foam having a micro and uniform cell structure. The polyester elastomer foam is formed by allowing a polyester elastomer composition containing a polyester elastomer and a surface-treated inorganic substance (except hydroxides) to expand. A residue on a 166 mesh sieve in the surface-treated inorganic substance (except hydroxides) is preferably not more than 0.01%.Type: ApplicationFiled: July 10, 2012Publication date: June 12, 2014Applicant: NITTO DENKO CORPORATIONInventors: Kiyoaki Kodama, Makoto Saitou, Kazumichi Kato, Itsuhiro Hatanaka
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Publication number: 20140011902Abstract: To be provided is a foam waterproofing material superior in waterproofness and flexible enough to be compatible with further minute clearance. The foam waterproofing material according to the present invention is a waterproofing material including a foam having a thickness of 0.1 to 1.0 mm, characterized in that the foam has a micro cell structure with an average cell diameter of 10 to 60 ?m and an apparent density of 0.01 to 0.060 g/cm3. In the foam waterproofing material, the repulsive load when compressed to 0.1 mm (0.1 mm-compressive repulsion force) of the foam is preferably 0.01 to 0.1 MPa. The foam preferably has a closed-cell structure or a semi-open- and semi-closed-cell structure. In addition, the foam may have a pressure-sensitive adhesive layer on one or both faces thereof. The pressure-sensitive adhesive layer is preferably formed on the foam via a film layer.Type: ApplicationFiled: July 2, 2013Publication date: January 9, 2014Applicant: NITTO DENKO CORPORATIONInventors: Hiroki Fujii, Kazumichi Kato, Itsuhiro Hatanaka
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Publication number: 20130309483Abstract: The invention has an object to provide a foam laminate with excellent repeelability for electric or electronic devices. Also, the invention has an object to provide a foam laminate with excellent repeelability and excellent heat resistance for electric or electronic devices. A foam laminate for electric or electronic devices of the invention has, on at least one side of a foam layer, a pressure-sensitive adhesive layer having a crystal melting energy of 50 J/g or less, obtained according to the following: the crystal melting energy is a melting heat (J/g) obtained during a second heating in differential scanning calorimetry conducted under conditions of heating at a heating rate of 10° C./min to melt (a first heating), followed by cooling down to ?50° C. at a cooling rate of 10° C./min (a first cooling), and then heating from ?50° C. at a heating rate of 10° C./min (the second heating) (according to JIS K 7122).Type: ApplicationFiled: January 16, 2012Publication date: November 21, 2013Applicant: NITTO DENKO CORPORATIONInventors: Naomi Watanabe, Itsuhiro Hatanaka