Abstract: Methods and apparatus for reworking printed circuit boards carrying surface mounted components by removing faulty or improperly connected components and replacing them with new components, incorporate an X-Y table for clamping the board with the target component positioned on a vertical working axis, using a heated, component-gripping vacuum head movably mounted for vertical movement and angularly rotatable pivoting adjustment, and jets of hot compressed air directed at the component's peripheral terminal leads, bringing them to solder-melting temperature, with a reversible angular drive motor connected to deliver torque to the head gently or abruptly or in reciprocating fashion, producing pivoting head movement over a small angle of rotation, shearing the adhesive which bonds the component in place, all under control of a programmed microcomputer governing operating sequences selected and initiated by the operator.