Patents by Inventor Ituro Kusunoki

Ituro Kusunoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing and using a carrier tape for bonding IC devices
    Patent number: 5019209
    Abstract: A carrier tape has a plurality of rows.times.a plurality of columns of IC device holes and two pairs of sprocket holes. A plurality of finger leads extending into each IC device hole and a conductive lead for connecting all of the finger leads are formed on the carrier tape. While the carrier tape is conveyed with feed teeth of a sprocket being meshed with one pair of sprocket holes, the finger leads and the conductive leads are formed, and solder is plating on both of the leads. Only in a bonding step, the carrier tape is conveyed with the feed teeth of the sprocket being meshed with the other pair of sprocket holes. Since the sprocket holes used in the bonding step are not deformed, highly precise positioning of IC devices required in bonding can be efficiently achieved.
    Type: Grant
    Filed: September 10, 1990
    Date of Patent: May 28, 1991
    Assignee: Casio Computer Co., Ltd.
    Inventors: Takashi Hiraide, Ituro Kusunoki, Joji Tajima
  • Carrier tape for bonding IC devices and method of using the same
    Patent number: 4980219
    Abstract: A carrier tape has a plurality of rows.times.a plurality of columns of IC device holes and two pairs of sprocket holes. A plurality of finger leads extending into each IC device hole and a conductive lead for connecting all of the finger leads are formed on the carrier tape. While the carrier tape is conveyed with feed teeth of a sprocket being meshed with one pair of sprocket holes, the finger leads and the conductive leads are formed, and solder is plating on both of the leads. Only in a bonding step, the carrier tape is conveyed with the feed teeth of the sprocket being meshed with the other pair of sprocket holes. Since the sprocket holes used in the bonding step are not deformed, highly precise positioning of IC devices required in bonding can be efficiently achieved.
    Type: Grant
    Filed: March 31, 1989
    Date of Patent: December 25, 1990
    Assignee: Casio Computer Co., Ltd.
    Inventors: Takashi Hiraide, Ituro Kusunoki, Joji Tajima