Abstract: The invention provides a method and an apparatus for measuring a flow rate which can determine a flow rate of a fluid, particularly a slowly flowing fluid, with an improved accuracy, without requiring a complicated flow rate-measuring system.

Abstract: Problems: The invention provides a method and an apparatus for measuring a flow rate which can determine a flow rate of a fluid, particularly a slowly flowing fluid, with an improved accuracy, without requiring a complicated flow rate-measuring system.

Abstract: The present invention relates to a method and system for managing data. The invention is intended to provide a data managing method and data managing system capable of classifying created files and managing them without depending on the operator's ability. The method is for use in an analytical instrument having a function of imaging a specimen and a function of analyzing the specimen. The area of the specimen from which the image has been taken is analyzed totally or partially. The analytical instrument includes an analytical data managing unit for recording the resulting data hierarchically in a corresponding manner to the specimen area.

Abstract: The present invention relates to a method and system for managing data. The invention is intended to provide a data managing method and data managing system capable of classifying created files and managing them without depending on the operator's ability. The method is for use in an analytical instrument having a function of imaging a specimen and a function of analyzing the specimen. The area of the specimen from which the image has been taken is analyzed totally or partially. The analytical instrument includes an analytical data managing unit for recording the resulting data hierarchically in a corresponding manner to the specimen area.

Abstract: A semiconductor element carrying apparatus for surely recovering semiconductor elements dropped in the environs of an electric driver. A lower base member is disposed under a carrying inlet, an inspecting part and a carrying outlet for semiconductor elements, such as semiconductor integrated circuit devices. On the lower base member, an electric driver cover covering an electric driver and a collector is disposed for collecting the semiconductor elements dropped. The semiconductor elements dropped on the electric driver cover are guided to the collector. The collector is equipped with a collector outlet, and a semiconductor collecting vessel is arranged under the collector outlet. Furthermore, an air blower blows compressed air along a slope from a nozzle to move dropped semiconductor devices.

Abstract: There is disclosed a long-lived thermal field emission electron gun for use in a scanning electron microscope. The gun has a tungsten tip. The surface of this tip is coated with zirconium, zirconium oxide, titanium or titanium oxide. A wire member is mounted above the front end of the tungsten tip to prevent the coating of zirconium or other material from slipping off.

Abstract: A semiconductor device test system includes a first warehouse, an insertion and extraction unit, a second warehouse, a test burn-in unit, and a scheduler. The scheduler sets a test schedule so that the test burn-in unit tests the semiconductor devices according to the type of semiconductor devices, based on product data transmitted from the first and second warehouses. The scheduler issues an instruction to transfer a desired burn-in board from the second warehouse to the insertion and extraction unit based on the insertion and extraction schedule. The scheduler issues an instruction to transfer the desired burn-in board from the insertion and extraction unit to the second warehouse based on the insertion and extraction schedule. A high throughput test system is thus provided that concurrently carries out the insertion and extraction of semiconductor devices with respect to burn-in boards.

Abstract: A semiconductor device test system for efficiently testing many types of devices and for reducing the amount of floor space needed. The test system has a test board having a plurality of sockets for receiving semiconductor devices. A semiconductor device insertion and extraction station removes the devices from a tray and inserts them into the sockets of the test board and extracts the devices from the sockets to mount them on the tray. A test chamber has a temperature setting section for setting the test board to a test environmental temperature and a test-performing section for supporting the test board so that electrode terminals of the sockets are exposed. A tester head is simultaneously connected to the electrode terminals of the sockets of the test board. A head moving section connects the tester head to the electrode terminals of the sockets of the test board. A tester is connected to the tester head to test electrical characteristics of the semiconductor devices.

Abstract: A burn-in apparatus includes a robot for supplying and removing burn-in boards. The robot includes a movable enclosure capable of temperature control. In a burn-in board removing method, a burn-in board which is to be removed from the chamber of a burn-in apparatus body is enclosed by the movable enclosure of the robot. The interior of the movable enclosure is then cooled to normal temperatures by means of a cooling mechanism. Subsequently, power supply to semiconductor IC's on the burn-in board is suspended, and the burn-in board is removed. In this way, disappearance of failures generated by the charging-up during the burn-in can be prevented, and a burn-in test can be accurately conducted.

Abstract: Different types of a plurality of connectors are provided on a plurality of stages of one slot. Burn-in boards are arranged in a carried in accordance with the positions of the connectors which are in conformity with the burn-in boards. Thus, a burn-in test can be conducted for burn-in boards with one burn-in device, even when the size of the burn-in board and the shape of the connector are different.