Patents by Inventor Iwao Maekawa
Iwao Maekawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7781896Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: June 13, 2008Date of Patent: August 24, 2010Assignee: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20080290529Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: June 13, 2008Publication date: November 27, 2008Applicant: Hitachi Chemical Co., Ltd.Inventors: Shinji TAKEDA, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7387914Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: April 24, 2006Date of Patent: June 17, 2008Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7326440Abstract: There is disclosed a sheet-state ink-jet recording material which comprises a water-resistant support and at least one ink-receptive layer provided on the support, wherein at least one of the ink-receptive layers contains inorganic fine particles having an average primary particle size of 30 nm or less and a hydrophilic binder, and a longitudinal direction of the sheet-state ink-jet recording material is cut at a right angle to a flowing direction of the recording material at a time of coating the ink-receptive layer.Type: GrantFiled: June 26, 2003Date of Patent: February 5, 2008Assignee: Mitsubishi Paper Mills LimitedInventors: Yukio Tokunaga, Iwao Maekawa
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Publication number: 20060180903Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: April 24, 2006Publication date: August 17, 2006Applicant: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7078094Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: July 15, 2004Date of Patent: July 18, 2006Assignee: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7057265Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: May 2, 2003Date of Patent: June 6, 2006Assignee: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 7012320Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: February 20, 2001Date of Patent: March 14, 2006Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 6991330Abstract: Disclosed are an ink-jet recording material for proof including a water-resistant support and at least one ink-receptive layer containing inorganic fine particles and a hydrophilic binder provided on the support, wherein the water-resistant support has a center line average roughness Ra75 with a cut off value of 0.8 mm according to JIS-B0601 of 1.0 ?m or less, and an uppermost ink-receptive layer farthest from the water-resistant support contains a colorless or white matting agent having an average particle size of 1 to 10 ?m and a colored pigment having an average particle size of 1 ?m or less, and use of the same for proof.Type: GrantFiled: April 24, 2003Date of Patent: January 31, 2006Assignee: Mitsubishi Paper Mills LimitedInventor: Iwao Maekawa
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Patent number: 6855579Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: February 20, 2001Date of Patent: February 15, 2005Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20040253770Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: July 15, 2004Publication date: December 16, 2004Applicant: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Patent number: 6825249Abstract: Provided are a laminating method and machine for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe. leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position B by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2. It is therefore possible to bond a film-shaped organic die-bonding material under compression on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip.Type: GrantFiled: July 14, 2000Date of Patent: November 30, 2004Assignee: Hitachi Chemical Co., Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki, Iwao Maekawa, Akio Kotato, Yuusuke Miyamae, Tadaji Satou, Makoto Saitou, Tooru Kikuchi, Akira Kageyama, Aizou Kaneda
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Publication number: 20040086665Abstract: There is disclosed a sheet-state ink-jet recording material which comprises a water-resistant support and at least one ink-receptive layer provided on the support, wherein at least one of the ink-receptive layers contains inorganic fine particles having an average primary particle size of 30 nm or less and a hydrophilic binder, and a longitudinal direction of the sheet-state ink-jet recording material is cut at a right angle to a flowing direction of the recording material at a time of coating the ink-receptive layer.Type: ApplicationFiled: June 26, 2003Publication date: May 6, 2004Inventors: Yukio Tokunaga, Iwao Maekawa
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Patent number: 6717242Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 Mpa or less at a temperature of 259° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: GrantFiled: February 20, 2001Date of Patent: April 6, 2004Assignee: Hitachi Chemical Company, Ltd.Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20030203133Abstract: Disclosed are an ink-jet recording material for proof comprising a water-resistant support and at least one ink-receptive layer containing inorganic fine particles and a hydrophilic binder provided on the support, wherein the water-resistant support has a center line average roughness Ra75 with a cut off value of 0.8 mm according to JIS-B0601 of 1.0 &mgr;m or less, and an uppermost ink-receptive layer farthest from the water-resistant support contains a colorless or white matting agent having an average particle size of 1 to 10 &mgr;m and a colored pigment having an average particle size of 1 &mgr;m or less, and use of the same for proof.Type: ApplicationFiled: April 24, 2003Publication date: October 30, 2003Inventor: Iwao Maekawa
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Publication number: 20030160337Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: May 2, 2003Publication date: August 28, 2003Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20030054145Abstract: There is disclosed a sheet-state ink-jet recording material which comprises a water-resistant support and at least one ink-receptive layer provided on the support, wherein at least one of the ink-receptive layers contains inorganic fine particles having an average primary particle size of 30 nm or less and a hydrophilic binder, and a longitudinal direction of the sheet-state ink-jet recording material is cut at a right angle to a flowing direction of the recording material at a time of coating the ink-receptive layer.Type: ApplicationFiled: August 30, 2002Publication date: March 20, 2003Inventors: Yukio Tokunaga, Iwao Maekawa
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Publication number: 20010035533Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: February 20, 2001Publication date: November 1, 2001Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20010016384Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: February 20, 2001Publication date: August 23, 2001Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
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Publication number: 20010009780Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.Type: ApplicationFiled: February 20, 2001Publication date: July 26, 2001Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikiuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda