Abstract: A photolithography system includes an optical system, an actuation apparatus, and a control module. The optical system includes an optical source that produces a pulsed light beam traveling along a beam path; a plurality of optical components positioned between the optical source and a photolithography exposure apparatus, at least some of the plurality of optical components configured to receive the pulsed light beam and direct the pulsed light beam to the photolithography exposure apparatus; and an optical element positioned to interact with the pulsed light beam. The actuation apparatus is coupled to the optical element. The actuation apparatus is configured to adjust a physical property of the optical element based on a control signal from the control module to thereby adjust a polarization of the pulsed light beam.

Abstract: A photolithography system includes an optical system, an actuation apparatus, and a control module. The optical system includes an optical source that produces a pulsed light beam traveling along a beam path; a plurality of optical components positioned between the optical source and a photolithography exposure apparatus, at least some of the plurality of optical components configured to receive the pulsed light beam and direct the pulsed light beam to the photolithography exposure apparatus; and an optical element positioned to interact with the pulsed light beam. The actuation apparatus is coupled to the optical element. The actuation apparatus is configured to adjust a physical property of the optical element based on a control signal from the control module to thereby adjust a polarization of the pulsed light beam.

Abstract: A method of controlling a spectral property of a light beam includes directing a light beam to a lithography exposure apparatus configured to create a pattern on a wafer; receiving information representative of a spectral property of the light beam; receiving information representative of an optical imaging condition of the lithography exposure apparatus; estimating a characteristic value of the light beam based on the received spectral property information and the received optical imaging condition information; determining whether the estimated light beam characteristic value matches a target light beam characteristic value; and if it is determined that the estimated light beam characteristic value does not match the target light beam characteristic value, adjusting the spectral property of the light beam.

Abstract: A method of controlling a spectral property of a light beam includes directing a light beam to a lithography exposure apparatus configured to create a pattern on a wafer; receiving information representative of a spectral property of the light beam; receiving information representative of an optical imaging condition of the lithography exposure apparatus; estimating a characteristic value of the light beam based on the received spectral property information and the received optical imaging condition information; determining whether the estimated light beam characteristic value matches a target light beam characteristic value; and if it is determined that the estimated light beam characteristic value does not match the target light beam characteristic value, adjusting the spectral property of the light beam.