Abstract: In a half-bridge module for an inverter, semiconductor switches and signal and power connections are arranged on a first surface of a substrate and coated with a casting compound, and external connection contacts for the signal and power connections extend through the casting compound to the exterior. In various embodiments, the external connection contacts extend from the casting compound from four second surfaces that are orthogonal to the first surface, and have a first right angle bend outside the casting compound, such that the ends of the external connection contacts are perpendicular to the first surface. The invention also relates to a corresponding inverter.

Abstract: A storage choke assembly for a multi-phase DC-to-DC converter for converting a DC input voltage to a DC charging voltage for charging a vehicle battery in an electric vehicle, fuel cell vehicle, or hybrid vehicle, includes a storage choke that has one or more coils, and a housing in which the storage choke is accommodated, wherein the housing has a first housing section and a second housing section, wherein the first housing section is made of a first thermosetting plastic and is in direct contact with one or more coils, wherein the second housing section is made of a second thermosetting plastic, wherein the first thermosetting plastic has a higher thermal conductivity than the second thermosetting plastic.

Abstract: An inductor includes a winding that has a predefined inductance, a soft magnetic winding core, and a housing that has a cooling surface for discharging heat from the inductor. This housing encases the winding.

Abstract: A link capacitor for a motor vehicle has a housing, a first busbar and a second busbar for electrical contact to the link capacitor, and at least one coupling element. The housing accommodates a winding for the link capacitor. The first busbar and second busbar are connected to the winding. The coupling element is on the housing and designed to couple the link capacitor to an adjacent link capacitor and/or to a support element.

Abstract: An inverter includes a DC input, a link capacitor including a plurality of input contacts fitted to a capacitor housing, a plurality of half-bridges, each including semiconductor switching elements for converting the DC current into an AC current having a plurality of phase currents, wherein the half-bridges are arranged in a row along a transverse direction to the inverter, a positive DC conductor rail and a negative DC conductor rail for the infeed of DC current to the half-bridges, wherein the positive and/or negative DC conductor rail extends in a transverse direction to the inverter over the row of half-bridges, such that the width of the positive and/or negative DC conductor rail extends to the width of the row of half-bridges, an AC conductor rail assembly for the output of AC current to the electric drive, and a cooler for cooling the half-bridges.

Abstract: A half-bridge having power connections and signal connections shaped from a leadframe, the signal connections electrically connected to semiconductor switching elements so that they can be switched by the signal connections, and the power connections are electrically connected to the switching elements in so that they switch an electrical power transmission between the power connections. The switching elements are embedded in a modular layer system including a contact-connection plane and a metallization for contact-connecting the switching elements, the signal connections and the power connections are arranged on a first surface of the substrate.

Abstract: A power module (10) for an inverter (100) for operating an electric drive in an electric vehicle or a hybrid vehicle, the power module (10) comprising a plurality of half-bridges (12A, 12B, 12C), which each comprise a substrate, a plurality of semiconductor switching elements, a positive DC power connection (14), a negative DC power connection (16), an AC power connection and a plurality of signal connections (18), wherein the signal connections (18) are electrically connected to the semiconductor switching elements in each half-bridge (12A, 12B, 12C) in such a way that the semiconductor switching elements can be switched by means of the signal connections (18), wherein the power connections (14, 16) are electrically connected to the semiconductor switching elements in such a way that the semiconductor switching elements permit or interrupt an electrical power transmission between the power connections (14, 16), wherein a respective DC busbar (24, 26), which is connected to the respective DC power connection

Abstract: A half-bridge having semiconductor switch elements embedded in a modular layer system that comprises a contact plane and a metal plating for establishing contact with the semiconductor switch elements, wherein the signal connections and power connections are located on a first surface of the substrate, wherein the modular layer system, signal connections and power connections are cast in a casting compound, wherein external sections of the power connections and/or signal connections formed in the conductor frame each extend from the casting compound, from a second surface that is orthogonal to the first surface, wherein the external sections each have an end that is perpendicular to the first surface.

Abstract: What is provided is a damping arrangement for power electronics applications having a circuit board, and a current sensor electrically connected to the circuit board, which current sensor is held in a current sensor housing, and an electrical contact pin passing through the circuit board and surrounded by the current sensor housing, wherein a damping element is arranged between the current sensor housing and the electrical contact pin.

Abstract: In a half-bridge module for an inverter, semiconductor switches and signal and power connections are arranged on a first surface of a substrate and coated with a casting compound, and external connection contacts for the signal and power connections extend through the casting compound to the exterior. The external connection contacts may extend from the casting compound from four second surfaces that are orthogonal to the first surface, and may have a first right angle bend outside the casting compound, such that the ends of the external connection contacts are perpendicular to the first surface. The invention also relates to a corresponding inverter.

Abstract: The invention relates to a half-bridge module for an inverter in an electric drive for an electric vehicle or a hybrid vehicle, comprising a substrate, semiconductor switches arranged on the substrate, power connections, and signal connections, wherein the signal connections are electrically connected to the semiconductor switches such that the semiconductor switches can be switched via the signal connections, and wherein the power connections are electrically connected to the semiconductor switches such that the semiconductor switches allow or interrupt electricity transmission between the power connections. The half-bridge module according to the invention is distinguished in that the semiconductor switches are in electrical contact in part via bond wires and in part via lead frames. The invention also relates to a corresponding inverter.

Abstract: What is provided is a damping arrangement for power electronics applications having a circuit board, and a current sensor electrically connected to the circuit board, which current sensor is held in a current sensor housing, and an electrical contact pin passing through the circuit board and surrounded by the current sensor housing, wherein a damping element is arranged between the current sensor housing and the electrical contact pin.