Patents by Inventor Iwan Ricardo Grau

Iwan Ricardo Grau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Activate loading mechanism
    Patent number: 11019751
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a heat source, a heat sink over the heat source, and an active loading mechanism coupled to the heat sink, where the heat sink is thermally decoupled from the heat source when the active loading mechanism is not activated and the heat sink is thermally coupled to the heat source when the active loading mechanism is activated. In an example, the active loading mechanism includes shape memory material and the shape memory material is activated when a temperature of the heat source satisfies a threshold temperature.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: May 25, 2021
    Assignee: Intel Corporation
    Inventors: Iwan Ricardo Grau, Erich Nolan Ewy
  • ACTIVATE LOADING MECHANISM
    Publication number: 20200229318
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to enable an active loading mechanism. The electronic device can include a heat source, a heat sink over the heat source, and an active loading mechanism coupled to the heat sink, where the heat sink is thermally decoupled from the heat source when the active loading mechanism is not activated and the heat sink is thermally coupled to the heat source when the active loading mechanism is activated. In an example, the active loading mechanism includes shape memory material and the shape memory material is activated when a temperature of the heat source satisfies a threshold temperature.
    Type: Application
    Filed: March 27, 2020
    Publication date: July 16, 2020
    Applicant: Intel Corporation
    Inventors: Iwan Ricardo Grau, Erich Nolan Ewy